CPC Class H04N

A virtual-reality system includes a head-mounted display, a camera protruding from a surface of the head-mounted display, and a compressible shock mount mounting the camera to the head-mounted display. The shock mount is to retract the camera towards the head-mounted display when compressed. The shock mount protects the camera from damage when the head-mounted display is dropped.

An image sensor device includes a plurality of pixel cells arranged in a pixel array, a control circuit for controlling an exposure phase and a sampling phase of the image sensor device. Each of the plurality of pixel cells includes a photodiode, a storage diode, and a floating diffusion region. The control circuit is configured to activate the photodiode in a plurality of time windows to sense light reflected from a target as a result of a corresponding plurality of emitted light pulses, with a pre-determined delay time between each time window and a corresponding emitted light pulse. The photodiode can be activated using a plurality of bias voltage pulses or a plurality of global shutter signal pulses.

A pixel includes a photoconversion zone, an insulated vertical electrode and at least one charge storage zone. The photoconversion zone belongs to a first part of a semiconductor substrate and each charge storage zone belongs to a second part of the substrate physically separated from the first part of the substrate by the insulated vertical electrode.

The present disclosure relates to a solid-state image pickup device and an electronic apparatus that are capable of preventing leakage of charges between adjacent pixels.A plurality of pixels perform photoelectric conversion on light incident from a back surface via different on-chip lenses for each pixel. A pixel separation wall is formed between pixels adjacent to each other, and includes a front-side trench formed from a front surface and a backside trench formed from the back surface. A wiring layer is provided on the front surface. The present disclosure is applicable to, for example, a backside illuminated CMOS image sensor.