2 patents in CPC class H01L
A lighting apparatus including a controller and an LED luminaire to implement a color temperature from a minimum of 3,000K or less to a maximum of 5,000K or more, the LED luminaire including at least one first light emitter, at least one second light emitter, and at least one third light emitter, in which a triangle region defined by color coordinates of the light emitters includes at least a region on a Planckian locus, and the maximum and minimum color temperatures in the triangle region are 5,000K or more, and 3,000K or less, respectively, and in the CIE-1931 coordinate system, the color coordinates of the first light emitter is closer to 5,000K than those of the second and third light emitters, and the color coordinates of the third light emitter is closer to 3,000K than those of the first and second light emitters.
A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal, wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier.
A liquid cooling plate assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connection tube and a second connection tube. The first liquid cooling plate includes a first heat dissipation part and a second heat dissipation part connected to each other. The first heat dissipation part has a first fluid chamber. The second heat dissipation part has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and a fourth heat dissipation part connected to each other. The third heat dissipation part has a second fluid chamber. The fourth heat dissipation part has a second fluid channel in fluid communication with the second fluid chamber. The first connection tube communicates the second fluid chamber with the first fluid chamber. The second connection tube communicates the second fluid channel with the first fluid channel.
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.
The present disclosure relates to a CMP slurry composition for polishing polycrystalline silicon and a polishing method using the same. A CMP slurry composition for polishing polycrystalline silicon according to an embodiment of the present disclosure includes: abrasive particles; a surface roughness reducing agent; a polishing regulator containing an organic acid; and a pH regulator.