CPC Class H04N

An image sensor include a semiconductor substrate, a first epitaxial layer, a second epitaxial layer, a plurality of photodiodes, and a plurality of pixel isolation structures. The first epitaxial layer is formed on the semiconductor substrate, and the second epitaxial layer is formed on the first epitaxial layer. Each photodiode includes a first diffusion region formed in the first epitaxial layer and a second diffusion region formed in the second epitaxial layer. The second diffusion region is extended through the second epitaxial layer and electrically coupled to the first diffusion region. Each pixel isolation structure include a first isolation structure formed between adjacent first diffusion regions in the first epitaxial layer and a second isolation structure formed between adjacent second diffusion regions in the second epitaxial layer. The second isolation structure is extended through the second epitaxial layer to connect to the first isolation structure.

A 2D hologram system with a matrix addressing scheme is provided. The system may include a 2D array of sub-wavelength hologram elements integrated with a refractive index tunable core material on a wafer substrate. The system may also include a matrix addressing scheme coupled to the 2D array of sub-wavelength hologram elements and configured to independently control each of the sub-wavelength hologram elements by applying a voltage.

An image sensor includes a substrate, thin lenses disposed on a first surface of the substrate and configured to concentrate lights incident on the first surface, and light-sensing cells disposed on a second surface of the substrate, the second surface facing the first surface, and the light-sensing cells being configured to sense lights passing through the thin lenses, and generate electrical signals based on the sensed lights. A first thin lens and second thin lens of the thin lenses are configured to concentrate a first light and a second light, respectively, of the incident lights onto the light-sensing cells, the first light having a different wavelength than the second light.

To achieve a size reduction of a semiconductor package while securing stability in mounting.Three terminals t1, t2, and t4 are individually arranged on a semiconductor package 10 having a rectangular shape as viewed in plan in such a manner that the center in the longitudinal direction of the semiconductor package 10 of each of the three terminals t1, t2, and t4 and the center in the longitudinal direction of each of the other terminals are not overlapped with each other as viewed from the side of the long side. The terminal t4 and the other terminals t1 and t2 are arranged in such a manner that the terminal t4 and the other terminals t1 and t2 are present on mutually different sides across a line segment M passing through the center in the width direction, an angle θ formed by two line segments connecting the center of gravity of the terminal t4, the position in the longitudinal direction of which is the center, and the center of gravity of each of the other terminals t1 and t2 is 60° or more, and a width L1 of the semiconductor package 10 and a distance Lt between the rightmost end position of the terminal t4 arranged at the rightmost end in the width direction of the semiconductor package 10 and the leftmost end position of the terminal t1 or t2 arranged at the leftmost position in the width direction satisfy Lt/L1≤0.5.

A direct drive servo motor is provided and may include a quadrature encoder and a silicone rubber sleeve affixed to the encoder's shaft that is attached to the rotor hub and may also include an axle fixed to the rotor hub, inner and outer bearings, front and rear bearing plates, an outer stator, and an inner rotor rare earth magnet ring. A computer-controlled camera system is also provided and includes a direct drive camera gimbal; a pan-bar system; a robotic control system; a master interconnect unit; custom control software; and a track and gantry system. A universal camera tripod head adapter is also provided and includes front and rear clamps, a clamp handle, side and rear brackets and a silicone rubber sleeve affixed to the shaft of each encoder that rides on the pan and tilt axis lips of a camera tripod head.

A method of transmitting a broadcast signal includes encoding mobile data for FEC (Forward Error Correction); encoding signaling information for signaling the mobile data; allocating the encoded mobile data and signaling data into a transmission frame; and transmitting the broadcast signal including the transmission frame, wherein the transmission frame includes a service signaling table having service_type information identifying a type of a service of the mobile data and hidden information indicating whether the service of the mobile data is hidden or not.