CPC Class H04N

A solid-state imaging device capable of achieving higher image quality is provided.Provided is a solid-state imaging device including a semiconductor substrate, a first photoelectric conversion unit that is provided above the semiconductor substrate and that converts light into charge, and a second photoelectric conversion unit that is provided above the first photoelectric conversion unit and that converts light into charge. Each of the first photoelectric conversion unit and the second photoelectric conversion unit includes at least a first electrode, a second electrode, and a photoelectric conversion film disposed between the first electrode and the second electrode. The first electrode of the second photoelectric conversion unit and a charge accumulation unit formed in the semiconductor substrate are electrically connected to each other via a conductive portion penetrating at least the first photoelectric conversion unit. An insulation film portion is disposed at least on a part of an outer circumference of the conductive portion. The insulation film portion includes at least one layer of an insulation film. The at least one layer of the insulation film has fixed charge of a type identical to a type of charge accumulated in the charge accumulation unit.

An image sensor that includes a sensor substrate provided with a sensor surface on which a photodiode is arranged in a planar manner, a sealing resin applied to a side of the sensor surface of the sensor substrate, sealing glass bonded to the sensor substrate via the sealing resin, and a reinforcing resin made of a resin material having higher rigidity than the sealing resin and formed on an outer periphery of the sealing resin to bond the sensor substrate and the sealing glass. The sealing resin is formed to have a smaller area than each of the sensor substrate and the sealing glass, so that the reinforcing resin is formed to fill a gap provided on the outer periphery of the sealing resin, the sensor substrate and the sealing glass facing each other through the gap.

An apparatus or method to allow a user to control an audio processing operation of an internal and/or external microphone(s). The method includes providing a configurable user interface which enables mixing of audio signals through interaction with the user interface. The audio signals may be captured with internal or external microphones.

A semiconductor device includes a digital-analog converter provided with a plurality of current cells, and a test circuit electrically connected to the digital-analog converter to test the digital-analog converter. The test circuit includes: a charge information holding circuit that holds, as differential charge information, a difference value between a first charge according to a first current and a second charge according to a second current by at least one or more current cells among the plurality of current cells; a reference voltage generation circuit that generates a reference voltage to be comparative object; and a comparison circuit that compares a determination voltage according to the differential charge information and the reference voltage to output a comparison result.

Methods and devices for dynamically designated first and second subsets of a plurality of frequency channels as upstream and downstream channels, respectively, for performing wired communications using virtual segmentation between a network controller and an endpoint device, performing virtual segmentation to service an endpoint device. Communications are performed between the network controller and the endpoint device through a wired communication medium using the upstream and downstream channels. The first subset and second subsets of the plurality of channels are designated as upstream channels and downstream channels, respectively, based at least in part on one or both of upstream and downstream channel demand and channel availability.