CPC Class H04N

Example comparators as discussed herein may include a second stage coupled to provide an output in response to an intermediate voltage, a first stage coupled to provide the intermediate voltage in response to an input. The first stage including a pair of cascode devices coupled to a current mirror, a low gain input coupled to inputs of the first stage via first switches, and further selectively coupled to the pair of cascode devices via second switches, and a high gain input coupled to the first and second inputs of the first stage via the first switches, and further selectively coupled to the pair of cascode devices via fourth switches. Based on a low conversion gain mode, the low gain input may be coupled to the inputs by the first switches, and further coupled to the pair of cascode devices by the second switches in response to a control signal being in a first state, and based on a high conversion gain mode, the high gain input may be coupled to the first and second inputs by the first switches, and further coupled to the pair of cascode device by the fourth switch in response to the control signal being in a second state.

A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.

Methods, systems, apparatus, including computer-readable media storing executable instructions, for color filter arrays for image sensors. In some implementations, an imaging device includes a color filter array arranged to filter incident light. The color filter array has a repeating pattern of color filter elements. The color filter elements include yellow filter elements, green filter elements, and blue filter elements. The imaging device includes an image sensor having photosensitive regions corresponding to the color filter elements. The photosensitive regions are configured to respectively generate electrical signals indicative of intensity of the color-filtered light at the photosensitive regions. The imaging device includes one or more processors configured to generate color image data based on the electrical signals from the photosensitive regions.

The present disclosure relates to a solid-state image pickup device and an electronic apparatus that are capable of preventing leakage of charges between adjacent pixels. A plurality of pixels perform photoelectric conversion on light incident from a back surface via different on-chip lenses for each pixel. A pixel separation wall is formed between pixels adjacent to each other, and includes a front-side trench formed from a front surface and a backside trench formed from the back surface. A wiring layer is provided on the front surface. The present disclosure is applicable to, for example, a backside illuminated CMOS image sensor.

Disclosed herein is a semiconductor device, including: a first substrate including a first electrode, and a first insulating film configured from a diffusion preventing material for the first electrode and covering a periphery of the first electrode, the first electrode and the first insulating film cooperating with each other to configure a bonding face; and a second substrate bonded to and provided on the first substrate and including a second electrode joined to the first electrode, and a second insulating film configured from a diffusion preventing material for the second electrode and covering a periphery of the second electrode, the second electrode and the second insulating film cooperating with each other to configure a bonding face to the first substrate.