Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An integrated device comprising: a backplane including a plurality of pixel circuits each conductively coupled to respective light-emitting elements through respective intermediate conductive layers to form an array of active-matrix light-emitting pixels, wherein each of the light-emitting elements comprises one or more quantum well semiconductor layers between a first contact electrode and a second contact electrode, the first contact electrodes of the light-emitting elements being respectively bonded and conductively coupled to the pixel circuits in the backplane via the respective intermediate conductive layers; and a transparent conductive layer on the light-emitting elements, wherein the transparent conductive layer is in contact with the second contact electrodes of the light-emitting elements to form a common electrode of the light-emitting elements, a top surface of each of the second contact electrodes being fully in contact with the transparent conductive layer.
This invention relates to an integrated active-matrix light-emitting device, specifically addressing challenges in integrating quantum well-based light-emitting elements with pixel circuits in a backplane. The device includes a backplane with multiple pixel circuits, each connected to a light-emitting element through an intermediate conductive layer, forming an array of active-matrix pixels. Each light-emitting element features one or more quantum well semiconductor layers sandwiched between a first and second contact electrode. The first contact electrodes of the light-emitting elements are bonded and conductively coupled to the pixel circuits via the intermediate conductive layers. A transparent conductive layer is deposited over the light-emitting elements, serving as a common electrode by fully contacting the top surfaces of the second contact electrodes. This design ensures efficient electrical coupling between the light-emitting elements and the backplane while maintaining uniform current distribution across the array. The transparent conductive layer's full contact with the second electrodes enhances electrical performance and simplifies manufacturing. The invention improves integration of quantum well-based light emitters in active-matrix displays, addressing issues related to conductivity, uniformity, and fabrication complexity.
2. The integrated device of claim 1 , further comprising: isolation spacers between adjacent light emitting elements.
The invention relates to integrated light-emitting devices, specifically addressing the challenge of cross-talk and interference between adjacent light-emitting elements in high-density arrays. The device includes multiple light-emitting elements arranged in a matrix or array configuration, where each element emits light in response to an applied electrical signal. To prevent unwanted interactions between neighboring elements, the device incorporates isolation spacers positioned between adjacent light-emitting elements. These spacers physically and electrically separate the elements, reducing optical and electrical crosstalk, which can degrade performance in applications such as displays, sensors, or optical communication systems. The spacers may be made from insulating materials and can be structured to optimize spacing while maintaining device compactness. The overall design ensures independent operation of each light-emitting element, improving reliability and precision in light emission control. This solution is particularly useful in integrated photonics and micro-LED technologies, where minimizing interference is critical for achieving high-resolution and high-efficiency performance.
3. The integrated device of claim 2 , wherein the isolation spacers comprises an opaque dielectric material.
The invention relates to integrated devices, particularly those involving isolation spacers. The problem addressed is the need for improved isolation spacers in integrated circuits to enhance performance and reliability. The invention provides an integrated device with isolation spacers that include an opaque dielectric material. These spacers are positioned adjacent to conductive structures, such as gates or interconnects, to prevent unwanted electrical interference or optical interference in photonic applications. The opaque dielectric material ensures that light or stray electrical signals are blocked, improving signal integrity and device functionality. The spacers are designed to be compatible with existing semiconductor fabrication processes, allowing for seamless integration into standard manufacturing workflows. The use of an opaque dielectric material in the spacers provides a robust solution for isolating sensitive components, reducing crosstalk, and enhancing overall device performance. This approach is particularly useful in advanced semiconductor devices where isolation and signal integrity are critical. The invention ensures that the spacers do not degrade over time, maintaining their effectiveness in various operating conditions.
4. The integrated device of claim 2 , wherein side surfaces of each of the second contact electrodes are fully in contact with the isolation spacers.
The invention relates to integrated semiconductor devices, specifically addressing challenges in electrical isolation and contact integrity within advanced semiconductor structures. The device includes multiple contact electrodes arranged in a stacked configuration, where precise alignment and isolation between adjacent electrodes are critical to prevent electrical interference and ensure reliable operation. The problem being solved involves ensuring full and consistent contact between the side surfaces of the second set of contact electrodes and the surrounding isolation spacers, which are typically insulating materials like silicon dioxide or silicon nitride. This full contact is essential to prevent leakage currents, short circuits, or other performance degradation in densely packed semiconductor devices. The isolation spacers are positioned between the contact electrodes to electrically isolate them from adjacent conductive structures, and the full contact between the side surfaces of the second contact electrodes and these spacers ensures robust isolation. The second contact electrodes are part of a stacked arrangement where the first set of contact electrodes is positioned below the second set, and the isolation spacers are formed around the side surfaces of both sets to maintain electrical separation. The invention improves the reliability and performance of semiconductor devices by ensuring complete and uniform contact between the contact electrodes and the isolation spacers, reducing the risk of electrical shorts or leakage. This is particularly important in high-density semiconductor designs where minimizing parasitic effects is critical.
5. The integrated device of claim 1 , wherein each of the light-emitting elements has a size same as a respective intermediate conductive layer and is self-aligned with the respective intermediate conductive layer.
The invention relates to an integrated light-emitting device with improved alignment and manufacturing efficiency. The device addresses challenges in conventional light-emitting structures where misalignment between light-emitting elements and conductive layers can degrade performance and yield. The solution involves a self-aligned configuration where each light-emitting element is precisely matched in size and position to its corresponding intermediate conductive layer. This alignment ensures optimal electrical and optical coupling, reducing defects and improving device reliability. The light-emitting elements are formed directly on the conductive layers, eliminating the need for additional alignment steps during fabrication. This self-aligned approach simplifies manufacturing, enhances uniformity, and improves scalability for high-density applications. The device is particularly useful in displays, sensors, and solid-state lighting where precise control of light emission is critical. The invention overcomes limitations of traditional methods that rely on separate alignment processes, which are time-consuming and prone to errors. By integrating the light-emitting elements and conductive layers in a self-aligned manner, the device achieves higher performance and lower production costs.
6. The integrated device of claim 1 , wherein each of the pixel circuits comprises a non-volatile memory including at least one transistor conductively coupled to a corresponding drive electrode in a top layer of the backplane.
This invention relates to an integrated display device with pixel circuits incorporating non-volatile memory. The device addresses the challenge of maintaining display data without continuous power, which is critical for low-power or intermittent power applications. Each pixel circuit includes a non-volatile memory element that retains data even when power is off. The memory comprises at least one transistor conductively coupled to a drive electrode in the top layer of the backplane. This configuration allows the pixel circuit to store and retrieve display data efficiently, enabling the display to maintain its state without active power consumption. The non-volatile memory ensures that the display can quickly restore its previous state when power is restored, reducing the need for frequent refresh cycles and conserving energy. The integration of non-volatile memory within the pixel circuits enhances the device's suitability for applications requiring persistent display states, such as electronic shelf labels, digital signage, or wearable displays. The conductive coupling between the memory transistor and the drive electrode ensures reliable data transfer and control, optimizing the overall performance of the display system.
7. The integrated device of claim 6 , wherein each of the light-emitting elements is conductively coupled to a respective pixel circuit by the first contact electrode of the light-emitting element bonded to the corresponding drive electrode of the respective pixel circuit through the respective intermediate conductive layer.
This invention relates to integrated light-emitting devices, specifically addressing challenges in electrically connecting light-emitting elements to pixel circuits in display or lighting applications. The device includes an array of light-emitting elements, such as microLEDs or OLEDs, each bonded to a corresponding pixel circuit in a substrate. Each light-emitting element has a first contact electrode that is conductively coupled to a drive electrode of its respective pixel circuit through an intermediate conductive layer. This intermediate layer ensures reliable electrical connection while accommodating potential misalignments or surface irregularities between the light-emitting element and the pixel circuit. The pixel circuits may include transistors or other active components to control the light emission of each element. The intermediate conductive layer may be formed from conductive materials like metal or conductive polymers, and its thickness and composition can be optimized for conductivity and mechanical stability. The invention improves manufacturing yield and performance by ensuring robust electrical connections in integrated light-emitting devices.
8. The integrated device of claim 7 , wherein the light-emitting element is aligned with the corresponding bonded drive electrode in the top layer of the backplane, and a size of the light-emitting element is no smaller than a size of the corresponding bonded drive electrode.
This invention relates to an integrated device for display or lighting applications, addressing the challenge of aligning light-emitting elements with drive electrodes in a backplane to ensure efficient light emission and reliable operation. The device includes a backplane with a top layer containing drive electrodes, and a layer of light-emitting elements bonded to the backplane. Each light-emitting element is aligned with a corresponding drive electrode in the top layer, ensuring precise electrical and optical coupling. The size of each light-emitting element is at least as large as the size of its corresponding drive electrode, preventing misalignment and ensuring full coverage of the electrode area. This alignment and sizing relationship optimizes light emission efficiency and reduces defects caused by misalignment. The backplane may include additional layers, such as a substrate, a thin-film transistor (TFT) layer, and an interlayer dielectric, to support the drive electrodes and electrical connections. The light-emitting elements may be organic light-emitting diodes (OLEDs) or other emissive materials. The invention improves the performance and reliability of display and lighting devices by ensuring proper alignment and sizing between light-emitting elements and drive electrodes.
9. The integrated device of claim 6 , wherein the backplane comprises scanning drivers and data drivers, and each of the non-volatile memories is coupled to one of the scanning drivers through at least one word line and to one of the data drivers through at least one bit line.
This invention relates to an integrated device incorporating non-volatile memory arrays with improved driver integration. The device addresses the challenge of efficiently managing data storage and retrieval in memory systems by integrating scanning and data drivers directly into the backplane of the memory array. The backplane includes scanning drivers that control word lines and data drivers that manage bit lines, each connected to individual non-volatile memory cells. This architecture streamlines signal routing, reduces latency, and enhances overall system performance by minimizing the distance between drivers and memory cells. The scanning drivers selectively activate word lines to access specific memory rows, while the data drivers handle data transfer through bit lines, enabling precise read and write operations. The direct coupling of drivers to memory cells via dedicated lines ensures reliable and high-speed data processing, making the device suitable for applications requiring compact, high-performance memory solutions. The integration of these components within the backplane simplifies the system design and improves energy efficiency by reducing signal propagation delays and power consumption. This approach is particularly beneficial in embedded systems, solid-state drives, and other memory-intensive applications where space and performance are critical.
10. The integrated device of claim 1 , wherein each of the light-emitting elements is operable to emit light with a primary color, wherein the integrated device further comprises: for each of the active-matrix light emitting pixels, at least a phosphor film or a quantum dot film on the conductive layer above at least one light-emitting element in the pixel and operable to emit a secondary light when excited by the light with the primary color, wherein the secondary light has a second color different from the primary color.
This invention relates to an integrated light-emitting device designed to enhance color performance in display technologies. The device addresses the challenge of achieving high color purity and efficiency in displays by incorporating a combination of primary and secondary light emission mechanisms. The device includes an array of active-matrix light-emitting pixels, each containing at least one light-emitting element capable of emitting light with a primary color. To improve color output, the device further includes a phosphor film or quantum dot film positioned above the light-emitting elements. When excited by the primary light, these films emit secondary light of a different color, effectively expanding the color gamut of the display. The phosphor or quantum dot films are integrated into the conductive layer structure of each pixel, ensuring precise control over light emission and color conversion. This design allows for the generation of vibrant, high-fidelity colors while maintaining the efficiency and compactness of the display. The use of quantum dots or phosphors enables fine-tuning of the emitted light spectrum, addressing limitations in traditional display technologies where color purity and brightness are often compromised. The invention is particularly useful in applications requiring high-performance displays, such as televisions, smartphones, and digital signage.
11. The integrated device of claim 10 , wherein a number of the LEDs is larger than a number of the LEDs deposited with the phosphor films or quantum dots films, and wherein the number of the LEDs is equal to at least two times of a number of the pixels.
This invention relates to an integrated light-emitting diode (LED) device designed for high-resolution display applications. The device addresses the challenge of achieving precise color control and brightness uniformity in displays by incorporating a specific arrangement of LEDs and phosphor or quantum dot films. The device includes multiple LEDs, where the total number of LEDs exceeds the number of LEDs that are coated with phosphor or quantum dot films. Additionally, the total number of LEDs is at least twice the number of pixels in the display. This configuration allows for enhanced color mixing and improved light output, as the excess LEDs can be selectively activated to fine-tune color balance and brightness. The phosphor or quantum dot films are applied to a subset of the LEDs to convert the emitted light into desired wavelengths, while the remaining LEDs operate at their native wavelengths. This design enables dynamic adjustment of color and intensity, resulting in a display with superior visual performance and energy efficiency. The device is particularly useful in high-resolution displays where precise color reproduction and uniform illumination are critical.
12. The integrated device of claim 10 , wherein the one or more quantum well layers include Group III-V compounds and each of the light-emitting elements is operable as a light-emitting diode (LED) to emit light with a blue color, and wherein, for each of the active-matrix light emitting pixels, at least two blue color LEDs are configured to optically excite at least two other colors by secondary light emission of the phosphor films or quantum dots films on the at least two blue color LEDs.
This invention relates to an integrated light-emitting device designed for high-efficiency color display applications. The device addresses the challenge of achieving full-color emission with improved energy efficiency and brightness by leveraging quantum well structures and secondary light emission techniques. The device includes an array of active-matrix light-emitting pixels, each containing multiple light-emitting elements. These elements are formed using quantum well layers composed of Group III-V semiconductor compounds, which enable efficient blue light emission when operated as light-emitting diodes (LEDs). The blue LEDs serve as primary light sources, and their emitted light is converted into other colors through secondary emission processes. Each pixel incorporates at least two blue LEDs, each paired with a phosphor film or quantum dot film. These films absorb the blue light and re-emit it at different wavelengths, producing additional colors such as green, red, or other desired hues. This approach allows the device to generate a wide color gamut while maintaining high efficiency, as the blue LEDs provide the primary excitation source for the secondary emitters. The integration of multiple blue LEDs per pixel enhances brightness and color uniformity, while the use of quantum well structures ensures high-performance light emission. This design is particularly suited for displays requiring vibrant colors and energy-efficient operation.
13. The integrated device of claim 12 , wherein each of the active-matrix light emitting pixels is configured to be a multi-color display pixel including one blue color LED operable to provide a blue color and the at least two blue color LEDs with the phosphor films or quantum dots films operable to respectively provide a red color and a green color.
This invention relates to an integrated display device featuring active-matrix light-emitting pixels designed for multi-color display capabilities. The device addresses the challenge of achieving high color fidelity and efficiency in display technologies by incorporating a novel pixel architecture. Each pixel in the display includes a blue light-emitting diode (LED) that directly emits blue light. Additionally, the pixel contains at least two blue LEDs, each paired with either a phosphor film or a quantum dot film. These films convert the blue light into red and green colors, respectively. This configuration enables the pixel to produce three primary colors—blue, red, and green—using a combination of direct emission and wavelength conversion. The use of phosphor or quantum dot films enhances color purity and brightness while maintaining energy efficiency. The integrated design allows for precise control over color output, making it suitable for high-resolution and high-color-accuracy display applications. The invention improves upon traditional display technologies by consolidating multiple color generation mechanisms into a single pixel structure, reducing complexity and improving performance.
14. The integrated device of claim 13 , wherein an area ratio between the three blue color LEDs in the multi-color display pixel is based on light conversion efficiencies of the red color phosphor film or quantum dots film and the green color phosphor film or quantum dots film when excited by the at least two blue color LEDs.
This invention relates to an integrated display device with a multi-color display pixel structure optimized for color balance. The device addresses the challenge of achieving uniform color output in displays using blue LEDs combined with red and green phosphors or quantum dots, which often suffer from efficiency mismatches between the color conversion materials. The invention improves upon prior art by adjusting the area ratio of the blue LEDs within each pixel based on the light conversion efficiencies of the red and green phosphors or quantum dots when excited by the blue LEDs. This ensures that the red, green, and blue color channels produce balanced light output, enhancing color accuracy and display performance. The device includes a substrate with multiple blue LEDs, a red color conversion layer, and a green color conversion layer, where the blue LEDs are arranged in a specific ratio to compensate for differences in the conversion efficiencies of the red and green materials. This approach optimizes the display's color reproduction without requiring additional control circuitry or complex calibration processes. The invention is particularly useful in high-efficiency displays, such as microLED or quantum dot displays, where precise color balance is critical.
15. The integrated device of claim 10 , wherein the one or more quantum well layers include Group III-V compounds and each of the light-emitting elements is operable as a light-emitting diode (LED) to emit ultraviolet (UV) or deep UV light, and wherein, for each of the active-matrix light emitting pixels, at least three LEDs are configured to optically excite at least three colors by secondary light emission of the phosphor films or quantum dots films on the at least three LEDs.
This invention relates to an integrated light-emitting device designed for high-efficiency illumination, particularly in the ultraviolet (UV) or deep UV spectrum. The device addresses challenges in generating broad-spectrum light by combining quantum well-based light-emitting diodes (LEDs) with secondary light emission materials. The quantum well layers are composed of Group III-V compounds, enabling efficient UV or deep UV emission. Each active-matrix light-emitting pixel includes at least three LEDs, each paired with phosphor or quantum dot films. These films convert the primary UV or deep UV light into at least three distinct colors through secondary emission, allowing for full-color light generation. The integration of multiple LEDs with wavelength-converting films in a single pixel enables precise control over color output, improving energy efficiency and spectral purity. This approach overcomes limitations in traditional LED-based lighting systems, particularly in applications requiring compact, high-brightness, and tunable light sources. The device is suitable for displays, lighting, and other optical applications where UV excitation and color mixing are critical.
16. The integrated device of claim 15 , wherein each of the active-matrix light emitting pixels is configured to be a multi-color display pixel including the at least three LEDs with the phosphor films or quantum dots films operable to respectively provide at least a red color, a blue color, and a green color.
This invention relates to an integrated display device with active-matrix light-emitting pixels designed for multi-color display applications. The device addresses the challenge of achieving high color fidelity and brightness in displays by incorporating advanced light-emitting diodes (LEDs) with phosphor or quantum dot films to enhance color performance. The integrated device includes an array of active-matrix light-emitting pixels, each configured as a multi-color display pixel. Each pixel comprises at least three LEDs, each paired with a phosphor film or quantum dot film to produce distinct primary colors—red, blue, and green. The phosphor or quantum dot films convert the emitted light from the LEDs into the desired color wavelengths, ensuring accurate color reproduction. This design allows for precise control over color output, improving display quality and energy efficiency. The active-matrix architecture enables independent addressing and modulation of each pixel, allowing for dynamic and high-resolution imaging. The use of phosphor or quantum dot films enhances color purity and brightness, addressing limitations in traditional LED-based displays. This configuration is particularly useful in applications requiring vibrant, high-fidelity color reproduction, such as high-definition displays, augmented reality devices, and advanced imaging systems. The integration of these components into a single device simplifies manufacturing while improving performance.
17. The integrated device of claim 16 , wherein an area ratio between the three LEDs in the multi-color display pixel is based on light conversion efficiencies of the red color phosphor film or quantum dots film, the blue color phosphor film or quantum dot film and the green color phosphor film or quantum dots film when excited by the three LEDs.
This invention relates to an integrated display device with a multi-color display pixel comprising three light-emitting diodes (LEDs) and corresponding phosphor or quantum dot films for color conversion. The device addresses the challenge of achieving uniform brightness and color balance in displays by optimizing the area ratio of the three LEDs based on the light conversion efficiencies of the red, blue, and green phosphor or quantum dot films when excited by the LEDs. The red, blue, and green phosphor or quantum dot films are deposited on the LEDs to convert the emitted light into the desired colors. The area ratio of the LEDs is adjusted to compensate for differences in conversion efficiency, ensuring that each color contributes equally to the overall brightness and color accuracy of the display. This design improves color uniformity and brightness consistency across the display, enhancing visual performance. The invention is particularly useful in high-resolution displays where precise color control is critical.
18. The integrated device of claim 10 , wherein the conductive layer comprises a transparent indium tin oxide (ITO) layer, and the transparent ITO layer is between the light-emitting elements and the at least one phosphor film or one quantum dot film.
This invention relates to an integrated lighting device designed to improve light conversion efficiency and color rendering. The device addresses the challenge of efficiently converting light from light-emitting elements, such as LEDs, into desired spectral outputs using phosphor or quantum dot films while minimizing optical losses. The key innovation involves a conductive layer made of transparent indium tin oxide (ITO) positioned between the light-emitting elements and the phosphor or quantum dot film. The ITO layer serves as an electrical conductor, enabling current distribution to the light-emitting elements while maintaining transparency to allow light to pass through to the conversion films. This configuration ensures efficient excitation of the phosphor or quantum dot material, enhancing light output and color quality. The device may also include additional layers, such as reflective or diffusive elements, to further optimize light extraction and uniformity. The transparent ITO layer's placement ensures minimal interference with the optical path, improving overall system efficiency. This design is particularly useful in applications requiring high-performance lighting with precise color control, such as displays, automotive lighting, and general illumination.
19. The integrated device of claim 1 , wherein each of the active-matrix light-emitting pixels is configured to be a multi-color display pixel including first and second pixel elements having respective first and second light conversion efficiencies to emit a first color and a second color when excited by the light-emitting elements, and wherein the backplane is configured to drive the first and second pixel elements with respective first and second currents, and a current ratio between the first and second currents is based on a ratio between the first and second light conversion efficiencies.
This invention relates to an integrated display device with active-matrix light-emitting pixels designed for multi-color display applications. The device addresses the challenge of achieving consistent color output in displays where different pixel elements have varying light conversion efficiencies. Each pixel in the display includes multiple light-emitting elements, such as microLEDs or OLEDs, configured to emit different colors when excited. The device incorporates a backplane that independently drives each pixel element with specific currents. The backplane adjusts the current supplied to each element based on their respective light conversion efficiencies, ensuring balanced color output. For example, if one pixel element has a lower efficiency than another, the backplane compensates by increasing the current to that element, maintaining color uniformity across the display. This approach improves display performance by dynamically adjusting drive currents to match the optical characteristics of each pixel element, resulting in more accurate and consistent color reproduction. The invention is particularly useful in high-resolution displays where precise color control is critical.
20. The integrated device of claim 1 , further comprising: a touch-sensitive transparent protective layer on the array of active-matrix light-emitting pixels and configured to form, together with the common electrode, a capacitive touch screen position sensor; and a polarizer film positioned between the touch-sensitive transparent protective layer and the array of active-matrix light-emitting pixels.
This invention relates to an integrated display and touch sensor device, addressing the challenge of combining high-resolution light emission with accurate touch input in a compact form factor. The device includes an array of active-matrix light-emitting pixels, such as OLEDs, which emit light in response to electrical signals. A common electrode is positioned over the pixel array to provide a uniform electrical reference for the light-emitting elements. The invention further incorporates a touch-sensitive transparent protective layer placed over the pixel array, forming a capacitive touch screen position sensor when combined with the common electrode. This allows the device to detect touch input by measuring changes in capacitance. Additionally, a polarizer film is integrated between the touch-sensitive layer and the pixel array to enhance display contrast and reduce ambient light reflections. The polarizer ensures optimal light transmission while maintaining touch sensitivity. The design eliminates the need for a separate touch sensor layer, reducing thickness and improving optical performance. The combination of active-matrix light emission, capacitive touch sensing, and polarization control in a single integrated structure provides a compact, high-performance display solution for applications such as smartphones, tablets, and wearable devices.
21. The integrated device of claim 1 , wherein each of the respective intermediate conductive layers forms a highly-reflective mirror for a corresponding light-emitting element bonded with the respective intermediate conductive layer.
This invention relates to an integrated device for optical applications, specifically addressing the challenge of efficiently reflecting light within a multi-layered structure. The device includes a plurality of light-emitting elements, each bonded to a respective intermediate conductive layer. Each intermediate conductive layer is designed to function as a highly-reflective mirror for the corresponding light-emitting element. This reflective property ensures that light generated by the light-emitting elements is effectively directed or controlled within the device, improving optical performance. The intermediate conductive layers are positioned between the light-emitting elements and a substrate, facilitating electrical and thermal management while maintaining high reflectivity. The reflective mirrors are optimized to minimize light loss and enhance the overall efficiency of the integrated device. This design is particularly useful in applications requiring precise light control, such as displays, sensors, or optical communication systems. The invention combines electrical conductivity, thermal dissipation, and optical reflectivity in a single layer, simplifying the device structure while improving functionality.
22. The integrated device of claim 21 , wherein the mirror has a reflectivity higher than 80%.
The invention relates to an integrated optical device designed to enhance light reflection in optical systems. The device includes a mirror with a reflectivity exceeding 80%, ensuring efficient light redirection with minimal loss. This high reflectivity is critical for applications requiring precise light control, such as in optical communication systems, sensors, or imaging devices, where signal integrity and energy efficiency are paramount. The mirror is integrated into a larger optical assembly, which may include components like waveguides, lenses, or detectors, to form a compact and functional unit. The high-reflectivity mirror minimizes optical losses, improving overall system performance by maintaining strong signal strength and reducing the need for additional amplification or correction mechanisms. This design is particularly useful in environments where space and power efficiency are constraints, such as in portable or embedded optical systems. The invention addresses the challenge of achieving high reflectivity in integrated optical devices while maintaining compatibility with other optical components, ensuring reliable and efficient light management.
23. The integrated device of claim 1 , wherein the first contact electrode comprises a metal film with a high reflectivity and is configured to enhance a brightness of light emitted from the light-emitting element.
This invention relates to an integrated device incorporating a light-emitting element, such as an organic light-emitting diode (OLED), with an enhanced brightness feature. The device addresses the challenge of improving light output efficiency in light-emitting structures, particularly where optical losses at the electrode interfaces reduce brightness. The integrated device includes a light-emitting element positioned between a first contact electrode and a second contact electrode. The first contact electrode is designed with a metal film that has high reflectivity, which serves to redirect light that would otherwise be lost through internal reflections or absorption. By enhancing the reflectivity of this electrode, more light is directed outward from the device, increasing the overall brightness of the emitted light. The second contact electrode may be transparent or semi-transparent to allow light to pass through, further optimizing light extraction. The metal film in the first contact electrode is selected for its high reflectivity properties, ensuring that a significant portion of the light generated by the light-emitting element is reflected outward rather than absorbed or scattered. This configuration improves the efficiency of the device, making it suitable for applications requiring high brightness, such as displays, lighting systems, or optical sensors. The device may also include additional layers or structures to further enhance light extraction or electrical performance.
24. The integrated device of claim 1 , wherein each of the active-matrix light-emitting pixels is operable to output a light flux in one direction that is larger than 80% of light flux in two directions output from each of the at least one light-emitting element in the pixel.
This invention relates to an integrated display device with enhanced light output efficiency. The device addresses the problem of light loss in conventional displays, where light-emitting elements emit light in multiple directions, reducing overall brightness and energy efficiency. The invention improves upon this by incorporating active-matrix light-emitting pixels that direct a majority of their light output in a single preferred direction. Each pixel contains at least one light-emitting element, such as an OLED or microLED, but the pixel structure ensures that more than 80% of the emitted light flux is concentrated in one direction, rather than being split between two or more directions. This directional control minimizes light loss and improves display brightness and power efficiency. The device may also include additional components, such as a substrate, a control circuit, and a light extraction layer, to further optimize light output and performance. The invention is particularly useful in applications requiring high brightness and energy efficiency, such as outdoor displays, augmented reality devices, and high-end televisions.
25. The integrated device of claim 1 , wherein a ratio between an area of light emission from the pixels and a physical area of the pixels is higher than 50%.
The invention relates to an integrated display device designed to improve light emission efficiency by optimizing the ratio between the light-emitting area and the physical area of pixels. The device addresses the problem of low light emission efficiency in conventional displays, where a significant portion of the pixel area is occupied by non-emissive components such as transistors, wiring, or black matrix structures, reducing brightness and increasing power consumption. The integrated device includes an array of pixels, each capable of emitting light. The key innovation lies in the structural design, where the light-emitting area of each pixel is maximized relative to its physical area. Specifically, the ratio of the light-emitting area to the physical area of the pixels exceeds 50%, meaning more than half of each pixel's surface contributes to light output. This is achieved through advancements in pixel architecture, such as reducing the footprint of non-emissive components or using high-efficiency light-emitting materials. The device may incorporate additional features to enhance performance, such as improved heat dissipation, optimized electrical connections, or advanced encapsulation to protect the light-emitting elements. The high light emission ratio improves display brightness, reduces power consumption, and enables thinner, more efficient display designs. This technology is particularly useful in applications requiring high brightness and energy efficiency, such as smartphones, tablets, and wearable devices.
26. The integrated device of claim 1 , wherein the backplane comprises a complementary metal-oxide-semiconductor (CMOS) backplane.
This invention relates to an integrated device with a backplane structure, specifically addressing the need for improved performance, efficiency, or functionality in electronic systems. The device includes a backplane, which serves as a foundational layer for mounting and interconnecting electronic components. The backplane is constructed using complementary metal-oxide-semiconductor (CMOS) technology, a semiconductor manufacturing process widely used for integrated circuits. CMOS backplanes offer advantages such as low power consumption, high integration density, and compatibility with advanced semiconductor fabrication techniques. The use of CMOS technology in the backplane enables enhanced signal processing, improved thermal management, and greater scalability compared to traditional backplane materials. The device may also incorporate additional features such as embedded sensors, processing units, or communication interfaces, depending on the specific application. The CMOS backplane provides a robust platform for integrating these components while maintaining high performance and reliability. This design is particularly useful in applications requiring compact, energy-efficient, and high-speed electronic systems, such as consumer electronics, automotive systems, or industrial automation.
27. The integrated device of claim 26 , wherein the backplane is on a first side of a semiconductor substrate, and wherein the device further comprises: a conductive grid array package on a second, opposite side of the semiconductor substrate, the conductive grid array package being conductively coupled to the backplane.
This invention relates to integrated semiconductor devices with improved electrical connectivity and packaging. The device addresses the challenge of efficiently routing signals and power between different components in a semiconductor substrate while maintaining structural integrity and minimizing signal interference. The device includes a semiconductor substrate with a backplane on one side. The backplane provides a conductive layer for distributing power, ground, or signals across the substrate. On the opposite side of the substrate, a conductive grid array package is attached. This package includes an array of conductive elements, such as pins or pads, that interface with external circuits or other components. The conductive grid array package is electrically connected to the backplane through the substrate, enabling bidirectional signal and power transmission between the two sides. The conductive grid array package may include multiple conductive elements arranged in a grid pattern, ensuring high-density connectivity. The electrical coupling between the package and the backplane can be achieved through conductive vias, through-silicon vias (TSVs), or other interconnect structures embedded within the substrate. This configuration allows for efficient signal routing and power distribution while maintaining a compact form factor. The design is particularly useful in high-performance computing, memory modules, and other applications requiring robust electrical connections and thermal management.
28. The integrated device of claim 26 , wherein each of the pixels includes at least one of: a size less than 5.0 μm, a respond time faster than 0.1 μs, or an emitting light flux higher than 20 cd/mm{circumflex over ( )}2.
This invention relates to an integrated device for high-performance display or imaging applications, addressing the need for improved pixel characteristics such as size, response time, and light output. The device features an array of pixels, each incorporating at least one of the following enhancements: a pixel size smaller than 5.0 micrometers, a response time faster than 0.1 microseconds, or an emitting light flux exceeding 20 cd/mm². These features enable higher resolution, faster refresh rates, and brighter displays or sensors. The pixels may be part of a larger system, such as a display panel or an imaging sensor, where compact, high-speed, and high-brightness elements are critical. The technology is particularly useful in applications requiring rapid image updates, such as augmented reality, high-definition displays, or high-speed cameras. The integration of these pixel characteristics ensures superior performance in terms of spatial resolution, temporal resolution, and luminous efficiency.
29. The integrated device of claim 26 , comprising at least one of: a thickness less than 1.0 mm, or a device area larger than 50 mm×50 mm.
This invention relates to an integrated device designed for compact and scalable applications. The device addresses the need for miniaturization and large-area deployment in electronic systems, where traditional devices often face limitations in either size reduction or scalability. The integrated device includes a substrate with embedded electronic components, such as sensors, processors, or communication modules, arranged in a layered structure. The device is engineered to operate efficiently in confined spaces or over extensive areas, depending on the application. A key feature is the integration of multiple functional layers within a thin profile, enabling high-density component placement while maintaining structural integrity. The device may also incorporate flexible or foldable materials to enhance adaptability in various environments. In some configurations, the device has a thickness of less than 1.0 mm, allowing it to fit into tight spaces or be embedded in thin structures. Alternatively, the device can be scaled to cover areas larger than 50 mm by 50 mm, making it suitable for applications requiring broad coverage, such as large-area sensors or displays. The design ensures reliable performance across different sizes and form factors, addressing challenges in both miniaturization and scalability.
30. The integrated device of claim 26 , wherein the device is flexible.
The invention relates to an integrated device designed for use in flexible electronic systems, addressing the challenge of integrating multiple functional components into a compact, bendable form factor. The device includes a substrate, a first electrode, a second electrode, and an active layer positioned between the electrodes. The active layer contains a material that changes its electrical properties in response to an external stimulus, such as light, heat, or mechanical stress. The device is structured to allow for efficient charge transport and interaction with the active layer, enabling functions like sensing, energy conversion, or signal modulation. A key feature of this invention is its flexibility, allowing the device to conform to curved or irregular surfaces without compromising performance. This flexibility is achieved through the use of bendable substrate materials and electrode configurations that maintain electrical connectivity under deformation. The device may also incorporate additional layers, such as encapsulation or protective coatings, to enhance durability and environmental resistance. The flexible nature of the device makes it suitable for applications in wearable electronics, flexible displays, or conformal sensors, where traditional rigid devices would be impractical. The invention improves upon prior art by integrating multiple functional layers into a single, flexible unit, reducing complexity and improving adaptability to various form factors.
31. The integrated device of claim 1 , wherein the backplane comprises a low temperature polysilicon (LTPS) thin-film transistors (TFT) array control backplane.
This invention relates to display technologies, specifically addressing the need for improved control backplanes in integrated display devices. The device incorporates a backplane constructed from a low temperature polysilicon (LTPS) thin-film transistor (TFT) array. LTPS TFTs are used to control pixel elements in the display, offering advantages such as higher electron mobility, better performance, and lower manufacturing costs compared to traditional amorphous silicon TFTs. The backplane integrates these LTPS TFTs to drive the display's active matrix, enabling faster response times, higher resolution, and improved energy efficiency. The LTPS TFT array is designed to interface with light-emitting elements, such as organic light-emitting diodes (OLEDs), to modulate pixel brightness and color. The use of LTPS technology allows for finer control over individual pixels, enhancing display quality and reducing power consumption. This backplane structure is particularly suited for applications requiring high-performance displays, such as smartphones, tablets, and wearable devices, where compact size and efficient power usage are critical. The invention focuses on optimizing the backplane's electrical and thermal properties to ensure reliable operation under varying environmental conditions.
32. The integrated device of claim 31 , wherein the backplane is on a substrate, and wherein the device further comprises: a second LTPS TFT array control backplane on the substrate, the second backplane being adjacent to the backplane.
This invention relates to integrated display devices with multiple low-temperature polycrystalline silicon (LTPS) thin-film transistor (TFT) array control backplanes on a single substrate. The technology addresses the challenge of integrating multiple display control backplanes in a compact form factor, which is critical for advanced display applications requiring high performance and space efficiency. The device includes a first LTPS TFT array control backplane on a substrate, which functions as a primary display driver. Adjacent to this backplane is a second LTPS TFT array control backplane, also on the same substrate. The second backplane may serve as a secondary display driver, enabling features such as dual-display functionality, redundancy, or enhanced performance. Both backplanes are fabricated using LTPS TFT technology, which provides high electron mobility and efficient control of display elements. The integration of multiple backplanes on a single substrate reduces the need for separate components, improving device compactness and manufacturing efficiency. This configuration is particularly useful in applications requiring high-resolution, multi-zone displays or redundant display systems for reliability. The invention optimizes space utilization while maintaining high-performance display control.
33. The integrated device of claim 31 , wherein each of the pixels includes at least one of: a size less than 10 μm, a respond time faster than 1.0 μs, or an emitting light flux higher than 10 cd/mm{circumflex over ( )}2.
This invention relates to an integrated device for high-performance display or imaging applications, addressing challenges in pixel size, response time, and light output. The device features an array of pixels, each incorporating at least one of three key enhancements: a pixel size smaller than 10 micrometers, a response time faster than 1.0 microsecond, or an emitting light flux exceeding 10 cd/mm². These improvements enable higher resolution, faster refresh rates, and brighter displays or sensors. The device may be used in applications requiring compact, high-speed, or high-brightness optical components, such as microdisplays, augmented reality systems, or high-speed imaging devices. The pixel architecture ensures efficient light emission or detection while maintaining minimal footprint and rapid switching capabilities. The integration of these features into a single device enhances performance in demanding optical environments.
34. The integrated device of claim 31 , comprising at least one of: a thickness less than 1.0 mm, or a device area larger than 100 mm×100 mm.
The invention relates to integrated devices, particularly those designed for compact and large-area applications. The device addresses the challenge of balancing miniaturization with scalability, providing a solution that can be both thin and large in area. The device includes at least one of two key features: a thickness of less than 1.0 mm, enabling compact integration into space-constrained environments, or a device area larger than 100 mm by 100 mm, allowing for broad coverage in applications requiring extensive surface deployment. The device may incorporate multiple functional layers or components, such as sensors, actuators, or electronic circuits, arranged in a thin, scalable configuration. The combination of thinness and large area makes the device suitable for applications in flexible electronics, wearable technology, large-area displays, or energy harvesting systems. The design ensures mechanical flexibility and structural integrity while maintaining performance across varying dimensions. The invention improves upon existing solutions by offering a versatile form factor that can adapt to both small-scale and large-scale deployment needs without compromising functionality.
35. The integrated device of claim 31 , wherein the device is flexible, rollable, and foldable.
This invention relates to flexible, rollable, and foldable integrated devices designed for enhanced portability and adaptability. The device integrates multiple functional components into a single, compact form factor, allowing it to conform to various shapes and environments. Its flexibility enables bending, rolling, and folding without compromising structural integrity or performance. The device may include electronic, optical, or mechanical systems, such as displays, sensors, or energy storage modules, all embedded within a flexible substrate. The design ensures durability under repeated deformation while maintaining functionality. This adaptability makes the device suitable for applications in wearable technology, portable electronics, or deployable systems where traditional rigid devices would be impractical. The invention addresses the need for lightweight, space-efficient devices that can adapt to dynamic usage scenarios while retaining full operational capabilities.
36. The integrated device of claim 1 , wherein the backplane is operable to drive the active-matrix light emitting pixels by pulse-width-modulation (PWM).
The invention relates to an integrated device for driving active-matrix light-emitting pixels, addressing the challenge of efficiently controlling light emission in display systems. The device includes a backplane that interfaces with the pixels, enabling precise modulation of their brightness. A key feature is the backplane's ability to drive the pixels using pulse-width-modulation (PWM), a technique that adjusts light output by varying the duration of current pulses. This method ensures accurate brightness control while minimizing power consumption and heat generation. The backplane may also incorporate additional circuitry, such as drivers or controllers, to manage pixel operation. The integrated design simplifies manufacturing and improves reliability by consolidating components into a single unit. The PWM-driven backplane enhances display performance by providing fine-grained brightness adjustment, reducing flicker, and extending the lifespan of the light-emitting pixels. This solution is particularly useful in high-resolution displays, where precise and efficient pixel control is critical.
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January 5, 2021
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