An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.
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1. An integrated transformer, comprising: a primary winding; a secondary winding; wherein each of the primary and secondary windings is made of a metallic material and has a spiral planar arrangement comprising a corresponding plurality of coils; and a dielectric portion of dielectric material interposed between the primary winding and the secondary winding; an attenuation layer having a dielectric coefficient greater than a dielectric coefficient of the dielectric portion, said attenuation layer positioned between an upper surface of the dielectric portion and a lower surface of the coils of the primary winding; and a field plate winding electrically coupled with the primary winding, wherein the primary winding is positioned between the field plate winding and the secondary winding; wherein the field plate winding comprises at least one field plate coil having a lateral extension greater than a lateral extension of a primary outer coil of the primary winding with the at least one field plate coil overlapping in plan view the primary outer coil of the primary winding, the field plate winding being configured to mutually separate equipotential surfaces of an operating electric field at a secondary winding facing edge of the primary outer coil of the primary winding.
This invention relates to integrated transformers and addresses the problem of managing electric fields and improving performance in such devices. The integrated transformer includes a primary winding and a secondary winding, both constructed from a metallic material and arranged in a spiral planar configuration of multiple coils. A dielectric portion made of dielectric material is situated between the primary and secondary windings. An attenuation layer, characterized by a dielectric coefficient higher than that of the dielectric portion, is positioned between the upper surface of the dielectric portion and the lower surface of the primary winding's coils. Additionally, a field plate winding is electrically connected to the primary winding. The primary winding is located between the field plate winding and the secondary winding. The field plate winding comprises at least one field plate coil. This field plate coil has a lateral extension exceeding that of the outermost coil of the primary winding, and it overlaps the primary outer coil when viewed from above. The field plate winding is designed to spatially separate equipotential surfaces of the operating electric field at the edge of the primary outer coil that faces the secondary winding.
2. The integrated transformer according to claim 1 , further comprising an additional attenuation layer which surrounds side surfaces and top surfaces of the coils of the primary winding.
The invention relates to an integrated transformer with enhanced electromagnetic interference (EMI) suppression. The primary winding of the transformer is surrounded by an additional attenuation layer that covers the side and top surfaces of the coils. This layer is designed to reduce EMI emissions and improve signal integrity by attenuating high-frequency noise generated during operation. The attenuation layer may be composed of a conductive or absorptive material, such as a ferrite or conductive polymer, which dissipates or absorbs stray electromagnetic fields. The transformer is particularly useful in high-frequency applications where EMI suppression is critical, such as in power electronics, telecommunications, and high-speed data transmission systems. The additional attenuation layer provides a more compact and integrated solution compared to traditional EMI suppression techniques, which often require separate shielding components. By integrating the attenuation layer directly into the transformer structure, the invention reduces assembly complexity and improves overall performance.
3. The integrated transformer according to claim 2 , wherein a lower surface of the additional attenuation layer is in contact with the upper surface of the attenuation layer.
The invention relates to an integrated transformer with enhanced electromagnetic interference (EMI) shielding and signal attenuation. The transformer includes a core, primary and secondary windings, and an attenuation layer positioned between the windings to reduce noise and interference. The attenuation layer is made of a conductive or magnetic material that absorbs or reflects stray electromagnetic fields, improving signal integrity. The transformer further includes an additional attenuation layer stacked on top of the primary attenuation layer. The lower surface of this additional attenuation layer is in direct contact with the upper surface of the first attenuation layer, creating a multi-layered shielding structure. This configuration enhances EMI suppression by providing multiple barriers to electromagnetic interference, reducing crosstalk and improving overall performance in high-frequency applications. The additional attenuation layer may be made of the same or a different material as the primary layer, depending on the specific attenuation requirements. The stacked arrangement ensures continuous shielding without gaps, minimizing leakage and improving efficiency. This design is particularly useful in high-density electronic circuits where minimizing interference is critical.
4. An integrated transformer, comprising: a primary winding; a secondary winding; wherein each of the primary and secondary windings is made of a metallic material and has a spiral planar arrangement comprising a corresponding plurality of coils; and a dielectric portion of dielectric material having an upper surface and a lower surface; and an attenuation layer having a dielectric coefficient greater than a dielectric coefficient of the dielectric portion, said attenuation layer having a lower surface in contact with the upper surface of the dielectric portion and having an upper surface in contact with a lower surface of the coils of the primary winding; wherein the secondary winding is positioned below the lower surface of the dielectric portion; and a field plate winding electrically coupled with the primary winding, wherein the primary winding is positioned between the field plate winding and the secondary winding; wherein the field plate winding comprises at least one field plate coil having a lateral extension greater than a lateral extension of a primary outer coil of the primary winding with the at least one field plate coil overlapping in plan view the primary outer coil of the primary winding, the field plate winding being configured to mutually separate equipotential surfaces of an operating electric field at a secondary winding facing edge of the primary outer coil of the primary winding.
This invention relates to an integrated transformer designed to improve electromagnetic field containment and reduce interference in electronic circuits. The transformer includes a primary winding and a secondary winding, both made of metallic material and arranged in a spiral planar configuration with multiple coils. A dielectric portion with upper and lower surfaces separates the primary and secondary windings, with the secondary winding positioned below the dielectric portion. An attenuation layer, having a higher dielectric coefficient than the dielectric portion, is placed between the primary winding and the dielectric portion, enhancing field control. A field plate winding is electrically coupled to the primary winding and positioned above it, with at least one field plate coil extending laterally beyond the outermost coil of the primary winding. This overlapping configuration helps to separate equipotential surfaces of the operating electric field near the primary winding's edge, reducing parasitic coupling and improving transformer efficiency. The field plate winding's design ensures better containment of the electric field, minimizing interference with the secondary winding and other nearby components. This structure is particularly useful in integrated circuits where compact, high-performance transformers are required.
5. The integrated transformer according to claim 4 , further comprising an additional attenuation layer which surrounds side surfaces and top surfaces of the coils of the primary winding.
The invention relates to an integrated transformer with improved electromagnetic interference (EMI) suppression. The transformer includes a primary winding and a secondary winding, where the primary winding is formed by a plurality of coils arranged in a stacked configuration. The coils of the primary winding are surrounded by an additional attenuation layer that covers the side surfaces and top surfaces of the coils. This attenuation layer is designed to reduce electromagnetic emissions and improve the transformer's performance by minimizing interference. The attenuation layer may be made of a conductive or absorptive material that dampens unwanted electromagnetic radiation. The transformer is particularly useful in high-frequency applications where EMI suppression is critical, such as in power electronics, telecommunications, and signal processing systems. The additional attenuation layer enhances the transformer's ability to operate efficiently while complying with electromagnetic compatibility (EMC) regulations. The overall design ensures that the transformer maintains high efficiency while effectively suppressing unwanted electromagnetic noise.
6. The integrated transformer according to claim 5 , wherein a lower surface of the additional attenuation layer is in contact with the upper surface of the attenuation layer.
The invention relates to an integrated transformer with enhanced electromagnetic interference (EMI) shielding and signal attenuation. The device addresses the problem of unwanted electromagnetic radiation and signal interference in electronic circuits, particularly in high-frequency applications where transformers are used. The integrated transformer includes a core structure with primary and secondary windings, an attenuation layer positioned on an upper surface of the core, and an additional attenuation layer. The additional attenuation layer is placed such that its lower surface directly contacts the upper surface of the attenuation layer, forming a continuous shielding barrier. This configuration improves EMI suppression by ensuring seamless contact between the layers, reducing gaps that could allow electromagnetic leakage. The attenuation layers are composed of conductive or magnetic materials designed to absorb or reflect stray electromagnetic fields, thereby minimizing interference with adjacent components. The transformer's design is particularly useful in applications requiring strict EMI compliance, such as telecommunications, power electronics, and high-speed data processing systems. The direct contact between the attenuation layers ensures consistent performance and reliability in shielding against electromagnetic noise.
7. An apparatus, comprising: a semiconductor substrate; a plurality of metallization layers over said semiconductor substrate, wherein each metallization layer includes a dielectric material and an electrical element; an integrated transformer, comprising: a first winding at a lower-most one of the metallization layers; a second winding at an upper-most one of the metallization layers, wherein at least one metallization layer is between the lower-most and upper-most metallization layers; wherein each of the first and second windings has a spiral planar arrangement comprising a corresponding plurality of coils; and an attenuation layer having a dielectric coefficient greater than a dielectric coefficient of the dielectric material for said metallization layers, said attenuation layer positioned in direct contact with a bottom surface of the second winding and in direct contact with an upper surface of the dielectric material for the upper-most metallization layer.
This invention relates to integrated circuit (IC) design, specifically addressing challenges in implementing high-performance transformers within semiconductor devices. Traditional on-chip transformers suffer from performance limitations due to parasitic effects, such as capacitive coupling and signal loss, which degrade efficiency and signal integrity. The invention provides an apparatus with an integrated transformer that mitigates these issues through a novel structural arrangement and material selection. The apparatus includes a semiconductor substrate with multiple metallization layers, each containing a dielectric material and electrical elements. The integrated transformer consists of a first winding located in the lowest metallization layer and a second winding in the highest metallization layer, with at least one intermediate metallization layer separating them. Both windings have a spiral planar arrangement with multiple coils. To reduce parasitic capacitance and improve performance, an attenuation layer with a higher dielectric coefficient than the metallization layer dielectrics is placed directly beneath the second winding and above the uppermost metallization layer. This configuration minimizes unwanted coupling between the windings and the surrounding circuitry, enhancing transformer efficiency and signal quality. The design is particularly useful in high-frequency applications where minimizing parasitic effects is critical.
8. The apparatus according to claim 7 , further comprising an additional attenuation layer which surrounds side surfaces and top surfaces of the coil for the second winding.
This invention relates to electromagnetic shielding in electrical apparatus, specifically addressing the issue of interference between adjacent windings in transformers or inductors. The apparatus includes a primary winding and a secondary winding, where the secondary winding is surrounded by an attenuation layer to reduce electromagnetic interference. The attenuation layer is positioned to cover the side and top surfaces of the coil for the second winding, providing enhanced shielding against stray electromagnetic fields. The attenuation layer may be made of a conductive or ferromagnetic material to absorb or redirect interference, ensuring cleaner signal transmission and improved performance in high-frequency applications. The design is particularly useful in compact electronic devices where multiple windings are closely spaced, minimizing cross-talk and signal degradation. The additional attenuation layer works in conjunction with other shielding elements to further isolate the windings, improving overall system efficiency and reliability. This solution is applicable in power electronics, telecommunications, and other fields where electromagnetic compatibility is critical.
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January 16, 2020
April 12, 2022
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