Position-tolerance-insensitive contacting module for contacting optoelectronic chips

The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (EoK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (So) to be coupled in.