The present disclosure relates to a heat sink pedestal including a composite material. The composite material may include at least one layer of a thermally conductive primary material and at least one layer of a thermally conductive secondary material. The composite material may include a conductivity ratio of lateral thermal conductivity (Kz) to planar thermal conductivity (Kx, Ky) of the composite material of at least 0. The heat sink pedestal may be conformable to a shape of a semiconductor chip.
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4. The device of claim 1, wherein the thermally conductive primary material comprises graphite, graphene, silver, copper, or aluminum.
This invention relates to a thermal management device designed to improve heat dissipation in electronic systems. The device addresses the problem of excessive heat buildup in electronic components, which can degrade performance and reliability. The primary material of the device is thermally conductive, ensuring efficient heat transfer away from heat-generating components. The device includes a thermally conductive primary material, such as graphite, graphene, silver, copper, or aluminum, which are known for their high thermal conductivity. These materials are selected to maximize heat dissipation while maintaining structural integrity. The device may also include additional features, such as a thermally conductive secondary material, to further enhance heat transfer. The thermally conductive primary material is integrated into the device in a way that optimizes contact with heat sources, ensuring effective heat removal. The device is particularly useful in applications where high thermal performance is critical, such as in high-power electronics, data centers, and automotive systems. By using materials with superior thermal properties, the device helps maintain optimal operating temperatures, improving efficiency and longevity of electronic systems.
5. The device of claim 1, wherein the thermally conductive secondary material comprises a silica composite, alumina foam, alumina-silica fiber, manganese, nickel, copper, silver, silver-copper, tin, carbon fiber, aluminum, alumina, boron nitride, or aluminum nitride particles.
This invention relates to a thermal management device designed to improve heat dissipation in electronic or industrial systems. The device addresses the problem of inefficient heat transfer, which can lead to overheating and reduced performance in high-power applications. The core of the invention is a thermally conductive secondary material integrated into the device to enhance heat conduction. This material can be selected from a range of options, including silica composites, alumina foam, alumina-silica fibers, metals like manganese, nickel, copper, silver, silver-copper alloys, tin, and aluminum, as well as non-metallic materials such as carbon fiber, boron nitride, and aluminum nitride particles. These materials are chosen for their high thermal conductivity, durability, and compatibility with various operating environments. The secondary material is structured to maximize surface area contact with the primary heat source, ensuring efficient heat transfer away from critical components. The device may also incorporate additional features, such as a heat sink or cooling fins, to further enhance thermal performance. The invention is particularly useful in applications where traditional cooling methods are insufficient, such as in high-performance computing, power electronics, or industrial machinery. By optimizing heat dissipation, the device helps maintain system reliability and extends operational lifespan.
6. The device of claim 1, wherein the thermally conductive primary material comprises graphite or graphene and the thermally conductive secondary material comprises a silica composite.
A thermal management device is designed to improve heat dissipation in electronic systems by incorporating a composite structure with enhanced thermal conductivity. The device includes a thermally conductive primary material, such as graphite or graphene, which provides high thermal conductivity and structural support. A thermally conductive secondary material, such as a silica composite, is integrated with the primary material to further enhance heat transfer properties. The combination of these materials ensures efficient heat spreading and dissipation, addressing the challenge of thermal management in high-performance electronics where traditional materials may be insufficient. The silica composite may be embedded within or applied as a coating to the primary material, optimizing thermal performance while maintaining mechanical stability. This design is particularly useful in applications requiring rapid heat dissipation, such as power electronics, data centers, or high-density computing systems. The use of graphite, graphene, or silica composites ensures lightweight, durable, and high-efficiency thermal management solutions.
7. The device of claim 1, wherein the thermally conductive primary material has a higher thermal conductivity than the thermally conductive secondary material, and further wherein the layer of the thermally conductive primary material is thicker than the layer of the thermally conductive secondary material.
This invention relates to a thermal management device designed to improve heat dissipation in electronic systems. The device addresses the problem of uneven heat distribution and inefficient cooling in high-performance electronics, which can lead to overheating and reduced performance. The device comprises a layered structure with a thermally conductive primary material and a thermally conductive secondary material. The primary material has higher thermal conductivity than the secondary material and is also thicker, allowing it to efficiently transfer heat away from critical components. The secondary material, while less conductive, provides structural support and additional heat spreading. The layered arrangement ensures that heat is first absorbed by the primary material and then distributed through the secondary material, optimizing cooling efficiency. The device is particularly useful in applications where both high thermal conductivity and structural integrity are required, such as in power electronics, data centers, and high-performance computing systems. The design balances thermal performance with material cost and weight, making it suitable for a wide range of electronic cooling applications.
8. The device of claim 1, wherein the composite material further comprises a hardness on a durometer scale of less than 25 based on industrial ASTM D2240 test standard.
A composite material is designed for applications requiring high flexibility and durability, particularly in environments where resistance to wear, impact, or deformation is critical. The material is engineered to exhibit a low hardness, specifically less than 25 on the durometer scale as measured by the ASTM D2240 test standard. This low hardness indicates a soft, pliable composition that can conform to surfaces, absorb shocks, or provide cushioning without permanent deformation. The composite structure may include reinforcing elements such as fibers, particles, or layers embedded within a polymer matrix to enhance mechanical properties while maintaining flexibility. The material is suitable for use in seals, gaskets, vibration dampers, or protective coatings where a balance of softness and structural integrity is required. The formulation ensures long-term performance under dynamic loading conditions, resisting fatigue and maintaining its flexible characteristics over time. The ASTM D2240 standard provides a consistent method for measuring hardness, ensuring reproducibility and reliability in material characterization. This composite material addresses the need for flexible yet durable solutions in industrial, automotive, or consumer applications where traditional rigid materials would fail.
9. The device of claim 1, wherein the composite material further comprises a dielectric constant of less than 8.0.
A composite material is designed for use in electronic applications where low dielectric constant properties are critical. The material is engineered to reduce signal loss and improve performance in high-frequency circuits, such as those used in telecommunications, radar systems, and high-speed digital devices. The composite includes a base matrix combined with reinforcing or functional fillers to achieve specific electrical and mechanical properties. A key feature of this material is its dielectric constant, which is less than 8.0, ensuring minimal signal attenuation and interference. This low dielectric constant is achieved through careful selection of matrix and filler materials, as well as their distribution within the composite. The material may also incorporate additives to enhance thermal stability, mechanical strength, or processability without significantly increasing the dielectric constant. The composite is suitable for use in printed circuit boards, antennas, and other electronic components where signal integrity is paramount. The low dielectric constant ensures efficient signal transmission, reducing power loss and improving overall system performance. The material's composition and structure are optimized to maintain these properties across a wide range of operating conditions.
10. The device of claim 1, wherein the composite material further comprises a thermal endurance of up to 200° C.
A composite material is designed to provide enhanced thermal endurance, specifically capable of withstanding temperatures up to 200° C. This material is engineered to maintain structural integrity and performance under high-temperature conditions, addressing challenges in applications where conventional materials degrade or fail. The composite structure integrates multiple layers or components, each contributing to its thermal resistance, mechanical strength, and durability. The material may include reinforcing fibers, matrices, or additives that improve heat dissipation, thermal stability, or resistance to thermal degradation. This thermal endurance enables the composite to be used in environments such as aerospace, automotive, or industrial systems where exposure to elevated temperatures is common. The material's design ensures it retains its properties over extended periods, reducing maintenance and replacement costs. By combining thermal resistance with other functional properties, the composite material offers a reliable solution for high-temperature applications.
11. The device of claim 1, wherein the composite material further comprises a moisture absorption of 0.5 to 3.0 percent.
This invention relates to composite materials designed for use in environments where moisture absorption is a critical factor, such as in aerospace, automotive, or electronics applications. The problem addressed is the need for composite materials that maintain structural integrity and performance while minimizing moisture uptake, which can lead to swelling, delamination, or electrical failures. The composite material includes a reinforcing phase, such as fibers or particles, embedded in a matrix, and is engineered to achieve a moisture absorption range of 0.5 to 3.0 percent. This controlled moisture absorption ensures the material remains stable under varying humidity conditions without compromising mechanical or electrical properties. The reinforcing phase may include materials like carbon fibers, glass fibers, or ceramic particles, while the matrix could be a polymer, such as epoxy or polyester resin. The specific moisture absorption range is achieved through careful selection of material compositions, surface treatments, or additives that enhance hydrophobicity or moisture resistance. This balance ensures the composite material retains its strength, dimensional stability, and durability in humid or wet environments, making it suitable for high-performance applications where moisture sensitivity is a concern.
12. The device of claim 1, wherein the composite material further comprises a total thickness of 0.5 to 5 mm.
This invention relates to a composite material device designed for structural applications, particularly where lightweight yet durable materials are required. The composite material is engineered to address challenges in industries such as aerospace, automotive, and construction, where traditional materials may lack the necessary strength-to-weight ratio or environmental resistance. The composite material includes a layered structure with reinforcing fibers embedded in a matrix, providing enhanced mechanical properties. The fibers may be carbon, glass, or other high-strength materials, while the matrix can be a polymer, ceramic, or metal, depending on the application. The composite is further optimized by incorporating a total thickness ranging from 0.5 to 5 millimeters, balancing structural integrity with weight efficiency. This thickness range ensures sufficient load-bearing capacity while maintaining flexibility for various design constraints. The composite may also include additional layers or coatings to improve properties such as corrosion resistance, thermal stability, or impact absorption. The material's design allows for customization based on specific performance requirements, making it suitable for applications where durability, lightweight construction, and environmental resistance are critical. The invention aims to provide a versatile composite solution that outperforms conventional materials in demanding environments.
16. The heat sink pedestal of claim 13, wherein the composite material further comprises a hardness on a durometer scale of less than 25 based on industrial ASTM D2240 test standard.
A heat sink pedestal is designed to improve thermal management in electronic devices by efficiently dissipating heat. The pedestal is constructed from a composite material that enhances heat transfer while providing structural support. The composite material includes a polymer matrix reinforced with thermally conductive fillers, such as metal particles or ceramic fibers, to improve thermal conductivity. The pedestal is shaped to maximize surface area contact with a heat-generating component, ensuring optimal heat dissipation. Additionally, the composite material has a hardness of less than 25 on the durometer scale, as measured by the ASTM D2240 test standard, which allows for flexibility and compliance to better conform to uneven surfaces and reduce mechanical stress. This design ensures reliable thermal performance while maintaining durability and structural integrity in electronic applications. The pedestal may also include mounting features, such as threaded holes or clips, to securely attach to electronic components or enclosures. The combination of high thermal conductivity, flexibility, and mechanical stability makes this heat sink pedestal suitable for use in high-performance computing, power electronics, and other heat-sensitive applications.
20. The method of claim 17, wherein the composite material further comprises a hardness on a durometer scale of less than 25 based on industrial ASTM D2240 test standard.
The invention relates to composite materials designed for specific mechanical properties, particularly focusing on hardness. The composite material is engineered to have a hardness of less than 25 on the durometer scale, as measured by the ASTM D2240 test standard. This low hardness indicates a soft, flexible, or pliable material suitable for applications requiring shock absorption, cushioning, or conformability. The composite material may incorporate fillers, reinforcements, or additives to achieve the desired hardness while maintaining structural integrity. The material's composition and processing methods are tailored to ensure consistent hardness across the material, making it reliable for use in industries such as automotive, medical devices, or consumer products where soft-touch or impact-resistant materials are needed. The invention addresses the need for materials that balance softness with durability, providing a solution for applications where traditional hard composites would be unsuitable.
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November 9, 2020
December 6, 2022
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