Memory devices including a substrate supporting at least one semiconductor device thereon. The substrate includes an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures are located proximate to, and laterally outward from, the interface. The engagement structures extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier includes supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
2. The apparatus of claim 1, wherein a line connecting a first point on the first portion located closest to the another, opposite end of the substrate to a second point on the second laterally inward portion located closest to the end of the substrate is oriented at an oblique angle when compared to a leading edge of the substrate at the end.
This invention relates to a substrate processing apparatus designed to improve material handling and alignment during manufacturing processes. The apparatus addresses the challenge of precisely positioning substrates, such as semiconductor wafers or glass panels, to ensure consistent processing outcomes. The invention features a substrate support structure with a first portion and a second laterally inward portion, each positioned at opposite ends of the substrate. A key aspect is the orientation of a line connecting a first point on the first portion (located closest to the opposite end of the substrate) to a second point on the second laterally inward portion (located closest to the end of the substrate). This connecting line is angled obliquely relative to the leading edge of the substrate at the end, enhancing stability and alignment during processing. The oblique angle helps mitigate misalignment issues caused by thermal expansion, mechanical stress, or handling forces, ensuring uniform processing across the substrate surface. The design may be integrated into systems like lithography, etching, or deposition tools where precise substrate positioning is critical. The apparatus improves yield and reduces defects by maintaining optimal substrate orientation throughout the manufacturing workflow.
3. The apparatus of claim 1, wherein a maximum thickness of the substrate is 10 mm or less.
This invention relates to an apparatus for manufacturing a composite material, addressing the challenge of producing high-quality composite structures with precise thickness control. The apparatus includes a substrate with a maximum thickness of 10 mm or less, which is used as a base for forming the composite material. The substrate is designed to support and facilitate the deposition of reinforcing fibers or other materials during the manufacturing process. The apparatus may also include a mechanism for applying pressure or heat to the substrate to ensure proper bonding and consolidation of the composite layers. The thin substrate (10 mm or less) allows for efficient material distribution and reduces the risk of defects such as voids or delamination. The apparatus may further incorporate alignment features to ensure accurate positioning of the substrate and composite layers, enhancing the structural integrity of the final product. The invention is particularly useful in industries requiring lightweight, high-strength composite materials, such as aerospace, automotive, and construction.
4. The apparatus of claim 1, wherein a power rating of the substrate is between 10 W and 14 W.
The invention relates to a power control apparatus for managing electrical power distribution in a system, particularly for substrates used in semiconductor processing or other high-precision applications. The apparatus addresses the challenge of maintaining stable and efficient power delivery to substrates, which is critical for consistent performance and reliability in manufacturing processes. The apparatus includes a power supply unit that regulates electrical power to a substrate, ensuring that the power output remains within a specified range to prevent overheating or underperformance. A control module monitors the power consumption of the substrate and adjusts the power supply accordingly, maintaining optimal operating conditions. The apparatus also incorporates safety mechanisms to detect and respond to power fluctuations or faults, protecting both the substrate and the power supply. A key feature of the apparatus is its ability to handle substrates with a power rating between 10 W and 14 W, ensuring compatibility with a range of applications requiring precise power control. The invention improves efficiency, reliability, and safety in power distribution systems for substrates, particularly in environments where precise power management is essential.
5. The apparatus of claim 1, further comprising holes extending through the crossbar, the holes sized and shaped to receive connectors through the holes to secure the carrier in place in a higher-level assembly.
This invention relates to a mechanical apparatus for securing a carrier within a higher-level assembly. The apparatus includes a crossbar with holes extending through it, designed to receive connectors that fasten the carrier in place. The holes are specifically sized and shaped to accommodate these connectors, ensuring proper alignment and stability during assembly. The crossbar is part of a larger structure that supports and positions the carrier, which may be a component or module within a larger system. The holes allow for precise attachment using fasteners such as screws, bolts, or pins, ensuring the carrier remains securely fixed during operation. This design enhances assembly efficiency and structural integrity, particularly in applications where the carrier must withstand mechanical stress or vibration. The apparatus is useful in industries such as electronics, automotive, or aerospace, where reliable component mounting is critical. The holes may be threaded or unthreaded, depending on the connector type, and their placement ensures optimal load distribution and alignment. The invention improves upon existing mounting solutions by providing a more robust and adaptable fastening mechanism.
6. The apparatus of claim 1, wherein a greatest width of the crossbar, as measured in a direction at least substantially perpendicular to major surfaces of the sidewalls, is equal to or less than 1U of a server rack.
This invention relates to a compact crossbar apparatus designed for use in server racks, addressing the challenge of space constraints in data center environments. The crossbar is a high-speed interconnect structure that facilitates communication between multiple processing units or memory modules within a server rack. The key innovation lies in its compact form factor, where the greatest width of the crossbar, measured perpendicular to its sidewalls, is equal to or less than 1U (one rack unit, equivalent to 1.75 inches or 44.45 mm). This dimensional constraint ensures compatibility with standard server rack dimensions, allowing for efficient integration without occupying excessive vertical space. The crossbar includes sidewalls that support and protect the internal interconnect pathways, which may consist of electrical traces, optical fibers, or other high-speed data transmission media. The apparatus may also incorporate cooling mechanisms, such as heat sinks or liquid cooling channels, to manage thermal dissipation in high-density computing environments. By minimizing the crossbar's footprint while maintaining robust performance, the invention enables denser server rack configurations, reducing overall data center footprint and operational costs. The design is particularly suited for high-performance computing, cloud infrastructure, and edge computing applications where space optimization is critical.
7. The apparatus of claim 1, wherein the greatest width of the crossbar is equal to or less than 34 mm.
This invention relates to a crossbar apparatus used in a vehicle's roof rack system, specifically addressing the need for a lightweight yet structurally robust crossbar design. The crossbar is designed to support loads while minimizing weight and aerodynamic drag. The apparatus includes a hollow body with a cross-sectional shape that enhances strength and rigidity, such as a multi-chambered or reinforced structure. The crossbar is mounted to a vehicle's roof rails or side rails using mounting brackets that allow for secure attachment and load distribution. The crossbar may also include integrated features like drainage channels, aerodynamic contours, or mounting interfaces for accessories. The invention emphasizes optimizing the crossbar's width to balance structural integrity with aerodynamic efficiency. The greatest width of the crossbar is constrained to be equal to or less than 34 mm, ensuring compatibility with various vehicle roof designs while maintaining performance. The crossbar may be constructed from materials like aluminum, steel, or composite materials to achieve the desired strength-to-weight ratio. The design may also incorporate internal reinforcements or external ribs to further enhance load-bearing capacity. The apparatus is intended for use in automotive roof rack systems, providing a durable and efficient solution for transporting cargo.
8. The apparatus of claim 1, further comprising holes extending through the substrate, the holes located proximate to the another, opposite end of the substrate.
This invention relates to an apparatus for managing fluid flow, particularly in systems where precise control of fluid distribution is required. The apparatus includes a substrate with a first end and an opposite second end, where the substrate is designed to facilitate fluid movement. The substrate has a channel that extends from the first end toward the second end, allowing fluid to flow through it. Additionally, the apparatus includes a barrier positioned along the channel to direct or restrict fluid flow, ensuring controlled distribution. The barrier may be adjustable or fixed, depending on the application. To enhance fluid management, the apparatus further includes holes that extend through the substrate, located near the second end. These holes allow for additional fluid ingress, egress, or pressure equalization, improving the overall efficiency and performance of the system. The holes may be uniformly or variably spaced to optimize fluid dynamics based on specific requirements. This design is particularly useful in applications such as microfluidic devices, filtration systems, or chemical processing, where precise fluid control is critical. The combination of the channel, barrier, and holes ensures balanced fluid distribution and minimizes unwanted pressure buildup or flow irregularities.
9. The apparatus of claim 8, wherein the carrier comprises protrusions extending laterally inwardly from each sidewall toward each other sidewall, the protrusions comprising other holes extending through the protrusions, the other holes positioned to align with the holes in the substrate when the engagement structures are engaged with the supports.
This invention relates to a mechanical apparatus for securing a substrate, such as a semiconductor wafer or similar component, within a carrier. The problem addressed is the need for precise alignment and secure retention of the substrate during handling, processing, or testing, while allowing for controlled movement or access to the substrate. The apparatus includes a carrier with sidewalls that form an enclosure for the substrate. The carrier has engagement structures that interact with supports to hold the substrate in place. The sidewalls of the carrier include protrusions that extend laterally inward toward each other. These protrusions contain additional holes that align with holes in the substrate when the engagement structures are engaged with the supports. This alignment ensures that the substrate is properly positioned and secured within the carrier, facilitating accurate processing or testing. The protrusions and holes may be used for mechanical fastening, fluid delivery, or electrical connections, depending on the application. The design ensures stability while allowing controlled access to the substrate.
10. The apparatus of claim 1, wherein the at least one semiconductor device comprises a first semiconductor device supported on a first major surface of the substrate and a second semiconductor device supported on a second major surface of the substrate, the first major surface located on a first side of the substrate, the second major surface located on a second, opposite side of the substrate.
This invention relates to semiconductor device packaging, specifically addressing the challenge of integrating multiple semiconductor devices into a compact, efficient structure. The apparatus includes a substrate with semiconductor devices mounted on both major surfaces, enabling high-density integration while maintaining electrical and thermal performance. The substrate has a first major surface on one side and a second major surface on the opposite side. A first semiconductor device is supported on the first major surface, while a second semiconductor device is supported on the second major surface. This dual-sided configuration allows for increased functionality and reduced footprint compared to single-sided designs. The apparatus may further include electrical interconnects, thermal management features, and encapsulation to protect the devices while ensuring reliable operation. The design is particularly useful in applications requiring high-performance, space-efficient semiconductor packaging, such as advanced computing, telecommunications, and power electronics. The invention optimizes space utilization by leveraging both sides of the substrate, reducing the need for additional interconnect layers or external components.
11. The apparatus of claim 10, further comprising heat-management structures, each heat management structure located on a side of a respective one of the first semiconductor device or the second semiconductor device opposite the substrate.
This invention relates to semiconductor devices, specifically to an apparatus with multiple semiconductor devices mounted on a substrate and incorporating heat-management structures. The apparatus addresses the problem of thermal dissipation in densely packed semiconductor devices, which can lead to overheating and reduced performance. The apparatus includes a first semiconductor device and a second semiconductor device mounted on a substrate, where the first semiconductor device is electrically connected to the second semiconductor device. The heat-management structures are positioned on the sides of the semiconductor devices opposite the substrate, ensuring efficient heat dissipation from the active regions of the devices. These structures may include heat sinks, thermal spreaders, or other cooling elements designed to draw heat away from the semiconductor devices and into the surrounding environment. The apparatus may also include additional components such as interconnects or packaging materials that facilitate electrical and thermal connectivity while maintaining structural integrity. The heat-management structures are strategically placed to maximize cooling efficiency without interfering with the electrical connections or mechanical stability of the apparatus. This design improves thermal performance, reliability, and operational lifespan of the semiconductor devices in high-power or high-density applications.
12. The apparatus of claim 10, further comprising an overmold material covering at least the first semiconductor device and the second semiconductor device.
This invention relates to semiconductor packaging, specifically addressing the challenge of protecting multiple semiconductor devices within a single package while maintaining electrical connectivity and structural integrity. The apparatus includes a first semiconductor device and a second semiconductor device, each having a plurality of electrical contacts. These devices are electrically connected to a substrate, which provides mechanical support and electrical routing. The substrate includes conductive traces that connect the electrical contacts of the semiconductor devices to external connection points, such as pins or pads, enabling communication with external circuits. The apparatus further includes an overmold material that encapsulates at least the first and second semiconductor devices, providing physical protection against environmental factors like moisture, dust, and mechanical stress. The overmold material may also enhance thermal dissipation and structural rigidity. The substrate may be a printed circuit board (PCB), a lead frame, or another suitable support structure, depending on the application. The electrical connections between the semiconductor devices and the substrate may be achieved through soldering, wire bonding, or other bonding techniques. The overmold material is applied to cover the semiconductor devices, ensuring their protection while allowing the external connection points to remain accessible for further assembly or testing. This design is particularly useful in applications requiring compact, robust, and reliable semiconductor packaging, such as consumer electronics, automotive systems, and industrial devices.
13. The apparatus of claim 12, wherein the overmold material covers a majority of each of the first major surface and the second major surface.
This invention relates to an apparatus for overmolding electronic components, addressing the challenge of protecting sensitive electronic parts while maintaining functionality. The apparatus includes a substrate with a first major surface and a second major surface, where the substrate supports one or more electronic components. The overmold material is applied to encapsulate these components, providing mechanical and environmental protection. The overmold material covers a majority of both major surfaces of the substrate, ensuring comprehensive protection while allowing necessary connections or interfaces to remain exposed. The substrate may be flexible or rigid, depending on the application, and the overmold material is selected to provide thermal and electrical insulation, moisture resistance, and structural integrity. The apparatus may also include additional features such as alignment guides or mounting points to facilitate integration into larger systems. The overmold material is applied in a controlled manner to avoid damaging the electronic components while ensuring full coverage of critical areas. This design improves durability and reliability in harsh environments while maintaining the functionality of the embedded electronics.
14. The apparatus of claim 1, wherein each sidewall of the carrier comprises longitudinally extending mutually parallel rails defining a channel therebetween aligned with the cutouts, lateral edges of the substrate being received in the channels and the posts received in recesses of the engagement structures.
This invention relates to a carrier apparatus for holding and aligning substrates, such as semiconductor wafers or similar components, during processing. The problem addressed is the need for precise positioning and secure retention of substrates within a carrier to prevent misalignment or damage during handling, transport, or processing operations. The apparatus includes a carrier with sidewalls that have mutually parallel rails extending longitudinally along each sidewall. These rails define a channel between them, which is aligned with cutouts in the carrier. The substrate is placed such that its lateral edges are received within these channels, ensuring precise lateral alignment. Additionally, the carrier includes engagement structures with recesses that receive posts, further securing the substrate in place. The combination of the rails and posts ensures that the substrate remains properly positioned and stabilized during use. This design prevents lateral movement and rotational misalignment, improving handling efficiency and reducing the risk of damage to the substrate. The apparatus is particularly useful in automated processing environments where consistent and accurate substrate positioning is critical.
17. The method of claim 16, wherein engaging the engagement structures with the support comprises orienting a line connecting a first portion located closest to another, opposite end of the substrate to a second point on the second laterally inward portion located closest to the end of the substrate to be at an oblique angle when compared to a leading edge of the substrate at the end.
This invention relates to a method for engaging engagement structures with a support in a substrate processing system. The method addresses the challenge of precisely aligning and securing a substrate, such as a semiconductor wafer, during handling or processing operations. The substrate has a leading edge at one end and engagement structures positioned along its perimeter. The method involves orienting a line connecting a first portion of the engagement structure, located closest to the opposite end of the substrate, to a second point on a laterally inward portion of the engagement structure, closest to the leading edge. This line is positioned at an oblique angle relative to the leading edge of the substrate. The oblique orientation ensures proper engagement with the support, improving stability and alignment during processing. The engagement structures may include notches, grooves, or other features designed to interact with corresponding structures on the support. The method ensures consistent and accurate positioning of the substrate, reducing misalignment and improving processing efficiency. The support may be part of a handling system, such as a robot arm or a processing chamber, where precise substrate placement is critical. The oblique angle orientation helps compensate for variations in substrate dimensions or alignment tolerances, enhancing overall system reliability.
18. The method of claim 16, further comprising inserting the substrate longitudinally into the carrier between the sidewalls, surfaces defining the cutouts located proximate to ends of the posts and aligned with channels between longitudinally extending, laterally inwardly protruding rails of the sidewalls, the channels each receiving a lateral edge of the substrate.
This invention relates to a system for handling and processing substrates, such as semiconductor wafers or glass panels, within a carrier. The problem addressed is the precise alignment and secure retention of substrates during transport or processing to prevent damage or misalignment. The carrier includes sidewalls with laterally inwardly protruding rails that form channels for receiving the lateral edges of the substrate. The rails are designed to guide and stabilize the substrate during insertion and removal. The invention further includes posts with cutouts positioned near the ends of the rails. These cutouts are aligned with the channels to facilitate smooth insertion of the substrate into the carrier. The substrate is inserted longitudinally between the sidewalls, with its edges sliding into the channels formed by the rails. The cutouts ensure that the substrate can be inserted without obstruction, while the rails maintain proper alignment and prevent lateral movement. This design improves substrate handling efficiency and reduces the risk of damage during processing.
19. The method of claim 16, further comprising aligning holes extending through the substrate with other holes extending through protrusions of the carrier, the holes of the substrate located proximate to another, opposite end of the substrate, each protrusion extending from a respective sidewall of the carrier toward another respective sidewall, each protrusion comprising one of the other holes extending through the protrusion, each respective sidewall extending from the crossbar along the remainder of the lateral periphery of the substrate.
This invention relates to a method for aligning holes in a substrate with holes in protrusions of a carrier. The method addresses the challenge of precisely aligning holes in a substrate with corresponding holes in a carrier, particularly when the substrate is positioned within the carrier. The carrier includes a crossbar and sidewalls extending from the crossbar along the lateral periphery of the substrate. Protrusions extend from the sidewalls toward opposing sidewalls, each protrusion containing a hole. The substrate has holes located near an end opposite the end where the substrate is initially positioned. The method involves aligning these substrate holes with the holes in the protrusions to ensure proper alignment and secure attachment. This alignment is critical for applications requiring precise positioning, such as in electronic packaging or mechanical assemblies where misalignment could lead to structural or functional failures. The method ensures that the substrate is correctly oriented and secured within the carrier, maintaining the integrity of the assembly.
20. The method of claim 19, further comprising securing the other end of the substrate to the carrier by inserting an attachment member through each set of a hole of the substrate and another hole of a respective protrusion of the carrier.
This invention relates to a method for securing a flexible substrate to a rigid carrier, addressing challenges in maintaining alignment and stability during manufacturing processes. The method involves positioning a flexible substrate on a carrier with protrusions, where the substrate has holes that align with corresponding holes in the protrusions. The substrate is then secured to the carrier by inserting an attachment member through each aligned set of holes, ensuring a stable connection. The carrier may include multiple protrusions, each with a hole, and the substrate may have multiple holes that align with these protrusions. The attachment member, such as a screw or pin, is inserted through the aligned holes to fasten the substrate to the carrier. This method ensures precise alignment and secure attachment, preventing misalignment or detachment during subsequent processing steps. The invention is particularly useful in applications requiring high precision, such as electronics manufacturing or assembly of flexible components.
21. The method of claim 16, further comprising securing the carrier within an equipment rack of a server.
A method for managing and securing a carrier within a server equipment rack is disclosed. The carrier is designed to hold and organize components such as cables, connectors, or other hardware within a server system. The method involves positioning the carrier in a specific orientation relative to the server equipment rack to ensure proper alignment and functionality. Additionally, the method includes securing the carrier within the equipment rack to prevent movement or dislodgment during operation. This ensures stability and reliability of the components housed within the carrier. The securing mechanism may involve mechanical fasteners, locking mechanisms, or other attachment methods compatible with standard server rack designs. The method may also include integrating the carrier with other components or systems within the server rack to optimize space utilization and accessibility. The overall solution addresses the need for organized and secure component management in high-density server environments, reducing installation errors and improving maintenance efficiency.
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August 4, 2021
April 23, 2024
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