A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.
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2. The circuit board cooling apparatus of claim 1, further comprising a gap-filler material to be deployed between the circuit board and the heat spreader device.
A circuit board cooling apparatus is designed to manage heat dissipation in electronic systems, particularly for high-performance computing or densely packed circuit boards. The apparatus includes a heat spreader device positioned adjacent to a circuit board to absorb and distribute heat away from critical components. The heat spreader device is thermally coupled to the circuit board, ensuring efficient heat transfer. To enhance thermal conductivity and fill any gaps between the circuit board and the heat spreader, a gap-filler material is deployed. This material compensates for irregularities in the surface of the circuit board or the heat spreader, ensuring optimal thermal contact and minimizing air pockets that could reduce cooling efficiency. The gap-filler material may be a thermally conductive adhesive, paste, or pad, selected based on the specific thermal and mechanical requirements of the system. This design improves heat dissipation, reduces thermal resistance, and extends the lifespan of electronic components by maintaining lower operating temperatures. The apparatus is particularly useful in applications where space constraints or high heat loads necessitate efficient cooling solutions.
3. The circuit board cooling apparatus of claim 1, the heat spreader device having a U-shaped cross section to cover both sides of the circuit board.
A circuit board cooling apparatus is designed to address thermal management challenges in electronic devices, particularly for circuit boards generating significant heat. The apparatus includes a heat spreader device with a U-shaped cross-section, allowing it to cover both sides of the circuit board simultaneously. This configuration enhances heat dissipation by increasing the surface area in contact with the board, improving thermal conductivity and reducing localized hotspots. The heat spreader may be made from materials with high thermal conductivity, such as metals or composites, to efficiently transfer heat away from critical components. The U-shaped design also provides structural support, helping to maintain the circuit board's stability while dissipating heat. The apparatus may further include additional cooling elements, such as heat pipes or fins, to further enhance cooling performance. This design is particularly useful in high-performance computing, telecommunications, and other applications where compact, efficient cooling is required. The apparatus ensures reliable operation by preventing overheating, which can degrade performance or cause component failure.
4. The circuit board cooling apparatus of claim 1, the heat spreader device having two side-plates coupled with a cross member to create a single heat spreader device to cover both sides of the circuit board.
A circuit board cooling apparatus is designed to address thermal management challenges in electronic devices, particularly for circuit boards generating significant heat. The apparatus includes a heat spreader device that enhances heat dissipation by covering both sides of the circuit board. The heat spreader device consists of two side-plates connected by a cross member, forming a unified structure that spans the entire width of the circuit board. This dual-sided design ensures efficient heat transfer from both the top and bottom surfaces of the circuit board, improving overall cooling performance. The side-plates and cross member are thermally conductive materials, such as metal or composite materials, to facilitate rapid heat dissipation. The apparatus may also include additional cooling elements, such as heat pipes or fins, integrated with the heat spreader to further enhance thermal conductivity. The unified structure of the heat spreader ensures uniform heat distribution and minimizes thermal hotspots, which is critical for maintaining the reliability and performance of high-power electronic components. This design is particularly useful in applications where space constraints limit the use of traditional cooling methods, such as fans or liquid cooling systems.
5. The circuit board cooling apparatus of claim 1, the conforming heat transfer device having a single elastic edge to conform to the surface contour of the heat spreader device.
A circuit board cooling apparatus is designed to address thermal management challenges in electronic devices, particularly where heat spreaders are used to dissipate heat from high-power components. The apparatus includes a conforming heat transfer device that directly interfaces with a heat spreader to enhance cooling efficiency. The heat transfer device features a single elastic edge that allows it to adapt to the surface contour of the heat spreader, ensuring optimal thermal contact regardless of surface irregularities. This elastic edge ensures a tight, uniform fit, minimizing air gaps that could reduce heat transfer efficiency. The apparatus may also include a mounting mechanism to secure the heat transfer device to the circuit board, ensuring stability and consistent thermal performance. The elastic edge design simplifies installation and improves adaptability across different heat spreader geometries, making the cooling solution more versatile for various electronic applications. The overall system aims to improve heat dissipation, reduce component temperatures, and enhance device reliability.
6. The circuit board cooling apparatus of claim 1, the heat transfer device being made of one of a metal layer and heat-conducting plastic.
A circuit board cooling apparatus is designed to address overheating in electronic devices, particularly in densely packed circuit boards where traditional cooling methods are insufficient. The apparatus includes a heat transfer device that efficiently dissipates heat away from critical components. This heat transfer device is constructed from either a metal layer or a heat-conducting plastic, both of which provide high thermal conductivity to effectively transfer heat from the circuit board to a cooler environment. The apparatus may also include a mounting mechanism to securely attach the heat transfer device to the circuit board, ensuring optimal thermal contact. Additionally, the apparatus may incorporate a heat sink or other cooling elements to further enhance heat dissipation. The use of metal or heat-conducting plastic ensures durability and efficient heat transfer, making the apparatus suitable for high-performance electronic applications where thermal management is critical. The design aims to improve the reliability and lifespan of electronic devices by maintaining safe operating temperatures.
7. The circuit board cooling apparatus of claim 1, the heat transfer device being wrapped around and physically attached to the heat transport device.
A circuit board cooling apparatus is designed to address thermal management challenges in electronic systems, particularly for high-density circuit boards where traditional cooling methods are insufficient. The apparatus includes a heat transfer device that is wrapped around and physically attached to a heat transport device. The heat transfer device is configured to absorb heat generated by the circuit board and transfer it to the heat transport device, which then distributes the heat away from the board. The heat transfer device may include a flexible material, such as a thermally conductive adhesive or a heat pipe, that conforms to the shape of the heat transport device to ensure efficient thermal contact. The heat transport device may be a heat sink, a liquid cooling loop, or another thermal management component that facilitates heat dissipation. The physical attachment ensures a secure and stable connection, preventing detachment during operation or environmental stress. This design enhances cooling efficiency by minimizing thermal resistance between the heat transfer and transport devices, improving overall system reliability and performance. The apparatus is particularly useful in applications where space constraints or high heat loads necessitate advanced cooling solutions.
8. The circuit board cooling apparatus of claim 1, wherein the heat transport device is a heat pipe.
A circuit board cooling apparatus is designed to address overheating in electronic devices, particularly in high-density circuit boards where traditional cooling methods are insufficient. The apparatus includes a heat transport device that efficiently transfers heat away from critical components to a heat dissipation area. In this specific configuration, the heat transport device is a heat pipe, which utilizes phase-change cooling to move heat through evaporation and condensation processes. The heat pipe consists of a sealed tube containing a working fluid that absorbs heat at the evaporator section near the heat source, vaporizes, and then condenses at the condenser section, releasing the heat to a heat sink or other cooling mechanism. This passive cooling solution is highly effective for applications requiring reliable and compact thermal management, such as servers, telecommunications equipment, and high-performance computing systems. The use of a heat pipe ensures rapid heat transfer with minimal energy consumption, making it ideal for environments where active cooling methods are impractical or inefficient. The apparatus may also include additional features such as thermal interface materials to enhance heat transfer between the circuit board and the heat pipe, as well as structural elements to secure the components in place. This design improves the overall reliability and performance of electronic devices by maintaining optimal operating temperatures.
10. The cooling assembly of claim 9, the first and the second plurality of memory modules being dual inline memory modules (DIMM).
The invention relates to a cooling assembly for electronic devices, specifically addressing the challenge of efficiently cooling memory modules in computing systems. The cooling assembly is designed to manage heat dissipation for multiple memory modules, particularly dual inline memory modules (DIMMs), which are commonly used in servers and high-performance computing systems. The assembly includes a first and a second plurality of DIMMs, where each DIMM is a type of memory module that connects to a motherboard using a dual-row configuration. The cooling assembly ensures optimal thermal management by maintaining proper airflow and heat transfer across these DIMMs, preventing overheating and ensuring reliable performance. The design may incorporate heat sinks, fans, or other cooling mechanisms to dissipate heat generated by the DIMMs during operation. The assembly is particularly useful in environments where high-density memory configurations are required, such as data centers or high-performance computing clusters, where thermal management is critical to system stability and longevity. The cooling assembly may also include structural features to support the DIMMs and facilitate their installation and removal, ensuring ease of maintenance and scalability. By addressing the thermal challenges associated with DIMM-based memory systems, the invention enhances the overall efficiency and reliability of computing systems.
11. The cooling assembly of claim 9, the respective heat spreader device having a U-shaped cross section.
A cooling assembly for electronic devices includes a heat spreader device with a U-shaped cross section, designed to enhance thermal dissipation. The heat spreader is configured to interface with a heat-generating component, such as a semiconductor chip, to efficiently transfer and distribute heat away from the component. The U-shaped cross section provides an increased surface area for heat dissipation, improving cooling performance. The assembly may also include a heat sink or other cooling elements that work in conjunction with the heat spreader to further enhance thermal management. The design is particularly useful in high-performance computing and electronics where effective heat dissipation is critical to maintaining optimal operating temperatures and preventing thermal throttling. The U-shaped configuration allows for better airflow or contact with cooling fluids, depending on the application, ensuring efficient heat transfer from the heat source to the surrounding environment. This cooling assembly is suitable for integration into various electronic systems, including servers, data centers, and consumer electronics, where thermal management is a key concern.
12. The cooling assembly of claim 9, the respective heat spreader device having two side-plates joint by a cross member.
A cooling assembly for electronic devices addresses the challenge of efficiently dissipating heat from high-performance components. The assembly includes a heat spreader device designed to evenly distribute heat across its surface, enhancing thermal management. The heat spreader device features two side-plates connected by a cross member, forming a rigid structure that improves heat conduction and structural stability. The side-plates are positioned to maximize contact with heat-generating components, while the cross member reinforces the assembly and facilitates uniform heat distribution. This design ensures effective heat transfer from the electronic components to the cooling medium, such as air or liquid, improving overall system reliability and performance. The assembly may also incorporate additional features like fins or channels to further enhance cooling efficiency. The integration of the side-plates and cross member optimizes both thermal conductivity and mechanical strength, making the cooling assembly suitable for demanding applications in computing, telecommunications, and industrial electronics.
13. The cooling assembly of claim 9, the respective single-sided conforming heat transfer device including a plurality of elastic tabs.
A cooling assembly is designed for thermal management in electronic devices, particularly for components with irregular or uneven surfaces. The assembly addresses the challenge of achieving efficient heat dissipation from such surfaces, which often have gaps or non-uniform geometries that hinder traditional cooling methods. The assembly includes a heat transfer device that conforms to the surface of the component, ensuring direct and uniform contact for optimal heat transfer. This device is single-sided, meaning it only contacts one side of the component, and features a plurality of elastic tabs. The elastic tabs enhance conformability by flexing to accommodate surface irregularities, ensuring consistent thermal contact even when the component surface is uneven. The tabs may be distributed across the heat transfer device to provide localized compliance, improving heat transfer efficiency. The assembly may also include additional components, such as a heat sink or cooling fluid, to further enhance thermal performance. The overall design ensures reliable cooling for components with complex geometries, improving device performance and longevity.
14. The cooling assembly of claim 9, one of a gap pad, a conductive paste, and a 3-D printed heat-conductive plastic to be deployed as a gap-filler material between the heat spreader device and the memory modules.
The invention relates to a cooling assembly for electronic devices, specifically addressing thermal management challenges in systems where memory modules generate heat that must be efficiently dissipated to maintain performance and reliability. The cooling assembly includes a heat spreader device designed to transfer heat away from the memory modules. To enhance thermal conductivity between the heat spreader and the memory modules, a gap-filler material is used. This material can be a gap pad, a conductive paste, or a 3-D printed heat-conductive plastic. The gap-filler material fills any air gaps between the heat spreader and the memory modules, ensuring optimal thermal contact and minimizing heat resistance. The heat spreader device may be a heat sink, a vapor chamber, or a liquid cooling plate, depending on the cooling requirements. The cooling assembly is particularly useful in high-performance computing environments where memory modules operate at high temperatures and require efficient cooling to prevent overheating and potential failure. The use of different gap-filler materials allows for flexibility in design and application, accommodating various thermal interface requirements and manufacturing constraints.
15. The cooling assembly of claim 9, the respective conforming heat transfer device being physically attached to the heat transport device by one of a spot-weld, a solder, and conductive adhesive.
A cooling assembly is designed to manage heat dissipation in electronic or mechanical systems where efficient thermal transfer is critical. The assembly includes a heat transport device, such as a heat pipe or vapor chamber, which absorbs and redistributes heat from a heat source. Attached to this device are conforming heat transfer devices, such as heat sinks or fins, which further dissipate the heat into the surrounding environment. The key innovation lies in the method of attaching these conforming heat transfer devices to the heat transport device. The attachment is achieved using one of three techniques: spot-welding, soldering, or conductive adhesive. Spot-welding provides a strong, localized bond, while soldering ensures a durable, thermally conductive connection. Conductive adhesive offers flexibility and ease of application while maintaining thermal conductivity. These attachment methods enhance the structural integrity and thermal efficiency of the cooling assembly, ensuring reliable heat transfer and preventing detachment under thermal stress or mechanical vibration. The assembly is particularly useful in high-performance computing, automotive electronics, and industrial machinery where thermal management is essential for performance and longevity.
17. The cooling assembly of claim 16, each pair of the plurality of memory modules having one memory module from the first memory board and another one memory module from the second memory board.
This invention relates to a cooling assembly for electronic systems, specifically addressing thermal management in high-density computing environments where multiple memory modules generate significant heat. The assembly includes a plurality of memory modules arranged in pairs, where each pair consists of one memory module from a first memory board and another memory module from a second memory board. The cooling assembly is designed to efficiently dissipate heat from these modules, ensuring optimal performance and reliability. The arrangement of memory modules in pairs from different boards facilitates uniform cooling distribution, preventing localized overheating. The cooling assembly may incorporate active or passive cooling mechanisms, such as heat sinks, fans, or liquid cooling systems, to maintain safe operating temperatures. The invention is particularly useful in data centers, servers, and other high-performance computing applications where thermal management is critical. By pairing memory modules from different boards, the cooling assembly ensures balanced heat dissipation, reducing the risk of thermal throttling and extending the lifespan of the components. The design also allows for modular scalability, accommodating additional memory modules as needed while maintaining effective cooling performance.
18. The cooling assembly of claim 16, each memory module being cooled by four cooling apparatuses.
A cooling assembly is designed for electronic systems, particularly for cooling memory modules in high-performance computing environments. The assembly addresses the challenge of efficiently dissipating heat from densely packed memory modules to prevent thermal throttling and ensure reliable operation. The system includes multiple cooling apparatuses strategically positioned to target specific areas of each memory module. Each memory module is cooled by four distinct cooling apparatuses, which may include heat sinks, fans, or liquid cooling components. These apparatuses are arranged to provide uniform cooling across the module's surface, minimizing hot spots and maintaining optimal operating temperatures. The cooling apparatuses may be adjustable or modular, allowing for customization based on thermal load variations. The assembly may also incorporate sensors to monitor temperature in real-time and dynamically adjust cooling performance. This design ensures consistent thermal management, extending the lifespan of memory modules and improving overall system performance. The cooling apparatuses may be interconnected or independently controlled, depending on the system's requirements. The assembly is particularly useful in data centers, servers, and other high-density computing environments where thermal management is critical.
19. The cooling assembly of claim 16, the double-sided conforming heat transfer device having two sets of elastic tabs.
A cooling assembly for electronic devices includes a double-sided conforming heat transfer device designed to efficiently dissipate heat from multiple heat sources. The heat transfer device is flexible and can conform to the contours of the electronic components it contacts, ensuring optimal thermal contact. The device features two sets of elastic tabs that enhance its ability to securely attach to and maintain contact with the heat-generating components. These tabs provide mechanical stability and ensure consistent thermal conductivity, even under varying operational conditions. The cooling assembly may also include a heat sink or other cooling elements to further enhance heat dissipation. The elastic tabs are designed to accommodate slight movements or expansions of the components without losing contact, ensuring reliable cooling performance over time. This design is particularly useful in applications where space is limited or where components have irregular shapes, as the conforming nature of the heat transfer device allows for effective heat management in constrained environments. The assembly may be used in consumer electronics, industrial equipment, or other devices where thermal management is critical.
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August 23, 2019
April 30, 2024
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