A stacked semiconductor device includes a cooling structure to increase the cooling efficiency of the stacked semiconductor device. The cooling structure includes various types of cooling components integrated into the stacked semiconductor device that are configured to remove and/or dissipate heat from dies of the stacked semiconductor device. In this way, the cooling structure reduces device failures and permits the stacked semiconductor device to operate at greater voltages, greater speeds, and/or other increased performance parameters by removing and/or dissipating heat from the stacked semiconductor device.
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18. The method of claim 17, wherein the fourth horizontal heat removal structure is formed to connect to the second plurality of vertical heat dissipation structures.
A method for enhancing heat dissipation in electronic devices involves forming a fourth horizontal heat removal structure that connects to a second set of vertical heat dissipation structures. This method is part of a broader approach to managing heat in high-performance systems, where multiple horizontal and vertical heat removal elements work together to efficiently transfer heat away from critical components. The vertical structures, typically fins or heat pipes, extend perpendicularly from a base or substrate, while the horizontal structures distribute heat laterally. By connecting the fourth horizontal structure to the second set of vertical structures, the method ensures that heat is effectively channeled from the horizontal plane into the vertical plane, improving overall thermal performance. This design is particularly useful in densely packed electronic systems where traditional cooling methods may be insufficient. The interconnected network of horizontal and vertical heat removal elements allows for more uniform heat distribution and reduces hotspots, thereby enhancing device reliability and longevity. The method may be applied in various applications, including data centers, high-performance computing, and power electronics, where efficient thermal management is critical.
20. The method of claim 13, wherein the third horizontal heat removal structure is formed to connect to the plurality of vertical heat dissipation structures.
This invention relates to thermal management systems for electronic devices, specifically addressing the challenge of efficiently dissipating heat from high-density components. The system includes a plurality of vertical heat dissipation structures, such as fins or heat pipes, arranged to conduct heat away from a heat source. A third horizontal heat removal structure is integrated to connect directly to these vertical structures, enhancing heat transfer by providing an additional pathway for heat dissipation. This horizontal structure may be a heat spreader, a liquid cooling channel, or another conductive element that redistributes heat laterally before it is further dissipated by the vertical structures. The design ensures improved thermal performance by increasing the surface area for heat exchange and reducing thermal resistance between components. The interconnected system allows for more uniform cooling across the device, preventing localized hotspots and extending the operational lifespan of the electronics. The invention is particularly useful in applications where space constraints limit traditional cooling methods, such as in compact computing systems, power electronics, or high-performance data centers.
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June 29, 2021
May 14, 2024
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