A semiconductor package includes a first heat dissipation plate, a second heat dissipation plate, a plurality of heat generating assemblies, and a plurality of fixture components. The first heat dissipation plate has a first upper surface and a first lower surface. The first heat dissipation plate includes first through holes extended from the first upper surface to the first lower surface. The second heat dissipation plate has a second upper surface and a second lower surface. The second heat dissipation plate includes second through holes extended from the second upper surface to the second lower surface. The heat generating assemblies are disposed between the first heat dissipation plate and the second heat dissipation plate. The fixture components include fix screws and nuts. The fix screws penetrate through the first heat dissipation plate and the second heat dissipation plate along the first through holes and the second through holes.
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2. The semiconductor package as claimed in claim 1, further comprising a back plate, disposed below the first lower surface, wherein the first heat dissipation plate is disposed between the heat generating assembly and the back plate, and the thread portions respectively penetrate through the back plate and nuts.
The semiconductor package is designed to enhance heat dissipation and structural integrity in electronic devices. The package includes a heat generating assembly, such as a semiconductor chip, mounted on a first heat dissipation plate. The first heat dissipation plate is positioned between the heat generating assembly and a back plate, which provides additional structural support and heat spreading. The back plate is located below the first lower surface of the heat dissipation plate. The package also includes thread portions that penetrate through the back plate and are secured with nuts, ensuring mechanical stability and efficient heat transfer. The arrangement allows for improved thermal management by distributing heat away from the heat-generating components while maintaining structural rigidity. This design is particularly useful in high-performance electronic applications where thermal and mechanical reliability are critical. The back plate and thread portions work together to reinforce the package, preventing deformation and ensuring long-term durability under thermal and mechanical stress. The overall structure facilitates efficient heat dissipation while maintaining a compact and robust form factor.
3. The semiconductor package as claimed in claim 2, wherein the nuts are respectively pressed against the back plate to fasten the back plate and first heat dissipation plate to the heat generating assemblies.
This invention relates to semiconductor packaging, specifically addressing thermal management and structural integrity in electronic devices. The technology involves a semiconductor package with a back plate and a first heat dissipation plate that are fastened to heat-generating assemblies, such as integrated circuits or power modules, using nuts. The nuts are pressed against the back plate to securely attach both the back plate and the first heat dissipation plate to the heat-generating assemblies. This design ensures efficient heat dissipation while maintaining mechanical stability. The back plate and heat dissipation plate work together to spread and transfer heat away from the heat-generating components, preventing overheating and improving device reliability. The fastening mechanism using nuts provides a robust connection, ensuring the components remain securely in place under thermal and mechanical stress. This approach is particularly useful in high-performance computing, power electronics, and other applications where thermal management is critical. The invention improves upon existing solutions by combining structural fastening with thermal dissipation in a compact and efficient manner.
4. The semiconductor package as claimed in claim 2, further comprising a plurality of stop screws penetrating through the back plate to press against the first lower surface of the first heat dissipation plate.
A semiconductor package includes a heat dissipation structure with a first heat dissipation plate having a first lower surface and a second heat dissipation plate with a second lower surface. The first heat dissipation plate is positioned above the second heat dissipation plate, and the second lower surface is in contact with a semiconductor device. The package also includes a back plate positioned below the second heat dissipation plate, with the semiconductor device sandwiched between the second lower surface and the back plate. The back plate has a plurality of stop screws that penetrate through it to press against the first lower surface of the first heat dissipation plate. This configuration ensures mechanical stability and efficient heat dissipation by maintaining contact between the heat dissipation plates and the semiconductor device. The stop screws prevent excessive movement or misalignment of the components, enhancing the structural integrity of the package while facilitating thermal management. The design is particularly useful in high-performance semiconductor applications where reliable heat dissipation and mechanical stability are critical.
5. The semiconductor package as claimed in claim 4, wherein the first heat dissipation plate is a flexible plate configured to be deformed through being pressed by the stop screws and the fixture components.
The semiconductor package is designed to improve heat dissipation in electronic devices, particularly where rigid heat sinks are impractical due to space constraints or mechanical interference. The package includes a flexible heat dissipation plate that can conform to irregular surfaces or adapt to assembly tolerances. This plate is made of a deformable material that allows it to bend or flex when pressed by stop screws and fixture components during installation. The flexibility ensures consistent thermal contact with the semiconductor device, even if the mounting surface is uneven or if the package undergoes mechanical stress. The plate may be coupled to a rigid heat spreader or directly attached to the semiconductor die, enhancing heat transfer efficiency. The deformable nature of the plate also reduces the risk of damage to the semiconductor or surrounding components during assembly, as it can absorb minor misalignments or pressure variations. This design is particularly useful in compact or high-performance electronic systems where traditional rigid heat sinks would be ineffective or cause mechanical conflicts.
6. The semiconductor package as claimed in claim 1, wherein a diameter of the fix screws disposed at a periphery of the semiconductor package is greater than a diameter of the fix screws disposed at a central area of the semiconductor package.
This invention relates to semiconductor packaging, specifically addressing the structural integrity and thermal management of semiconductor packages during assembly and operation. The problem being solved involves ensuring proper alignment, stability, and heat dissipation in semiconductor packages, particularly when subjected to mechanical stress or thermal expansion. The invention describes a semiconductor package with a differential screw design, where the diameter of fixation screws varies based on their location within the package. Screws positioned at the periphery of the package have a larger diameter compared to those in the central area. This design enhances structural reinforcement at the edges, where stress concentrations are typically higher, while maintaining flexibility in the central region to accommodate thermal expansion and contraction. The package may also include a base plate, a heat sink, and other components that contribute to thermal and mechanical stability. The differential screw sizing optimizes load distribution, reduces warpage, and improves overall reliability during manufacturing and operation. This approach is particularly useful in high-performance semiconductor applications where thermal cycling and mechanical stress are significant factors.
7. The semiconductor package as claimed in claim 1, wherein the first heat dissipation plate further comprises first lug bosses, and each of the first lug bosses is protruded from the first upper surface.
A semiconductor package includes a heat dissipation structure designed to improve thermal management in electronic devices. The package features a first heat dissipation plate with a first upper surface that includes protruding first lug bosses. These lug bosses enhance heat dissipation by increasing the surface area available for heat transfer. The first heat dissipation plate is part of a larger assembly that may include additional components, such as a second heat dissipation plate, to further optimize thermal performance. The lug bosses are strategically positioned to maximize heat dissipation efficiency while maintaining structural integrity. This design is particularly useful in high-performance semiconductor applications where effective heat management is critical to device reliability and longevity. The protruding lug bosses ensure better contact with cooling elements, such as heat sinks or fans, further improving thermal conductivity. The overall structure is engineered to dissipate heat more efficiently, reducing the risk of overheating and extending the operational lifespan of the semiconductor package.
8. The semiconductor package as claimed in claim 7, wherein gap heights between the heat generating assemblies and the first lug bosses are respectively different from each other.
This invention relates to semiconductor packaging, specifically addressing thermal management in packages with multiple heat-generating components. The problem solved is uneven heat dissipation, which can lead to thermal hotspots and reduced performance or reliability. The package includes a base with multiple lug bosses, each supporting a heat-generating assembly. The key innovation is that the gap heights between each heat-generating assembly and its corresponding lug boss are intentionally varied. This allows for customized thermal management, where components with higher heat output can have larger gaps to improve airflow or heat transfer, while others may have smaller gaps for structural stability. The base may also include a heat sink or cooling channels to further enhance thermal performance. The design ensures that each heat-generating assembly operates within optimal temperature ranges, improving overall system efficiency and longevity. The varying gap heights are achieved through precise manufacturing techniques, ensuring consistent performance across different semiconductor packages. This approach is particularly useful in high-performance computing, power electronics, and other applications where thermal management is critical.
9. The semiconductor package as claimed in claim 7, wherein each of the first lug bosses is disposed between the voltage regulator module and the first upper surface.
The invention relates to semiconductor packaging, specifically addressing the challenge of efficiently integrating voltage regulation components within a compact semiconductor package while maintaining thermal management and structural integrity. The package includes a voltage regulator module mounted on a substrate, with a first upper surface positioned above the module. The package further comprises first lug bosses that are strategically placed between the voltage regulator module and the first upper surface. These lug bosses serve as mechanical support structures, ensuring stability and proper alignment of the voltage regulator module within the package. Additionally, the lug bosses may facilitate heat dissipation by providing thermal pathways or mounting points for heat sinks. The arrangement optimizes space utilization while maintaining electrical and thermal performance, particularly in high-power or high-density semiconductor applications. The design ensures reliable operation by preventing mechanical stress on the voltage regulator module and enhancing thermal conductivity. This configuration is particularly useful in applications requiring compact, high-performance semiconductor packages with integrated voltage regulation.
10. The semiconductor package as claimed in claim 1, wherein the second heat dissipation plate further comprises second lug bosses, and each of the second lug bosses is protruded from the second lower surface.
The semiconductor package is designed to improve heat dissipation in electronic devices, particularly for high-power semiconductor components. Traditional semiconductor packages often suffer from inadequate heat dissipation, leading to overheating and reduced performance. This invention addresses the problem by incorporating an enhanced heat dissipation structure. The semiconductor package includes a first heat dissipation plate with first lug bosses protruding from its lower surface, and a second heat dissipation plate with second lug bosses protruding from its lower surface. The first and second heat dissipation plates are positioned on opposite sides of a semiconductor component, ensuring efficient heat transfer from both the top and bottom surfaces of the component. The lug bosses on both plates increase the surface area for heat dissipation, improving thermal performance. The second heat dissipation plate's second lug bosses are specifically designed to protrude from its lower surface, further enhancing heat dissipation by creating additional contact points and airflow channels. This dual-plate design with protruding lug bosses ensures better heat spreading and cooling efficiency, making the package suitable for high-performance applications.
11. The semiconductor package as claimed in claim 10, wherein each of the second lug bosses is disposed between the semiconductor die and the second lower surface.
A semiconductor package is designed to improve thermal management and structural integrity in electronic devices. The package includes a base with an upper surface supporting a semiconductor die and a lower surface with multiple lug bosses for mounting. The second lug bosses, positioned between the semiconductor die and the second lower surface, enhance heat dissipation and mechanical stability. These bosses are strategically placed to optimize thermal conductivity by providing direct pathways for heat transfer from the die to the base. Additionally, they reinforce the package structure, reducing stress concentrations during operation. The design ensures efficient cooling while maintaining robust physical connections, addressing challenges in high-performance semiconductor applications where thermal and mechanical reliability are critical. The package may also include additional features such as conductive layers, insulation, and electrical interconnects to support functionality. The second lug bosses contribute to both thermal and structural performance, making the package suitable for demanding environments.
13. The semiconductor package as claimed in claim 12, further comprising a back plate, disposed below the first lower surface, wherein the first heat dissipation plate is disposed between the heat generating assembly and the back plate, and the thread portions respectively penetrate through the back plate and nuts.
The semiconductor package is designed to improve heat dissipation in electronic devices, particularly those with high-power components. The package includes a heat-generating assembly, such as a semiconductor chip, mounted on a first heat dissipation plate. The first heat dissipation plate is positioned between the heat-generating assembly and a back plate, which provides structural support and additional heat spreading. The package also includes a second heat dissipation plate, which may be stacked or arranged adjacent to the first plate, depending on the configuration. The heat dissipation plates are connected to the heat-generating assembly and the back plate using threaded fasteners, such as screws or bolts, which pass through the back plate and are secured with nuts. This design ensures efficient heat transfer from the heat-generating assembly to the dissipation plates and the back plate, while maintaining mechanical stability. The threaded connections allow for modular assembly and disassembly, facilitating maintenance and repair. The back plate may also serve as a mounting interface for the entire package, enabling integration into larger systems. The overall structure is optimized for thermal performance, reliability, and ease of manufacturing.
14. The semiconductor package as claimed in claim 13, wherein the nuts are respectively pressed against the back plate to fasten the back plate and first heat dissipation plate to the heat generating assemblies.
The semiconductor package relates to thermal management in electronic devices, specifically addressing the challenge of efficiently dissipating heat from heat-generating assemblies such as integrated circuits or power modules. The package includes a back plate and a first heat dissipation plate, which are secured to the heat-generating assemblies using nuts. These nuts are pressed against the back plate to ensure a tight and stable connection, enhancing thermal conductivity between the components. The back plate and first heat dissipation plate work together to spread and transfer heat away from the heat-generating assemblies, preventing overheating and improving device performance. The design ensures mechanical stability while maintaining optimal thermal contact, making it suitable for high-power applications where reliable heat dissipation is critical. The use of nuts provides a secure fastening mechanism that can withstand thermal expansion and contraction, ensuring long-term reliability. This approach is particularly useful in semiconductor packages where efficient heat management is essential for maintaining operational efficiency and longevity.
16. The semiconductor package as claimed in claim 15, further comprising a back plate, disposed below the first lower surface, wherein the first heat dissipation plate is disposed between the heat generating assembly and the back plate, and the thread portions respectively penetrate through the back plate and nuts.
The semiconductor package is designed to improve heat dissipation and structural integrity in electronic devices. The package includes a heat generating assembly, such as a semiconductor chip, mounted on a first heat dissipation plate. The first heat dissipation plate is thermally coupled to the heat generating assembly to dissipate heat generated during operation. The package also includes a second heat dissipation plate, which may be stacked or arranged adjacent to the first heat dissipation plate to further enhance heat dissipation. The heat dissipation plates may be connected to the heat generating assembly using a thermally conductive adhesive or other bonding method to ensure efficient heat transfer. To secure the components, the package includes a back plate positioned below the first heat dissipation plate. The first heat dissipation plate is sandwiched between the heat generating assembly and the back plate. Threaded fasteners, such as screws or bolts, penetrate through the back plate and are secured with nuts to provide mechanical stability and ensure proper alignment of the components. This design helps maintain thermal contact between the heat generating assembly and the heat dissipation plates while preventing misalignment or detachment during operation. The back plate may also serve as an additional heat dissipation surface or structural support. The overall structure is optimized for high-performance applications where efficient heat dissipation and mechanical robustness are critical.
17. The semiconductor package as claimed in claim 16, further comprising a plurality of stop screws penetrating through the back plate to press against the first lower surface of the first heat dissipation plate.
A semiconductor package includes a heat dissipation structure with a first heat dissipation plate having a first lower surface and a second heat dissipation plate with a second lower surface. The first and second heat dissipation plates are thermally coupled to a semiconductor device. A back plate is attached to the second lower surface of the second heat dissipation plate. The package further includes a plurality of stop screws that penetrate through the back plate and press against the first lower surface of the first heat dissipation plate. This configuration enhances mechanical stability and thermal conductivity by ensuring proper contact between the heat dissipation plates and the semiconductor device. The stop screws provide additional structural support, preventing misalignment or detachment of the heat dissipation plates during operation. The design is particularly useful in high-power semiconductor applications where efficient heat dissipation and mechanical robustness are critical. The stop screws help maintain consistent thermal performance by ensuring uniform pressure distribution across the heat dissipation plates. This invention addresses the challenge of balancing thermal management and structural integrity in semiconductor packaging, particularly in environments with high thermal loads or mechanical stress.
18. The semiconductor package as claimed in claim 17, wherein the first heat dissipation plate is a flexible plate configured to be deformed through being pressed by the stop screws and the fixture components.
A semiconductor package includes a flexible heat dissipation plate designed to improve thermal management in electronic devices. The package addresses the challenge of efficiently dissipating heat generated by semiconductor components, which can degrade performance and reliability if not properly managed. The flexible heat dissipation plate is configured to deform when pressed by stop screws and fixture components, allowing it to conform to the surface of the semiconductor device or other components. This adaptability ensures better thermal contact, enhancing heat transfer efficiency. The plate may be made from materials such as copper, aluminum, or other thermally conductive metals, and its flexibility allows it to accommodate variations in component height or surface irregularities. The deformation under pressure ensures consistent contact, reducing thermal resistance and improving overall cooling performance. This design is particularly useful in high-power applications where effective heat dissipation is critical. The package may also include additional features, such as mounting mechanisms or insulation layers, to further optimize thermal and mechanical performance. The flexible nature of the plate allows for easier assembly and adjustment, making it suitable for various semiconductor packaging configurations.
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August 30, 2021
May 28, 2024
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