A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.
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1. An apparatus, comprising: at least one heated section of a plurality of heat pipes, wherein the at least one heated section of the plurality of heat pipes is coupled to a thermal conducting base; a first heat dissipating section coupled to at least one heat pipe of the plurality of heat pipes, wherein the first heat dissipating section extends transversally outward from a lateral side of the thermal conducting base; a second heat dissipating section coupled to the at least one heat pipe of the plurality of heat pipes and at least one other heat pipe of the plurality of heat pipes, wherein the second heat dissipating section extends vertically outward from the thermal conducting base; and a third heat dissipating section coupled to the at least one other heat pipe, wherein the third heat dissipating section extends vertically outward from the thermal conducting base, and wherein the first heat dissipating section, the second heat dissipating section and the third heat dissipating section are situated at a position higher than the at least one heated section.
The apparatus includes a thermally conductive base that connects to multiple heat pipes. Each heat pipe has a heated section attached to the base and a heat dissipating section. One heat dissipating section extends horizontally from the side of the base (laterally). Additional heat dissipating sections extend vertically from the top of the base. Crucially, all heat dissipating sections are positioned higher than the heated sections on the base. The lateral heat dissipating section is coupled to at least one heat pipe, while the vertical sections are coupled to at least one other heat pipe.
2. The apparatus of claim 1 , wherein the plurality of heat pipes comprise two or more differently shaped heat pipes.
The apparatus described in the previous heat dissipation description utilizes heat pipes with different shapes within the collection of heat pipes attached to the thermally conductive base. The shapes are predetermined and may vary for each heat pipe.
3. The apparatus of claim 1 , wherein the at least one other heat pipe of the plurality of heat pipes includes two heat pipes formed as U-shaped heat pipes with a containing space defined between the two heat pipes, wherein a fan is installed in the containing space.
This invention relates to a cooling apparatus for electronic devices, specifically a system using multiple heat pipes to dissipate heat efficiently. The apparatus includes a primary heat pipe thermally connected to a heat source, such as a processor, and at least one additional heat pipe that enhances cooling performance. The additional heat pipes are arranged in a U-shaped configuration, forming an enclosed space between them. A fan is installed within this space to actively circulate air, improving heat dissipation. The U-shaped design allows the fan to be positioned close to the heat pipes, optimizing airflow and cooling efficiency. The apparatus is designed to address the challenge of effectively removing heat from high-performance electronic components, where passive cooling alone may be insufficient. By combining multiple heat pipes with active airflow, the system provides a more robust cooling solution compared to traditional single-pipe or fan-only designs. The invention is particularly useful in compact electronic devices where space constraints limit cooling options.
4. The apparatus of claim 3 , further comprising a hood installed and covered onto the fan.
The apparatus featuring U-shaped heat pipes with a fan installed in the space between them, as described in the previous heat dissipation description, further includes a hood installed over the fan to direct airflow.
5. The apparatus of claim 1 , wherein a fan is installed on the first heat dissipating section.
In the original apparatus design that includes a thermally conductive base attached to multiple heat pipes having heated and heat dissipating sections, where heat dissipating sections extend both laterally and vertically, a fan is installed on the lateral heat dissipating section to improve its cooling performance.
6. The apparatus of claim 5 , further comprising a hood installed and covered onto the fan.
The heat dissipating apparatus with a laterally extending heat dissipating section that has a fan installed upon it, as discussed in the previous heat dissipation description, further includes a hood to cover the fan, which likely serves to direct airflow more efficiently.
7. The apparatus of claim 3 , wherein another fan is installed on the first heat dissipating section.
This is an improvement to the apparatus which includes U-shaped heat pipes with a fan installed between them as well as a thermally conductive base attached to multiple heat pipes having heated and heat dissipating sections, where heat dissipating sections extend both laterally and vertically. In addition to the fan between the U-shaped heat pipes, a separate fan is installed on the lateral heat dissipating section.
8. The apparatus of claim 7 , further comprising a hood installed and covered onto the apparatus.
This variation of the heat dissipation apparatus with two fans (one between the U-shaped heat pipes, and one on the laterally extending heat dissipating section), as described in the previous heat dissipation description, also includes a hood covering the entire apparatus.
9. The apparatus of claim 1 , wherein the first heat dissipating section dissipates heat from the thermal conducting base and a fan coupled to the first heat dissipating section provides air to a plurality of heat sources separate from the thermal conducting base.
Building on the original heat dissipating apparatus design that features a thermally conductive base attached to multiple heat pipes having heated and heat dissipating sections, where heat dissipating sections extend both laterally and vertically, the lateral heat dissipating section not only cools the base itself, but also directs airflow (using a fan attached to the lateral section) to cool other heat sources positioned nearby, separate from the base.
10. A device, comprising: one or more first heat pipes that include a first heated section coupled onto a thermal conducting base, a first heat dissipating section extended transversally outward from the thermal conducting base and a second heat dissipating section extended vertically outward from the thermal conducting base, wherein the first heat dissipating section is positioned higher than the first heated section; and one or more second heat pipes that include a second heated section coupled onto the thermal conducting base, the second heat dissipating section extended vertically outward from the thermal conducting base and a third heat dissipating section extended vertically outward from the thermal conducting base, wherein the second heat dissipating section is positioned higher than the second heated section.
This device has a thermally conductive base connected to two kinds of heat pipes. The first type of heat pipe has a heated section on the base, a horizontal (laterally extended) heat dissipating section and a vertical heat dissipating section. The horizontal section is higher than the heated section. The second type of heat pipe has a heated section on the base and two vertical heat dissipating sections. The vertical sections are higher than the heated section.
11. The device of claim 10 , wherein the first heat dissipating section, the second heat dissipating section and the third heat dissipating section include a plurality of fins.
The heat dissipation device described in the previous heat dissipation description, which contains two types of heat pipes and a thermally conductive base, and where the first heat dissipating section extends laterally from the thermal conducting base, and the second and third heat dissipating sections extend vertically from the thermal conducting base, has fins on all heat dissipating sections (the lateral one, and the two vertical ones) to increase surface area and improve cooling.
12. The device of claim 10 , wherein the one or more first heat pipes and the one or more second heat pipes comprise different predetermined curved shapes.
The heat dissipation device that incorporates a thermally conductive base connected to two kinds of heat pipes where one type has a horizontal heat dissipation section, as discussed in the previous heat dissipation description, is further distinguished by having first and second heat pipes that are curved into different predetermined shapes.
13. The device of claim 10 , wherein the first heat dissipating section dissipates heat from the thermal conducting base and a fan coupled to the first heat dissipating section provides air to a plurality of heat sources separate from the thermal conducting base.
Using the heat dissipation device described previously, with a thermally conductive base, lateral and vertical heat pipes, a fan on the lateral heat pipe provides additional cooling to other heat sources nearby, not just cooling the thermal conducting base itself.
14. The device of claim 10 , wherein the one or more second heat pipes includes two heat pipes formed as U-shaped heat pipes with a containing space defined between the two heat pipes, wherein a fan is installed in the containing space.
The device includes U-shaped heat pipes, two of which form a containing space, and a fan resides within that space. This is an improvement upon the heat dissipation device incorporating a thermally conductive base, and heat pipes having laterally and vertically extending heat dissipating sections, as described in the previous heat dissipation description.
15. The device of claim 10 , wherein a fan is installed on the first heat dissipating section.
The device has a heat pipe with a lateral heat dissipating section, as described in the previous heat dissipation description. A fan is installed on this lateral heat dissipating section.
16. A method, comprising: dissipating heat from a first heated section coupled to a thermal conducting base to a first heat dissipating section and a second heat dissipating section via one or more first heat pipes, wherein the first heat dissipating section extends transversally outward from the thermal conducting base, the second heat dissipating section extends vertically outward from the thermal conducting base and the first heat dissipating section is located at a position higher than the first heated section; and dissipating heat from a second heated section coupled to the thermal conducting base to the second heat dissipating section and a third heat dissipating section via one or more second heat pipes, wherein the third heat dissipating section extends vertically outward from the thermal conducting base and the second heat dissipating section is located at a position higher than the second heated section.
A method of heat dissipation involves a thermally conductive base. Heat is moved from heated sections to heat dissipating sections using heat pipes. One type of heat pipe moves heat laterally, and another type moves it vertically. The lateral heat dissipating section is positioned higher than the heated section, as is the vertical section.
17. The method of claim 16 , further including dissipating heat from one or more heat sources coupled to the thermal conducting base via the one or more first heat pipes and the one or more second heat pipes.
The heat dissipation method described in the previous heat dissipation description can also draw heat from additional sources attached to the thermal conducting base, using first and second heat pipes in combination to remove heat.
18. The method of claim 16 , wherein the dissipating heat from the first heat dissipating section includes using a fan installed on the first heat dissipating section.
The heat dissipation method from the previous heat dissipation description uses a fan on the lateral heat dissipating section to improve cooling of the heat dissipated from the first heat pipe.
19. The method of claim 16 , wherein the dissipating heat from the second heat dissipating section includes using a fan installed in a containing space formed by the one or more second heat pipes.
The heat dissipation method from the previous heat dissipation description uses a fan inside a contained space formed by the second type of U-shaped heat pipes to improve cooling.
20. A system, comprising: means for dissipating heat from a first heated section coupled to a thermal conducting base to a first heat dissipating section and a second heat dissipating section via one or more first heat pipes, wherein the first heat dissipating section extends from the thermal conducting base in a horizontal direction, the second heat dissipating section extends from the thermal conducting base in a vertical direction and the first heat dissipating section is situated at a position higher than the first heated section; and means for dissipating heat from a second heated section coupled to the thermal conducting base to the second heat dissipating section and a third heat dissipating section via one or more second heat pipes, wherein the third heat dissipating section extends from the thermal conducting base in a vertical direction and the second heat dissipating section is situated at a position higher than the second heated section.
A system for heat dissipation includes a thermal base. It contains a way to move heat from the base horizontally using a first set of heat pipes, and vertically using a second set of heat pipes. The horizontal heat dissipation is situated higher than the first heated section, and the second heat dissipation is situated higher than the second heated section.
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December 30, 2008
July 30, 2013
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