A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.
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1. A peeling device configured to separate a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, the peeling device comprising: a holding unit configured to hold the superposed substrate; and a plurality of position adjustment units movable toward and away from a side surface of the superposed substrate held in the holding unit, and the plurality of position adjustment units configured to perform a position adjustment of the superposed substrate relative to the holding unit by contacting the side surface of the superposed substrate and laterally moving the superposed substrate.
A peeling device is designed to separate a superposed substrate, where a target substrate and a support substrate are bonded together with an adhesive, into the individual target and support substrates. The device includes a holding unit that secures the superposed substrate in place. Additionally, it features multiple position adjustment units that can move toward and away from the side surface of the superposed substrate. These units contact the side surface and laterally shift the substrate to adjust its position relative to the holding unit. This adjustment ensures precise alignment before peeling, which is critical for clean separation without damaging the substrates. The device addresses challenges in accurately positioning and separating bonded substrates, particularly in applications requiring high precision, such as semiconductor manufacturing or display production. The lateral movement capability of the position adjustment units allows for fine-tuning the substrate's position, enhancing the efficiency and reliability of the peeling process.
2. The peeling device of claim 1 , wherein the holding unit holds the target substrate of the superposed substrate, and wherein each of the plurality of position adjustment units comes into contact with a side surface of the support substrate of the superposed substrate held in the holding unit to perform the position adjustment of the superposed substrate.
The peeling device separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. The holder specifically grips the target substrate. The position adjusters specifically contact the side of the support substrate to perform the alignment.
3. The peeling device of claim 1 , wherein a plurality of holes configured to eject a gas is formed on a surface of the holding unit.
The peeling device separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. The holder has tiny holes that eject gas to float the layered material slightly above the holder surface.
4. The peeling device of claim 1 , wherein the superposed substrate is disposed inside an annular frame and held by a tape attached to a back side of the annular frame and a non joint surface of the target substrate.
The peeling device separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. The layered material sits inside a frame. Tape on the frame's back and the target's backside secures the layered material to the frame.
5. The peeling device of claim 4 , wherein each of the plurality of position adjustment units is movable such that it comes into contact with the side surface of the superposed substrate without contacting the annular frame.
The peeling device separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. The layered material sits inside a frame. Tape on the frame's back and the target's backside secures the layered material to the frame. The position adjusters are designed to contact the layered material without touching the frame during alignment.
6. The peeling device of claim 4 , further comprising: a pressing unit configured to push the annular frame vertically downward with respect to the superposed substrate; and a peeling inducement unit configured to form a peeling initiation region in which a process of peeling off of the target substrate from the support substrate is initiated on a side surface of one end of the superposed substrate, wherein the pressing unit has a ball bearing that comes into contact with a surface of the annular frame.
The peeling device separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. The layered material sits inside a frame. Tape on the frame's back and the target's backside secures the layered material to the frame. It also has a press that pushes the frame down onto the material using a ball bearing. A blade creates an initial separation point between the target and support layers.
7. The peeling device of claim 6 , wherein the peeling inducement unit has a blade, and a movement mechanism configured to move the blade toward the side surface of the one end of the superposed substrate, and wherein the blade is attachable to or detachable from the movement mechanism.
The peeling device separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. The layered material sits inside a frame. Tape on the frame's back and the target's backside secures the layered material to the frame. It also has a press that pushes the frame down onto the material using a ball bearing. A blade creates an initial separation point between the target and support layers. The blade is mounted on a mechanism that moves it to the material's edge. The blade can be easily attached or detached.
8. The peeling device of claim 1 , further comprising: a delivery unit configured to deliver the superposed substrate between an outside of the peeling device and the holding unit; and a guide unit configured to perform a position adjustment of the superposed substrate with respect to the holding unit, and installed in the delivery unit.
The peeling device separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. A delivery system brings the layered material to the holder. The delivery system contains a guide that pre-aligns the material before placing it in the holder.
9. A peeling system including the peeling device according to claim 1 , comprising: a peeling station including the peeling device; a carry-in/carry-out station configured to carry the target substrate, the support substrate, or the superposed substrate into and out of the peeling station; and a transfer device configured to transfer at least one of the target substrate, the support substrate, and the superposed substrate between the peeling station and the carry-in/carry-out station.
A system for peeling layered materials includes a peeling device that separates a layered material (target + support) held together by adhesive. The peeling device contains a holder for the layered material, and multiple position adjusters that move in and out from the side of the held material, touching the side and nudging it sideways to precisely align the layered material within the holder. The system further includes a loading/unloading station and a robot arm or other transfer device to move materials between the station and the peeling device.
10. A peeling method of separating a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, comprising: holding the superposed substrate by a holding unit; performing a position adjustment of the superposed substrate relative to the holding unit by making a plurality of position adjustment units contacted with a side surface of the superposed substrate held by the holding unit and making the superposed substrate move in a lateral direction; and separating the superposed substrate that is subjected to the position adjustment in the holding unit into the target substrate and the support substrate.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers.
11. The peeling method of claim 10 , wherein in the holding the superposed substrate, the target substrate of the superposed substrate is held on the holding unit, and wherein in performing the position adjustment, the position adjustment of the superposed substrate is performed by making the plurality of position adjustment units contacted with a side surface of the support substrate of the superposed substrate held on the holding unit.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers. Specifically, the target layer is held, and the position adjusters touch the side of the support layer for alignment.
12. The peeling method of claim 10 , wherein in holding the superposed substrate and in performing the position adjustment, a gas is ejected from a surface of the holding unit to float the superposed substrate from the holding unit.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers. During holding and alignment, gas is ejected from the holder's surface to float the layered material slightly.
13. The peeling method of claim 10 , wherein the superposed substrate is disposed inside an annular frame and is held by a tape attached to a back side of the annular frame and a non-joint surface of the target substrate.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers. The layered material sits inside a frame. Tape on the frame's back and the target's backside secures the layered material to the frame.
14. The peeling method of claim 13 , wherein in performing the position adjustment, each of the plurality of position adjustment units moves until it comes into contact with the side surface of the superposed substrate without contacting the annular frame.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers. The layered material sits inside a frame. Tape on the frame's back and the target's backside secures the layered material to the frame. The position adjusters are designed to contact the layered material without touching the frame during alignment.
15. The peeling method of claim 13 , wherein in separating the superposed substrate, after the annular frame is vertically pushed downward with respect to the superposed substrate while a ball bearing of a pressing unit is in contact with a surface of the annular frame, a peeling initiation region in which a process of peeling off of the target substrate from the support substrate is initiated, is formed on a side surface of one end of the superposed substrate by a peeling inducement unit.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers. The layered material sits inside a frame. Tape on the frame's back and the target's backside secures the layered material to the frame. A press pushes the frame down onto the material using a ball bearing. A blade creates an initial separation point between the target and support layers.
16. The peeling method of claim 10 , further comprising: delivering the superposed substrate to the holding unit from an outside of the peeling device by a delivery unit before the holding the superposed substrate, wherein in delivering the superposed substrate, when the superposed substrate is held by the delivery unit, the position adjustment of the superposed substrate with respect to the holding unit is performed by a guide unit installed in the delivery unit.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers. A delivery system brings the layered material to the holder. The delivery system contains a guide that pre-aligns the material before placing it in the holder.
17. A peeling device configured to separate a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, the peeling device comprising: a holding unit configured to hold the superposed substrate; and a plurality of position adjustment units movable toward and away from a side surface of the superposed substrate held in the holding unit, and the plurality of position adjustment units configured to perform a position adjustment of the superposed substrate relative to the holding unit by contacting the side surface of the superposed substrate, wherein each of the plurality of position adjustment units includes an arm unit which is an elongated member and a rotational movement mechanism configured to rotate the arm unit, and wherein the arm unit has a leading end and the leading end comes into contact with a side surface of the superposed wafer substrate when the arm unit is rotated by the rotational movement mechanism until the leading end is directed vertically and downwardly.
A machine separates a layered material (target + support) held together by adhesive. It includes a holder for the layered material, and multiple position adjusters. These adjusters move in and out from the side of the held material. They touch the side and nudge it sideways, precisely aligning the layered material within the holder for the peeling process. Each adjuster uses a rotating arm. When the arm swings down to a vertical position, its tip contacts the side of the layered material to align it.
18. A peeling method of separating a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, comprising: holding the superposed substrate by a holding unit; performing a position adjustment of the superposed substrate relative to the holding unit by making a plurality of position adjustment units contacted with a side surface of the superposed substrate held by the holding unit; and separating the superposed substrate that is subjected to the position adjustment in the holding unit into the target substrate and the support substrate, wherein each of the plurality of position adjustment units includes an arm unit which is an elongated member and a rotational movement mechanism configured to rotate the arm unit, and wherein the arm unit has a leading end and the leading end comes into contact with a side surface of the superposed substrate when the arm unit is rotated by the rotational movement mechanism until the leading end is directed vertically and downwardly.
A method for separating a layered material (target + support) held together by adhesive. The method involves holding the layered material, then using multiple position adjusters to touch and nudge the sides of the material. This aligns the layered material within the holder. Finally, the layered material is separated into its target and support layers. Each adjuster uses a rotating arm. When the arm swings down to a vertical position, its tip contacts the side of the layered material to align it.
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April 28, 2014
March 21, 2017
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