A fluorine-containing compound represented by a following general formula (1) is provided. [In the general formula (1), X represents a halogen atom or an alkoxy group, R1 represents a branched chain or cyclic alkyl group having 3 to 10 carbon atoms, and Rf1 and Rf2 represent fluorinated alkoxy groups. n represents an integer of 0 or greater.]
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A fluorine-containing compound represented by a following general formula (1): where X represents a halogen atom or a methoxy group, R 1 represents a branched chain or cyclic alkyl group having 3 to 10 carbon atoms, R f1 and R f2 represent fluorinated alkoxy groups having 5 to 10 carbon atoms, and n represents an integer of 0 to 20.
A fluorine-containing compound has the general formula (1): where X is a halogen atom or a methoxy group (OCH3); R1 is a branched or cyclic alkyl group with 3 to 10 carbon atoms; Rf1 and Rf2 are fluorinated alkoxy groups with 5 to 10 carbon atoms; and n is an integer between 0 and 20. This compound is designed for chemical modification and pattern formation.
2. The fluorine-containing compound according to claim 1 , wherein R 1 represents an isopropyl group, an isobutyl group, or a tert-butyl group.
The fluorine-containing compound as described in Claim 1, where X represents a halogen atom or a methoxy group, R 1 represents a branched chain or cyclic alkyl group having 3 to 10 carbon atoms, R f1 and R f2 represent fluorinated alkoxy groups having 5 to 10 carbon atoms, and n represents an integer of 0 to 20, is further specified such that R1 is either an isopropyl group, an isobutyl group, or a tert-butyl group. These specific alkyl groups enhance the compound's properties for surface modification.
3. The fluorine-containing compound according to claim 1 , wherein R f1 or R f2 represent fluorinated alkoxy groups having 6 to 10 carbon atoms.
The fluorine-containing compound as described in Claim 1, where X represents a halogen atom or a methoxy group, R 1 represents a branched chain or cyclic alkyl group having 3 to 10 carbon atoms, R f1 and R f2 represent fluorinated alkoxy groups having 5 to 10 carbon atoms, and n represents an integer of 0 to 20, is further specified such that either Rf1 or Rf2 (or both) are fluorinated alkoxy groups containing 6 to 10 carbon atoms. This carbon range for the fluorinated alkoxy groups influences the water repellency characteristics.
4. A substrate for pattern formation having a surface chemically modified with the fluorine-containing compound according to claim 1 .
A substrate used for creating patterns has its surface chemically modified using the fluorine-containing compound. The fluorine-containing compound has the general formula (1): where X is a halogen atom or a methoxy group; R1 is a branched or cyclic alkyl group with 3 to 10 carbon atoms; Rf1 and Rf2 are fluorinated alkoxy groups with 5 to 10 carbon atoms; and n is an integer between 0 and 20. The chemical modification of the surface changes its properties in preparation for pattern creation.
5. A photodegradable coupling agent formed of the fluorine-containing compound according to claim 1 .
A photodegradable coupling agent is made from the fluorine-containing compound. The fluorine-containing compound has the general formula (1): where X is a halogen atom or a methoxy group; R1 is a branched or cyclic alkyl group with 3 to 10 carbon atoms; Rf1 and Rf2 are fluorinated alkoxy groups with 5 to 10 carbon atoms; and n is an integer between 0 and 20. This coupling agent breaks down upon exposure to light, allowing for pattern formation.
6. A pattern formation method for forming a pattern on a work surface of an object, the pattern formation method comprising: chemically modifying the work surface using the fluorine-containing compound according to claim 1 , by applying the fluorine-containing compound to the work surface such that the fluorine-containing compound bonds to the work surface; generating a latent image formed of a hydrophilic region and a water repellent region by irradiating the chemically modified work surface with light having a predetermined pattern; and disposing a pattern formation material in the hydrophilic region or the water repellent region.
A method for creating patterns on a surface involves chemically modifying the surface with a fluorine-containing compound, then creating a latent image by exposing the surface to light in a pattern, resulting in hydrophilic and water-repellent regions. The fluorine-containing compound has the general formula (1): where X is a halogen atom or a methoxy group; R1 is a branched or cyclic alkyl group with 3 to 10 carbon atoms; Rf1 and Rf2 are fluorinated alkoxy groups with 5 to 10 carbon atoms; and n is an integer between 0 and 20. Finally, a pattern formation material is applied and settles in either the hydrophilic or water-repellent areas, forming the desired pattern.
7. A pattern formation method for forming a circuit pattern for an electronic device on a substrate having flexibility, the pattern formation method comprising: chemically modifying an entire surface or a specific region of the substrate using the fluorine-containing compound according to claim 1 , by applying the fluorine-containing compound to the entire surface or specific region of the substrate such that the fluorine-containing compound bonds to the entire surface or specific region of the substrate; generating a latent image of the circuit pattern due to a difference in hydrophilicity and water repellency on the chemically modified surface of the substrate by irradiating with light energy having a distribution corresponding to the circuit pattern; and bringing a pattern formation material having fluidity into contact with a part of the latent image on the surface of the substrate and capturing the pattern formation material on the substrate in a shape of the circuit pattern by the difference in hydrophilicity and water repellency.
A method for creating circuit patterns on flexible substrates involves chemically modifying the entire or a specific region of the substrate with a fluorine-containing compound. The fluorine-containing compound has the general formula (1): where X is a halogen atom or a methoxy group; R1 is a branched or cyclic alkyl group with 3 to 10 carbon atoms; Rf1 and Rf2 are fluorinated alkoxy groups with 5 to 10 carbon atoms; and n is an integer between 0 and 20. The substrate is then irradiated with light according to the circuit pattern, creating areas with different hydrophilicity. A fluid pattern formation material is then applied and adheres to specific areas based on these properties, defining the circuit pattern.
8. The pattern formation method according to claim 6 , wherein the pattern formation material includes a liquid conductive material, a liquid semiconductor material, or a liquid insulating material.
In the pattern formation method as described in Claim 6, where a pattern is formed on a work surface using a fluorine-containing compound to create hydrophilic and hydrophobic regions, and then a pattern formation material is disposed in these regions, the pattern formation material is a liquid conductive material, a liquid semiconductor material, or a liquid insulating material. These materials create functional electronic patterns.
9. The pattern formation method according to claim 6 , wherein the light includes light having a wavelength included in a range of 200 nm to 450 nm.
In the pattern formation method as described in Claim 6, where a pattern is formed on a work surface using a fluorine-containing compound to create hydrophilic and hydrophobic regions, and then a pattern formation material is disposed in these regions, the light used to generate the latent image has a wavelength between 200 nm and 450 nm. This range of wavelengths allows for controlled photodegradation of the coupling agent.
10. The pattern formation method according to claim 6 , wherein the applying the fluorine-containing compound to the work surface is performed by dipping or refluxing the substrate to treat the work surface.
In the pattern formation method as described in Claim 6, where a pattern is formed on a work surface using a fluorine-containing compound to create hydrophilic and hydrophobic regions, and then a pattern formation material is disposed in these regions, the application of the fluorine-containing compound to chemically modify the surface is achieved by dipping the substrate into a solution containing the compound or by refluxing the substrate in the solution. These techniques ensure uniform coating of the surface.
11. The pattern formation method according to claim 7 , wherein the applying the fluorine-containing compound to the entire surface or specific region of the substrate is performed by dipping or refluxing the substrate to treat the entire surface or specific region of the substrate.
In the pattern formation method as described in Claim 7, where a circuit pattern is formed on a flexible substrate using a fluorine-containing compound to create regions of different hydrophilicity, and then a fluid pattern formation material is applied, the application of the fluorine-containing compound to the entire or specific region of the substrate is performed by dipping or refluxing the substrate to treat the surface. These methods enable uniform coating of the substrate, preparing it for pattern formation.
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March 2, 2015
March 28, 2017
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