It is an object to provide a power semiconductor module having a case shared for base plates of different sizes and having a high-stability base plate. The power semiconductor module according to the present invention includes: a base plate; an insulating substrate disposed on a first main surface of the base plate; a semiconductor chip disposed on an insulating substrate; a case for enclosing the base plate except a second main surface of the base plate facing the first main surface, the insulating substrate, and the semiconductor chip; and a spacer provided between the outer periphery of the base plate and the inner periphery of the case and in contact with both. The spacer has a bonding surface with a side surface of the base plate and the first main surface in the contact with the outer periphery of the base plate.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A power semiconductor module comprising: a base plate; an insulating substrate only partially covering a first main surface of said base plate; a semiconductor chip disposed on said insulating substrate; a case for enclosing said base plate except a second main surface of said base plate facing said first main surface, said insulating substrate, and said semiconductor chip; and a spacer provided between an outer periphery of said base plate and an inner periphery of said case and in contact with both, wherein said spacer includes a bonding surface in contact with a side surface of said base plate and said first main surface of said base plate at said outer periphery of said base plate, and said spacer is bonded to said base plate with an adhesive in said bonding surface.
A power semiconductor module contains a base plate, an insulating substrate that covers only part of the top surface of the base plate, and a semiconductor chip on the substrate. A case encloses the base plate, substrate, and chip, leaving the bottom surface of the base plate exposed. A spacer sits between the outer edge of the base plate and the inner edge of the case, making contact with both. The spacer has an adhesive bonding surface that touches both the side and top edge of the base plate. The spacer is glued to the base plate using this adhesive. This setup is designed to provide a stable mounting for the base plate within the case.
2. The power semiconductor module according to claim 1 , wherein said spacer has an uneven shape in at least one surface of said bonding surface.
The power semiconductor module described previously has a spacer with a bonding surface that is uneven. This unevenness, present on at least one side of the spacer’s bonding surface (the surface glued to the base plate), could be a rough texture or patterned shape. The base plate is stable due to the spacer sitting between it and the case.
3. The power semiconductor module according to claim 1 , further comprising a control substrate of said semiconductor chip above said semiconductor chip within said case.
The power semiconductor module described previously also includes a control substrate for the semiconductor chip. This control substrate is located above the semiconductor chip but still inside the case. The base plate sits below the insulating substrate and semiconductor chip. The insulating substrate is only partially covering the top of the base plate, on top of which sits the semiconductor chip and then control substrate. The spacer is glued between the base plate and the case.
4. The power semiconductor module according to claim 1 , wherein said spacer is bonded to said case in two or more surfaces.
The power semiconductor module described previously includes a spacer bonded to the case on at least two surfaces. The spacer is glued to the base plate on one side and the case on at least two sides, increasing stability. The insulating substrate is only partially covering the top of the base plate, on top of which sits the semiconductor chip. This provides more secure support of the base plate.
5. A power semiconductor module comprising: a base plate; an insulating substrate only partially covering a first main surface of said base plate; a semiconductor chip disposed on said insulating substrate; a case for enclosing said base plate except a second main surface of said base plate facing said first main surface, said insulating substrate, and said semiconductor chip; and a spacer provided between an outer periphery of said base plate and an inner periphery of said case and in contact with both, wherein said spacer includes a bonding surface in contact with a side surface of said base plate and said first main surface of said base plate at said outer periphery of said base plate, and said spacer is joined to said base plate with an insulating screw in said bonding surface.
A power semiconductor module contains a base plate, an insulating substrate that covers only part of the top surface of the base plate, and a semiconductor chip on the substrate. A case encloses the base plate, substrate, and chip, leaving the bottom surface of the base plate exposed. A spacer sits between the outer edge of the base plate and the inner edge of the case, making contact with both. The spacer has a bonding surface that touches both the side and top edge of the base plate. The spacer is joined to the base plate using an insulating screw that passes through the bonding surface. This setup is designed to provide a stable mounting for the base plate within the case.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 29, 2016
May 16, 2017
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