A modular electronic system for receiving, processing or forwarding information. Devices comprise a housing including flat electromagnetically effective transfer elements in or on an insulating housing wall and at least one circuit board including flat electromagnetically effective transfer elements and electronic components.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A modular electronic system for receiving, processing or forwarding information, comprising: a circuit board including electronic components and one or more first electromagnetically effective transfer elements; a housing made at least in part of electrically insulating material and having one or more second electromagnetically effective transfer elements arranged on or in a first wall among a plurality of walls of the housing, and having a cavity adapted to accommodate the circuit board including the electronic components; connection means adapted to feed electrical power or for information transfer purposes, wherein the connection means are electrically or electromagnetically coupled with the one or more second electromagnetically effective transfer elements of the housing or the one or more first electromagnetically effective transfer elements of the circuit board; and wherein the one or more second electromagnetically effective transfer elements of the housing and the one or more first electromagnetically effective transfer elements of the circuit board are arranged for electromagnetic coupling.
A modular electronic system is designed for receiving, processing, or forwarding information. It contains a circuit board with electronic components and one or more "first" electromagnetically effective transfer elements (e.g., coils). A housing, made at least partly of electrically insulating material, has one or more "second" electromagnetically effective transfer elements on or in a wall of the housing. The housing has a cavity to hold the circuit board. Connection means (electrical connectors, etc.) are used for power or data transfer. These connection means are electrically or electromagnetically connected to either the "second" transfer elements on the housing or the "first" transfer elements on the circuit board. The "first" and "second" transfer elements are arranged to electromagnetically couple with each other, enabling wireless transfer of power or data.
2. The modular electronic system as claimed in claim 1 , wherein the one or more first electromagnetically effective transfer elements and the one or more second electromagnetically effective transfer elements respectively include a first primary transfer element and a first secondary transfer element; and wherein the first primary transfer element and the first secondary transfer element are flat in a region where they face each other.
The modular electronic system described in the previous claim includes electromagnetically effective transfer elements comprised of a "first primary transfer element" and a "first secondary transfer element" on the circuit board and housing respectively. These transfer elements are flat in the region where they face each other. This flatness is intended to improve the efficiency or predictability of the electromagnetic coupling between the two elements for power or data transfer.
3. The modular electronic system as claimed in claim 1 , wherein the circuit board is a part of one of the plurality of walls of the housing, or of an element accommodating the one or more first electromagnetically effective transfer elements is produced by means of molded interconnect device (MID) technology.
In the modular electronic system described previously, the circuit board can be integrated as part of one of the walls of the housing. Alternatively, the element that accommodates the first electromagnetically effective transfer elements (e.g., the coil) on the circuit board can be produced using molded interconnect device (MID) technology. MID allows for integrating electrical functions directly into a molded plastic part, enabling complex geometries and miniaturization.
4. The modular electronic system as claimed in claim 1 , wherein the housing is electrically insulative, at least in a region of the one or more second electromagnetically effective transfer elements.
In the modular electronic system, the housing is electrically insulated, at least in the area where the second electromagnetically effective transfer elements are located. This insulation is crucial to prevent short circuits or other electrical malfunctions when the transfer elements are used for power transfer.
5. The modular electronic system as claimed in claim 1 , wherein a primary component of the one or more second electromagnetically effective transfer elements is arranged in the housing and a secondary component of the one or more first electromagnetically effective transfer elements is arranged on the circuit board.
In the modular electronic system, the second electromagnetically effective transfer element (located in the housing) acts as a "primary component," and the first electromagnetically effective transfer element (located on the circuit board) acts as a "secondary component." The primary component on the housing initiates the electromagnetic transfer and the secondary on the circuit board receives it.
6. The modular electronic system as claimed in claim 5 , wherein the circuit board has a further connection means.
The modular electronic system described previously where the housing electromagnetically effective transfer element acts as a "primary component," and the circuit board transfer element acts as a "secondary component", includes a further connection means on the circuit board.
7. The modular electronic system as claimed in claim 1 , wherein the electronic components include a radio frequency identification (RFID) component which is accommodated in the first wall of the housing, and wherein the first wall is electrically insulated.
The modular electronic system described in claim 1 incorporates a Radio Frequency Identification (RFID) component within the housing's wall. This wall is electrically insulated, ensuring proper RFID operation and preventing interference. The RFID component can be used for identification, tracking, or data storage purposes.
8. The modular electronic system as claimed in claim 1 , further comprising: a bus system; a number of subscriber devices with each one connected to the bus system via a respective one of the connection means, wherein each of the subscriber devices is adapted to be mounted and accommodated side by side on a support rail; the first wall forming a part of a respective subscriber device of the subscriber devices and including at least one first flat primary transfer element enclosed therein, the at least one first flat primary transfer element being the one or more second electromagnetically effective transfer elements; and the circuit board which in addition to the electronic components includes at least one flat first secondary transfer element for feeding rectifier components for power supply of the electronic components, the at least one first flat secondary transfer element being the one or more first electromagnetically effective transfer elements, wherein the first flat secondary transfer element is arranged facing towards and, adjacent to, the at least one first flat primary transfer element in the respective subscriber device for interaction by being coupled through a first electromagnetic alternating field.
The modular electronic system includes a bus system and multiple subscriber devices. Each subscriber connects to the bus via connection means and mounts side-by-side on a support rail. Each subscriber device has a first wall containing at least one flat primary transfer element (the housing's electromagnetically effective transfer element). The circuit board within the subscriber includes electronic components and at least one flat secondary transfer element that feeds rectifier components for powering the electronics (the circuit board's electromagnetically effective transfer element). The primary and secondary transfer elements are closely positioned to couple through an electromagnetic alternating field for power transfer.
9. The modular electronic system as claimed in claim 8 , wherein the respective subscriber device includes the housing and housing parts, one part of the housing being the first wall, which is an energy transfer wall.
The modular electronic system described previously, where subscriber devices are mounted on a bus system, the subscriber device includes the housing and its parts, with the first wall acting as an "energy transfer wall." The first wall being an energy transfer wall suggests it is specifically designed to facilitate efficient electromagnetic power transfer.
10. The modular electronic system as claimed in claim 8 , wherein the first wall includes a second primary transfer element facing and adjacent to a second secondary transfer element of the circuit board for interaction by being coupled through a second electromagnetic alternating field and used for signal transfer, the second flat primary transfer element being another of the one or more second electromagnetically effective transfer elements, and the second flat secondary transfer element being another of the one or more first electromagnetically effective transfer elements.
The modular electronic system described previously utilizes a second set of primary and secondary transfer elements for signal transfer, in addition to the first set used for power transfer. The first wall of the housing includes a second primary transfer element facing a second secondary transfer element on the circuit board. These elements couple through a second electromagnetic alternating field to transmit signals between the housing and circuit board.
11. The modular electronic system as claimed in claim 8 , wherein each of the at least one flat first primary transfer element and the at least one flat first secondary transfer element is connected to respective associated feed electronics encapsulated in the first wall, which is an energy transfer wall.
In the modular electronic system with subscribers on a bus, each primary and secondary transfer element used for power transfer is connected to its own feed electronics encapsulated within the energy transfer wall (the first wall of the housing). Encapsulating the feed electronics enhances isolation and protection of the components.
12. The modular electronic system as claimed in claim 11 , wherein the support rail supports power supply lines and signal lines which belong to the bus system and which are connected to the respective subscriber device via the respective one of the connection means; and wherein the connection means of the respective subscriber devices comprise plug-in connectors and lines leading to the respective associated feed electronics.
In the modular electronic system with subscribers on a bus, the support rail carries power and signal lines for the bus system, connecting to each subscriber device via connection means (plug-in connectors and lines) leading to the encapsulated feed electronics (described previously).
13. The modular electronic system as claimed in claim 8 , wherein the support rail supports power supply lines and signal lines which belong to the bus system and which are connected to the respective subscriber device via the respective one of the connection means.
In the modular electronic system with subscribers on a bus, the support rail supports power and signal lines for the bus system. These lines connect to each subscriber device through connection means (e.g., connectors).
14. The modular electronic system as claimed in claim 13 , wherein the connection means comprise an inductive or capacitive transformer.
In the modular electronic system with subscribers on a bus where a support rail delivers power and signal lines, the connection means use an inductive or capacitive transformer. This allows for non-contact power and data transfer between the support rail and subscriber devices.
15. A bus subscriber device for a modular electronic system, comprising: a housing made of electrically insulating material, comprising an energy transfer wall; a circuit board including electronic components, the circuit board inside of the housing, and the housing adapted to be mounted to a support rail; wherein the energy transfer wall includes a first flat electromagnetically effective primary transfer element encapsulated within the energy transfer wall for power transfer purposes, and a second flat electromagnetically effective primary transfer element encapsulated within the energy transfer wall for signal transfer purposes; and wherein the circuit board includes a first flat electromagnetically effective secondary transfer element for power supply purposes and a second flat electromagnetically effective secondary transfer element for reception and transmission of signals, wherein the first and second flat electromagnetically effective secondary transfer elements are arranged facing towards and, respectively adjacent to, the first and second flat electromagnetically effective primary transfer elements, for coupling purposes.
A bus subscriber device for a modular electronic system contains a housing made of electrically insulating material, which includes an energy transfer wall. A circuit board with electronic components resides inside the housing, which is designed to mount on a support rail. The energy transfer wall has a first flat primary electromagnetic transfer element for power transfer and a second flat primary element for signal transfer, both encapsulated within the wall. The circuit board contains corresponding first and second flat secondary electromagnetic transfer elements for power and signal purposes respectively, positioned to face the primary elements within the energy transfer wall for electromagnetic coupling.
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October 24, 2013
June 6, 2017
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