A power converter includes a circuit board having an elongated anode receiving an input voltage and an input current and an elongated cathode providing an output voltage and an output current, and a plurality of diodes electrically arranged in parallel between the anode and cathode. The parallel diodes convert the input voltage to an output voltage, convert the input current to an output current.
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1. A power converter, comprising: a circuit board having an elongated anode receiving an input voltage and an input current and an elongated cathode providing an output voltage and an output current; and a plurality of silicon carbide diodes electrically arranged in parallel and provided in a gap between the anode and cathode, and spaced relative to each other on the circuit board; wherein the parallel diodes convert the input voltage to an output voltage, convert the input current to an output current, and the number of diodes and the spacing of the diodes on the circuit board prevents thermal failure of the power converter.
A power converter contains a circuit board. This board has an elongated anode (positive terminal) that receives input voltage and current, and an elongated cathode (negative terminal) that provides output voltage and current. Multiple silicon carbide diodes are placed in parallel between the anode and cathode, spaced apart on the board to prevent overheating and failure. These diodes convert the input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
2. The power converter of claim 1 wherein the circuit board further comprises a thermally conductive substrate configured to remove at least a portion of heat generated by the diodes.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, has a thermally conductive substrate. This substrate is part of the circuit board and is designed to remove some of the heat produced by the diodes during operation, improving cooling. The diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
3. The power converter of claim 2 wherein the thermally conductive substrate is electrically isolated from the anode and cathode.
The power converter, which includes a circuit board with an elongated anode and cathode, parallel silicon carbide diodes spaced apart to prevent overheating, and a thermally conductive substrate to remove diode heat, has the substrate electrically isolated. This means the thermally conductive substrate, designed to remove heat generated by the diodes, does not conduct electricity to or from the anode or cathode, preventing short circuits or unwanted current flow. The diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
4. The power converter of claim 1 wherein each silicon carbide diode is configured to operate under at least 40 Ampere loads.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, uses silicon carbide diodes that can each handle at least 40 Amperes of current. This high current capacity allows the power converter to handle significant power loads without damaging the individual diodes. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
5. The power converter of claim 4 wherein the power converter provides at least a 10 KW output at 500 Ampere loads.
The power converter, which includes a circuit board with an elongated anode and cathode, parallel silicon carbide diodes spaced apart to prevent overheating, and diodes each capable of handling at least 40 Amperes, can provide at least a 10 Kilowatt output at 500 Ampere loads. This demonstrates the power converter's ability to deliver substantial power at high current levels. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
6. The power converter of claim 5 wherein the power converter is contained in a volume of at most 4.05 inches by 1.60 inches by 0.61 inches.
The power converter, which includes a circuit board with an elongated anode and cathode, parallel silicon carbide diodes spaced apart to prevent overheating, diodes each capable of handling at least 40 Amperes, and provides at least 10 Kilowatt output at 500 Ampere loads, is very compact. Its physical dimensions are at most 4.05 inches long, 1.60 inches wide, and 0.61 inches high, indicating a high power density. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
7. The power converter of claim 5 wherein the diodes are spaced apart to prevents thermal failure when the diodes collectively generate at least 440 thermal Watts of heat.
The power converter, which includes a circuit board with an elongated anode and cathode, parallel silicon carbide diodes spaced apart to prevent overheating, diodes each capable of handling at least 40 Amperes, and provides at least 10 Kilowatt output at 500 Ampere loads, is designed to prevent thermal failure even when the diodes collectively generate at least 440 Watts of heat. The diodes are spaced apart to manage this heat load effectively. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
8. The power converter of claim 7 wherein the diodes are spaced at least 3 millimeters apart.
The power converter, which includes a circuit board with an elongated anode and cathode, parallel silicon carbide diodes spaced apart to prevent overheating, diodes each capable of handling at least 40 Amperes, provides at least 10 Kilowatt output at 500 Ampere loads, and is designed to prevent thermal failure generating 440W of heat, achieves this thermal management by spacing the diodes at least 3 millimeters apart on the circuit board. This specific spacing helps dissipate heat and prevents individual diodes from overheating adjacent components. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
9. The power converter of claim 1 wherein the input voltage is DC and the output voltage is DC.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, takes a DC (Direct Current) input voltage and converts it to a DC output voltage. It's a DC-to-DC converter. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
10. The power converter of claim 1 wherein the input voltage is AC, the output voltage is DC, and the power converter operates as a half-wave rectifier.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, takes an AC (Alternating Current) input voltage and converts it to a DC (Direct Current) output voltage, and operates as a half-wave rectifier. This means it only allows one half of the AC waveform to pass through, creating a pulsating DC output. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
11. The power converter of claim 1 further comprising a second anode receiving a different input voltage and different input current, a second plurality of silicon carbide diodes electrically arranged in parallel between the second anode and the cathode, and spaced on the circuit board, such that the power converter operates as a full-wave rectifier.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, further includes a second anode that receives a different input voltage and current. A second set of parallel silicon carbide diodes is placed between this second anode and the cathode, also spaced apart on the board. This configuration allows the power converter to operate as a full-wave rectifier, using both halves of the AC waveform for a smoother DC output. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
12. The power converter of claim 1 wherein the spacing of the diodes on the circuit board prevents thermal failure when the diodes collectively generate at least 440 Watts of heat.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, is designed so that the spacing of the diodes on the circuit board prevents thermal failure even when the diodes collectively generate at least 440 Watts of heat. The physical arrangement of the diodes is crucial for effective heat dissipation. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
13. The power converter of claim 1 further comprising a dielectric layer overlying each of the diodes and circuit board.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, has a dielectric layer covering each of the diodes and the circuit board. This insulating layer provides electrical isolation and protection for the components. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
14. The power converter of claim 1 wherein the diodes are surface mounted on the circuit board in an open chip configuration.
The power converter, which includes a circuit board with an elongated anode and cathode, and parallel silicon carbide diodes spaced apart to prevent overheating, features diodes that are surface mounted directly on the circuit board in an open chip configuration. This means the silicon carbide dies are directly attached to the board without a traditional packaged enclosure, potentially improving thermal performance and reducing size. These diodes convert input voltage and current to output voltage and current. The number and spacing of the diodes ensure the power converter doesn't fail due to excessive heat.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 4, 2014
June 13, 2017
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