A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.
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1. A power module packaging structure comprising: a first conducting layer; a first insulating layer disposed above the first conducting layer; a second conducting layer disposed above the first insulating layer; a first power device disposed on the first conducting layer; and a first controlling device disposed on the second conducting layer and used for controlling the first power device; wherein the first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop, a direction of a current that flows through the first conducting layer in the loop is opposite to a direction of a current that flow through the second conducting layer in the loop.
A power module packaging structure contains a first conducting layer, a first insulating layer above it, and a second conducting layer above the insulating layer. A power device sits on the first conducting layer and is controlled by a controlling device on the second conducting layer. These components (first and second conducting layers, power device, and controlling device) form a loop. The current flows in opposite directions through the two conducting layers within that loop. This arrangement aims to minimize inductance and improve power module performance.
2. The power module packaging structure of claim 1 , wherein a thickness of the first insulating layer is 25 micrometers (um) to 1 millimeter (mm).
The power module packaging structure described previously has a first insulating layer separating the first and second conducting layers. The thickness of this insulating layer is specifically designed to be between 25 micrometers and 1 millimeter. This thickness range ensures adequate electrical isolation between the conducting layers while maintaining a compact module size and enabling efficient heat transfer.
3. The power module packaging structure of claim 1 , wherein a ratio of an area of a vertical projection of the second conducting layer onto the first conducting layer to an area of the second conducting layer is greater than 50%.
In the previously described power module, the second conducting layer's vertical projection onto the first conducting layer covers a significant portion of the second conducting layer's area. Specifically, the ratio of the projected area to the actual area of the second conducting layer is greater than 50%. This overlap helps to enhance the current carrying capacity and reduce parasitic inductance by maximizing the coupling between the two conducting layers.
4. The power module packaging structure of claim 1 , wherein the second conducting layer is coupled to the first conducting layer via a conducting member.
The power module packaging structure described earlier also includes a conducting member that connects the first and second conducting layers together. This conductive link provides a path for current flow between the layers, potentially forming part of the power loop or serving as a ground connection. The conducting member helps to optimize the current distribution and manage heat dissipation within the module.
5. The power module packaging structure of claim 4 , wherein the first power device is coupled to the first conducting layer via a first connecting member; wherein the power module packaging structure further comprises: a second power device disposed on the first conducting layer, and coupled to the first conducting layer via a second connecting member.
Building on the previous description, the first power device is connected to the first conducting layer by a first connecting member. The structure also includes a second power device, which is also placed on the first conducting layer and coupled to it via a second connecting member. This configuration allows for multiple power devices to be integrated within the power module, increasing power handling capability and flexibility.
6. The power module packaging structure of claim 5 , further comprising: a first driving circuit and a second driving circuit disposed on the second conducting layer and being independent of the first controlling device.
Extending the design from claim 5, the power module incorporates a first driving circuit and a second driving circuit positioned on the second conducting layer. These driving circuits operate independently from the first controlling device. They are responsible for independently controlling the first and second power devices. This independent control enhances the power module's operational flexibility and allows for advanced control strategies.
7. The power module packaging structure of claim 4 , further comprising: a second controlling device disposed on the second conducting layer and being coupled to the second conducting layer via a third connecting member.
Expanding on the power module with the conducting member (from claim 4), a second controlling device is added, positioned on the second conducting layer. This second control device is connected to the second conducting layer using a third connecting member. The second controller provides additional control capability, potentially managing other components or functions within the power module.
8. The power module packaging structure of claim 1 , further comprising a substrate, the substrate comprising the first conducting layer, the first insulating layer, and the second conducting layer.
The power module packaging structure described earlier is built upon a substrate. This substrate integrates the first conducting layer, the first insulating layer, and the second conducting layer. The substrate provides mechanical support and facilitates the assembly and integration of the various components of the power module.
9. The power module packaging structure of claim 8 , wherein the substrate further comprises. a third conducting layer; and a second insulating layer disposed on the third conducting layer; wherein the first conducting layer is disposed on the second insulating layer.
The substrate-based power module of the previous claim is further enhanced by including a third conducting layer and a second insulating layer. This second insulating layer is disposed on the third conducting layer, and the first conducting layer is then placed on top of the second insulating layer. This multi-layered substrate provides added functionality and increased component density.
10. The power module packaging structure of claim 1 , further comprising a first substrate and a second substrate, wherein the second substrate is disposed above the first substrate, and the first substrate and the second substrate being connected via conductive connection material; wherein the first substrate comprises the first conducting layer, and the second substrate comprises the second conducting layer and the first insulating layer.
As an alternative to a single substrate, the power module can be constructed using a first and a second substrate. The second substrate is positioned above the first, and they are connected using a conductive connection material. The first substrate includes the first conducting layer, while the second substrate comprises the second conducting layer and the first insulating layer. This multi-substrate approach allows for optimized material selection and manufacturing processes.
11. The power module packaging structure of claim 10 , wherein the first substrate further comprise: a third conducting layer; and a second insulating layer disposed on the third conducting layer, and the first conducting layer being disposed on the second insulating layer; wherein the second substrate further comprises: a fourth conducting layer, the first insulating layer being disposed on the fourth conducting layer, wherein the fourth conducting layer is connected to the first conducting layer via conductive connection material.
Expanding on the two-substrate design, the first substrate also includes a third conducting layer and a second insulating layer placed between the third and first conducting layers. The second substrate also includes a fourth conducting layer with the first insulating layer placed between the fourth and second conducting layers. The fourth conducting layer is connected to the first conducting layer using a conductive connection material. This layered substrate design allows for more complex interconnections and improved performance.
12. The power module packaging structure of claim 11 further comprising: a third substrate and a fourth substrate, the fourth substrate being disposed above the third substrate, and the third substrate and the fourth substrate being connected via conductive connection material, wherein the third substrate has a same structure as the first substrate, and the fourth substrate has a same structure as the second substrate.
Expanding on the two-substrate design, the power module now includes a third and fourth substrate. The fourth substrate is located above the third and they are connected using a conductive connection material. The third substrate has the same structure as the first substrate, and the fourth substrate has the same structure as the second substrate, effectively replicating the initial two-substrate arrangement. This allows for higher power handling and modular design.
13. The power module packaging structure of claim 12 , further comprising a substrate carrier, the first substrate and the second substrate being disposed above the substrate carrier, the first substrate being connected to the substrate carrier via conductive connection material; the third substrate and the fourth substrate being disposed above the substrate carrier, and the third substrate being connected to the substrate carrier via a conductive connection material; wherein the first substrate and the third substrate are connected via conductive connection material.
The multi-substrate power module now incorporates a substrate carrier. The first and second substrates are positioned above this carrier and the first substrate is connected to it using a conductive connection material. Similarly, the third and fourth substrates are also above the substrate carrier, with the third substrate connected to it conductively. Furthermore, the first and third substrates are also conductively linked. The substrate carrier provides mechanical support and a common electrical ground.
14. A manufacturing method for a power module packaging structure comprising: forming a first conducting layer; forming a first insulating layer above the first conducting layer; forming a second conducting layer above the first insulating layer; forming a first power device on the first conducting layer; forming a first controlling device on the second conducting layer, wherein the first controlling device is used for controlling the first power device; and making the first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop, wherein a direction of a current that flows through the first conducting layer in the loop is opposite to a direction of a current that flows through the second conducting layer in the loop.
A method for manufacturing a power module involves forming a first conducting layer, then creating a first insulating layer above it. A second conducting layer is then formed above the insulating layer. A power device is fabricated on the first conducting layer, and a controlling device is made on the second conducting layer to control the power device. The method ensures that the conducting layers, power device, and controlling device form a loop where current flows in opposite directions within the conducting layers.
15. The manufacturing method for the power module packaging structure of claim 14 , wherein a thickness of the first insulating layer is 25 micrometers (um) to 1 millimeter (mm).
The power module manufacturing method described previously involves creating a first insulating layer with a specific thickness between the first and second conducting layers. This thickness is controlled to be between 25 micrometers and 1 millimeter to ensure proper electrical isolation and thermal management during operation.
16. The manufacturing method for the power module packaging structure of claim 14 , wherein a ratio of an area of a vertical projection of the second conducting layer onto the first conducting layer to an area of the second conducting layer is greater than 50%.
In the power module manufacturing method, the second conducting layer is formed such that its vertical projection onto the first conducting layer covers a significant portion of its area. The ratio of the projected area to the actual area of the second conducting layer is maintained above 50% to optimize the electrical coupling and current carrying capacity.
17. The manufacturing method for the power module packaging structure of claim 14 , further comprising: coupling the first conducting layer to the second conducting layer via conducting member.
The power module manufacturing method described previously also includes a step of connecting the first conducting layer to the second conducting layer using a conducting member. This provides a conductive path between the layers, influencing current flow and potentially serving as a ground connection.
18. The manufacturing method for the power module packaging structure of claim 14 , further comprising: forming a substrate, wherein the substrate comprises the first conducting layer, the first insulating layer, and the second conducting layer.
The power module manufacturing method described previously includes forming a substrate that integrates the first conducting layer, the first insulating layer, and the second conducting layer. This substrate serves as the foundation for the module, providing mechanical support and facilitating the assembly of the other components.
19. The manufacturing method for the power module packaging structure of claim 14 , further comprising: forming a first substrate, wherein the first substrate comprises the first conducting layer; and forming a second substrate above the first substrate, wherein the second substrate comprises the second conducting layer and the first insulating layer.
The manufacturing method involves creating a first substrate containing the first conducting layer. Then, a second substrate, which includes the second conducting layer and the first insulating layer, is formed above the first substrate. This two-substrate approach offers flexibility in material selection and processing.
20. The manufacturing method for the power module packaging structure of claim 19 , further comprising: forming a third conducting layer; and forming a second insulating layer on the third conducting layer, and forming the first conducting layer on the second insulating layer; wherein the step of forming the second substrate further comprises: forming a fourth conducting layer of the second substrate, wherein the first insulating layer is disposed on the fourth conducting layer, wherein the fourth conducting layer is connected to the first conducting layer via conductive connection material.
The manufacturing method extends the two-substrate approach by forming a third conducting layer and placing a second insulating layer on it before forming the first conducting layer on top. For the second substrate, a fourth conducting layer is created, and the first insulating layer is formed on top of it. Finally, the fourth conducting layer is connected to the first conducting layer using a conductive connection material. This layering creates a more complex interconnection structure.
21. The manufacturing method for the power module packaging structure of claim 20 , further comprising: forming a third substrate, wherein the third substrate has a same structure as the first substrate; and forming a fourth substrate above the third substrate, and the third substrate and the fourth substrate being connected via conductive connection material, wherein the fourth substrate has a same structure as the second substrate.
Building upon the previous multi-substrate manufacturing process, the method involves creating a third substrate that mirrors the structure of the first substrate and a fourth substrate that replicates the second substrate. The fourth substrate is positioned above the third, and they are connected conductively. This repetition of the substrate structure provides a modular approach.
22. The manufacturing method for the power module packaging structure of claim 21 further comprising: forming a substrate carrier, wherein the first substrate and the second substrate are disposed above the substrate carrier, and the first substrate is connected to the substrate carrier via conductive connection material; wherein the step of forming the third substrate and the fourth substrate comprises: forming the third substrate and the fourth substrate above the substrate carrier, wherein the third substrate is connected to the substrate carrier via conductive connection material, wherein the first substrate and the third substrate are connected via conductive connection material.
Further enhancing the manufacturing process, a substrate carrier is introduced. The first and second substrates are placed above this carrier, and the first substrate is conductively connected to it. Likewise, the third and fourth substrates are positioned above the carrier, with the third substrate conductively connected to it. Finally, the first and third substrates are conductively connected to each other. This provides mechanical support and potentially a common electrical ground.
23. The manufacturing method for the power module packaging structure of claim 22 , further comprising: printing solder paste on the second conducting layer to attach the first controlling device and a second controlling device to the second conducting layer, and soldering the first controlling device and the second controlling device to the second conducting layer through reflow soldering; printing solder paste on the first substrate and soldering the fourth conducting layer and the first power device to the first substrate through reflow soldering; coupling the second controlling device to the second conducting layer and coupling the first power device to the second conducting layer via a plurality of connecting members; printing a solder material on the substrate carrier, fixing the first substrate and the third substrate to the substrate carrier by using a jig, and soldering the first substrate and the third substrate to the substrate carrier through reflow soldering; and connecting the first substrate to the third substrate via conductive connection material.
This detailed manufacturing method includes specific steps like printing solder paste on the second conducting layer to attach the first and second control devices followed by reflow soldering. Solder paste is printed on the first substrate for attaching the fourth conducting layer and the first power device using reflow soldering. The second control device is coupled to the second conducting layer and the first power device to the second conducting layer via connecting members. Solder is applied to the substrate carrier, the first and third substrates are fixed using a jig, and then soldered via reflow. Finally, the first and third substrates are connected via conductive material.
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May 30, 2016
July 4, 2017
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