To provide a wiring board ensuring adhesion strength of a connecting terminal to reduce the connecting terminal from being fallen over or peeled off under fabrication process. The wiring board according to the present invention includes a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body and a filling member filled up between the plurality of connecting terminals. The filling member is filled up to a position lower than a height of the plurality of connecting terminals. The connecting terminals has a cross section with a trapezoidal shape where a width of a first principal surface on a side contacting the laminated body is wider than a width of a second principal surface facing the first principal surface.
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1. A wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated, the wiring board comprising: a plurality of connecting terminals formed separately from one another on the laminated body; and a filling member filled up between the plurality of connecting terminals, the filling member being filled up to a position lower than a height of the plurality of connecting terminals, wherein the connecting terminals have a cross section with a trapezoidal shape where a width of a first principal surface on a side contacting the laminated body is wider than a width of a second principal surface facing the first principal surface, a solder resist layer having an opening that exposes the plurality of connecting terminals and covering a wiring pattern connected to the plurality of connecting terminals, is provided on the laminate body, the wiring pattern has a cross section with a trapezoidal shape where a width of a third principal surface on a side contacting the laminated body is wider than a width of a fourth principal surface facing the third principal surface, and at least a part of the plurality of connecting terminals has a ratio of a width of the first principal surface with respect to a width of the second principal surface larger than a ratio of a width of the third principal surface with respect to a width of the fourth principal surface of the wiring pattern.
The wiring board has alternating layers of insulation and conductors. Separated connecting terminals are placed on top. A filling material is applied between these terminals, but it doesn't reach the full height of the terminals. The terminals are trapezoidal, wider at the base (where they contact the board) than at the top. A solder resist layer with openings is applied to expose the connecting terminals and cover the wiring pattern connected to the connecting terminals. The wiring pattern also has a trapezoidal cross-section wider at the base. The ratio of the base width to the top width is greater for the connecting terminals than for the wiring pattern which enhances adhesion and reduces terminal damage during manufacturing.
2. The wiring board according to claim 1 , wherein the connecting terminals have the first principal surface that includes a contact surface and spaced surfaces, the contact surface contacting the laminated body, the spaced surfaces being disposed on both ends of the contact surface and not in contact with the laminated body.
The wiring board has connecting terminals with a special base. This base has a contact surface that touches the laminated body and separated spaces on either end that are not in contact with the laminated body. This improves adhesion strength between the terminal and the board. The wiring board itself has alternating layers of insulation and conductors with separated connecting terminals placed on top. A filling material is applied between these terminals, but it doesn't reach the full height of the terminals. The terminals are trapezoidal, wider at the base (where they contact the board) than at the top. A solder resist layer with openings exposes the connecting terminals and covers the wiring pattern. The wiring pattern is trapezoidal, and the terminals' base-to-top width ratio is greater.
3. The wiring board according to claim 1 , wherein the contact surface has a width wider than a width of the second principal surface.
The wiring board has connecting terminals that are wider where they contact the laminated body compared to their top surface. This wider contact surface improves adhesion. The wiring board itself has alternating layers of insulation and conductors with separated connecting terminals placed on top. A filling material is applied between these terminals, but it doesn't reach the full height of the terminals. The terminals are trapezoidal, wider at the base (where they contact the board) than at the top. A solder resist layer with openings exposes the connecting terminals and covers the wiring pattern. The wiring pattern is trapezoidal, and the terminals' base-to-top width ratio is greater.
4. The wiring board according to claim 1 , wherein the filling member functions as a solder resist.
In this wiring board, the filling material between the connecting terminals also acts as a solder resist, preventing solder from adhering to unwanted areas. The wiring board itself has alternating layers of insulation and conductors with separated connecting terminals placed on top. The filling material is applied between these terminals, but it doesn't reach the full height of the terminals. The terminals are trapezoidal, wider at the base (where they contact the board) than at the top. A solder resist layer with openings exposes the connecting terminals and covers the wiring pattern. The wiring pattern is trapezoidal, and the terminals' base-to-top width ratio is greater.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 12, 2013
July 4, 2017
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