A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.
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1. A substrate treating method, comprising: projecting, from a nozzle, a pressurized fluid containing an abrasive onto a substrate, the substrate comprising a first layer, the pressurized fluid softening the first layer and the abrasive removing the softened first layer thereby polishing the substrate, wherein a rate of the polishing of the substrate is proportional to a pressure of the pressurized fluid.
A method for polishing a substrate involves directing a pressurized fluid containing abrasive particles from a nozzle onto the substrate. The substrate has a first layer that is softened by the fluid, and the abrasive particles remove this softened layer, thereby polishing the substrate. The rate at which the substrate is polished is directly related to the pressure of the fluid.
2. The method of claim 1 , wherein the fluid is projected onto a non-patterned surface of the substrate.
The substrate polishing method involving directing a pressurized fluid containing abrasive particles onto a substrate, where the fluid softens a first layer for removal by the abrasive to polish the substrate, and polishing rate is proportional to fluid pressure, is specifically applied to a substrate's non-patterned surface.
3. The method of claim 1 , wherein the fluid is projected onto a contamination region of the substrate.
The substrate polishing method involving directing a pressurized fluid containing abrasive particles onto a substrate, where the fluid softens a first layer for removal by the abrasive to polish the substrate, and polishing rate is proportional to fluid pressure, is specifically applied to a contamination region of the substrate.
4. The method of claim 3 , wherein the fluid is projected onto a bevel region of the substrate.
The substrate polishing method involving directing a pressurized fluid containing abrasive particles onto a substrate, where the fluid softens a first layer for removal by the abrasive to polish the substrate, polishing rate is proportional to fluid pressure, and the fluid is projected onto a contamination region of the substrate, is further refined by projecting the fluid onto the bevel region of the substrate.
5. The method of claim 1 , wherein the softening of the first layer is caused by a chemical included in the projected fluid.
The substrate polishing method involving directing a pressurized fluid containing abrasive particles onto a substrate, where the fluid softens a first layer for removal by the abrasive to polish the substrate, and polishing rate is proportional to fluid pressure, uses a fluid that softens the first layer due to the presence of a chemical in the fluid.
6. The method of claim 5 , wherein the pressurized fluid further comprises an additive, wherein polishing the substrate further comprises attaching the additive onto a surface of the substrate or onto a second layer provided on the substrate, and wherein the additive prevents the surface of the substrate or the second layer from being removed by the abrasive when the first layer is removed.
The substrate polishing method using pressurized fluid with abrasive particles to polish a substrate by softening and removing a first layer, where polishing rate is pressure-dependent, and the fluid includes a chemical to soften the first layer, further includes an additive in the pressurized fluid. This additive attaches to the substrate surface or a second layer on the substrate. The additive's purpose is to prevent the abrasive from removing the substrate surface or the second layer during the first layer's removal.
7. The method of claim 1 , further comprising rotating the substrate.
The substrate polishing method involving directing a pressurized fluid containing abrasive particles onto a substrate, where the fluid softens a first layer for removal by the abrasive to polish the substrate, and polishing rate is proportional to fluid pressure, also includes rotating the substrate during the polishing process.
8. The method of claim 1 , wherein the abrasive comprises silica, ceria, or alumina.
The substrate polishing method involving directing a pressurized fluid containing abrasive particles onto a substrate, where the fluid softens a first layer for removal by the abrasive to polish the substrate, and polishing rate is proportional to fluid pressure, uses abrasive particles made of silica, ceria, or alumina.
9. A substrate treating method, comprising: preparing a substrate comprising a first layer and a second layer; pressurizing a fluid including an abrasive and an additive; projecting the pressurized fluid onto the first layer and the second layer; softening the first layer with the pressurized fluid; and removing the first layer with the abrasive, wherein the additive is attached on a surface of the substrate or the second layer, the additive preventing the substrate and the second layer from being polished by the abrasive.
A method for polishing a substrate prepares the substrate with a first and a second layer. A pressurized fluid containing both abrasive particles and an additive is directed onto these layers. The fluid softens the first layer, which is then removed by the abrasive. The additive attaches to the substrate's surface or the second layer, preventing the abrasive from polishing or removing the substrate or the second layer.
10. The method of claim 9 , wherein the first and second layers are deposited on a bevel region of the substrate.
The substrate polishing method that prepares a substrate with a first and second layer, projects a pressurized fluid including abrasive and an additive to soften the first layer for removal while the additive protects the second layer, is refined such that the first and second layers are specifically deposited on a bevel region of the substrate.
11. The method of claim 9 , wherein the substrate is rotated while the pressurized fluid is projected onto the first and second layers.
The substrate polishing method that prepares a substrate with a first and second layer, projects a pressurized fluid including abrasive and an additive to soften the first layer for removal while the additive protects the second layer, includes rotating the substrate while the pressurized fluid is projected onto the first and second layers.
12. The method of claim 9 , wherein the abrasive comprises silica, ceria, or alumina.
The substrate polishing method that prepares a substrate with a first and second layer, projects a pressurized fluid including abrasive and an additive to soften the first layer for removal while the additive protects the second layer, specifies that the abrasive particles are composed of silica, ceria, or alumina.
13. The method of claim 9 , wherein the first and second layers are disposed on a non-patterned surface of the substrate, and the pressurized fluid is projected onto the non-patterned surface of the substrate.
The substrate polishing method that prepares a substrate with a first and second layer, projects a pressurized fluid including abrasive and an additive to soften the first layer for removal while the additive protects the second layer, specifies that the first and second layers are located on a non-patterned surface of the substrate. The pressurized fluid is then projected onto this non-patterned surface.
14. The method of claim 9 , wherein the pressurized fluid further comprises a chemical, the chemical softening the first layer.
The substrate polishing method that prepares a substrate with a first and second layer, projects a pressurized fluid including abrasive and an additive to soften the first layer for removal while the additive protects the second layer, further includes a chemical in the pressurized fluid to soften the first layer.
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December 17, 2015
August 1, 2017
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