Method and devices for testing a headphone with increased sensation are provided. The headphone can filter and amplify low frequency audio signals, which are then sent to a haptic device in the headphone. The haptic device can cause bass sensations at the top of the skull and at both ear cups. The testing system can evaluate the haptic and acoustic sensations produced by the headphone to evaluate if they have been properly assembled and calibrate the headphones if necessary.
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1. An apparatus for testing a haptic headphone comprising a headband with a right ear cup attached to one end of the headband with a right driver configured to receive a right audio signal and reproduce sound, a left ear cup attached to the other end of the headband with a left driver configured to receive a left audio signal and reproduce sound, and a haptic device attached to the headband and configured to receive a combination of the right and left audio channels and to produce vibrations, the apparatus comprising: a base; a front-headband column attached to the base; a back-headband column attached to the base; a headband bridge attached to the front-headband column on the headband bridge's one end and the back-headband column on the headband bridge's other end; a headband plate loosely attached to the top of the front-headband column on the headband plate's one end and the back-headband column on the headband plate's other end; wherein the headband plate's loose attachment comprises rods and springs; a left-front-ear-cup column attached to the base; a left-back-ear-cup column attached to the base; a left-ear-cup bridge attached to the left-front-ear-cup column on the left-ear-cup bridge's one end and the left-back-ear-cup column on the left-ear-cup bridge's other end; a left-ear-cup plate loosely attached to the side of the left-front-ear-cup column on the left-ear-cup plate's one end and the side of the left-back-ear-cup column on the left-ear-cup plate's other end; wherein the left ear-cup plate's loose attachment comprises rods and springs; a left vibration sensor attached to the left-ear-cup plate; a right-front-ear-cup column attached to the base; a right-back-ear-cup column attached to the base; a right-ear-cup bridge attached to the right-front-ear-cup column on the right-ear-cup bridge's one end and the right-back-ear-cup column on the right-ear-cup bridge's other end; a right-ear-cup plate loosely attached to the side of the right-front-ear-cup column on the right-ear-cup plate's one end and the side of the right-back-ear-cup column on the right-ear-cup plate's other end; wherein the left ear-cup plate's loose attachment comprises rods and springs; a right vibration sensor attached to the right-ear-cup plate.
A testing apparatus for haptic headphones assesses both acoustic and haptic performance. The apparatus consists of a base to which columns are attached to hold the headphone in a realistic wearing position. A front column and back column support the headband via a bridge. The headband connects to this bridge using a plate with rods and springs to allow movement. Separate columns for the left and right earcups also attach to the base with a bridge. The earcups connect to the column bridge using a plate with rods and springs to allow movement. Vibration sensors are attached to each earcup plate. The system measures how the headphones vibrate at the earcups in response to audio signals. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
2. The apparatus of claim 1 , further comprising: a headband vibration sensor attached to the headband plate.
The testing apparatus for haptic headphones described previously, which assesses both acoustic and haptic performance by using a base to which columns are attached to hold the headphone in a realistic wearing position. It has front and back columns that support the headband via a bridge with a plate attached using rods and springs to allow movement. Separate columns for the left and right earcups are attached to the base with a bridge and a plate with rods and springs to allow movement. Vibration sensors are attached to each earcup plate, now also includes a vibration sensor attached to the headband plate. This headband sensor provides data on the haptic device's vibration performance, enabling comprehensive analysis of both earcup and headband vibrations in response to audio signals. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
3. The apparatus of claim 1 , wherein the attachment of the front-headband column, back-headband column, left-front-ear-cup column, left-back-ear-cup column, right-front-ear-cup column, and right-back-ear-cup column to the base are adjustable relative to the base.
The testing apparatus for haptic headphones described previously, which assesses both acoustic and haptic performance, features adjustable columns. Specifically, the front-headband column, back-headband column, left-front-ear-cup column, left-back-ear-cup column, right-front-ear-cup column, and right-back-ear-cup column attachments to the base are adjustable. This allows the apparatus to accommodate headphones of different sizes and shapes. The adjustable columns enable precise positioning and secure mounting of the haptic headphone to be tested. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
4. The apparatus of claim 1 , wherein the front-headband column and back-headband column each comprise a headband column base and headband column extension that can adjust the height of each of the headband columns.
The testing apparatus for haptic headphones described previously, which assesses both acoustic and haptic performance, has front and back headband columns that are height-adjustable. Each column has a base and an extension which allows modifying the overall height. This adjustable height accommodates headphones with various headband sizes and allows for precise positioning within the testing apparatus. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
5. The apparatus of claim 1 , wherein the front headband column, back headband column, and headband bridge; the left-front-ear-cup column, left-back-ear-cup column, and left-ear-cup bridge; or the right-front-ear-cup column, right-back-ear-cup column, and right-ear-cup bridge are formed from a singular piece of material.
The testing apparatus for haptic headphones described previously, which assesses both acoustic and haptic performance, uses integrated column and bridge components. Either: the front headband column, back headband column, and headband bridge are formed from a singular piece of material; or the left-front-ear-cup column, left-back-ear-cup column, and left-ear-cup bridge are formed from a singular piece of material; or the right-front-ear-cup column, right-back-ear-cup column, and right-ear-cup bridge are formed from a singular piece of material. This construction simplifies assembly and enhances the structural integrity of the apparatus. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
6. The apparatus of claim 1 , wherein the front headband column, back headband column, headband bridge, left-front-ear-cup column, left-back-ear-cup column, left-ear-cup bridge, right-front-ear-cup column, right-back-ear-cup column, and right-ear-cup bridge are formed from one or more pieces of material.
The testing apparatus for haptic headphones described previously, which assesses both acoustic and haptic performance, is constructed from one or more pieces of material. The front headband column, back headband column, headband bridge, left-front-ear-cup column, left-back-ear-cup column, left-ear-cup bridge, right-front-ear-cup column, right-back-ear-cup column, and right-ear-cup bridge are all formed from one or more pieces of material. This construction describes the complete structure of the apparatus. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
7. The apparatus of claim 1 , further comprising: a pressure sensor attached to the headband plate.
The testing apparatus for haptic headphones described previously, which assesses both acoustic and haptic performance, now includes a pressure sensor attached to the headband plate. This sensor measures the pressure exerted by the headband on the plate, providing data on the headphone's fit and contact force. This data can be used to calibrate the haptic device and ensure consistent performance. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
8. The apparatus of claim 1 , further comprising: a computer operatively connected to the right vibration sensor and left vibration sensor, and configure to receive tactile vibration signals form the right vibration sensor and left vibration sensor.
The testing apparatus for haptic headphones described previously, which assesses both acoustic and haptic performance and includes right and left vibration sensors attached to the earcup plates, now includes a computer. The computer is operatively connected to the right and left vibration sensors and is configured to receive tactile vibration signals from these sensors. This allows the computer to analyze the vibration data, providing insights into the haptic performance of the headphones. The haptic headphone includes standard right and left audio drivers in earcups attached to a headband, and a haptic device on the headband that vibrates based on the audio input.
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January 29, 2015
August 8, 2017
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