An encapsulant film and an optoelectronic device are provided. The encapsulant film having improved thermal resistance, and excellent adhesion, especially, long-term adhesive properties, to a front substrate and a back sheet can be provided. Also, the optoelectronic device capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated by the encapsulant film can be provided.
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1. An encapsulant film having a ratio (S a /S m ) of 0.6 or more, of a peak area (S a ) of silanol groups and amine groups in a wavenumber range of 3,100 cm −1 to 3,600 cm −1 to a peak area (S m ) of methylene groups in a wavenumber range of 705 cm −1 to 735 cm −1 , as measured by FT-IR using an attenuated total reflection (ATR) method, and comprising a copolymer which is formed from a composition comprising: an olefin resin; an unsaturated silane compound; and an aminosilane compound, wherein the aminosilane compound is included in an amount of 1 to 40 parts by weight with respect to 100 parts by weight of the silane compound in the composition.
An encapsulant film for optoelectronic devices exhibits improved thermal resistance and adhesion to front and back sheets. This film has a specific chemical signature measured by FT-IR: the ratio of the peak area of silanol and amine groups (3100-3600 cm⁻¹) to the peak area of methylene groups (705-735 cm⁻¹) is 0.6 or greater. The film comprises a copolymer made from an olefin resin, an unsaturated silane compound, and an aminosilane compound. The aminosilane compound constitutes 1 to 40 parts by weight per 100 parts by weight of the silane compound within the composition. The film is designed to encapsulate optoelectronic elements and wiring electrodes without negatively impacting working environments or component integrity.
2. The encapsulant film of claim 1 , wherein the ratio (S a /S m ) of the peak area (S a ) of the silanol groups and amine groups to the peak area (S m ) of the methylene groups is 0.9 or more.
The encapsulant film described previously, which has improved thermal resistance and adhesion and comprises a copolymer of olefin resin, unsaturated silane, and aminosilane compounds where the ratio of the peak area of silanol and amine groups (3100-3600 cm⁻¹) to the peak area of methylene groups (705-735 cm⁻¹) is 0.6 or greater, has an even higher ratio of silanol and amine groups to methylene groups. Specifically, the ratio (Sₐ/Sₘ) of the peak area of silanol and amine groups to the peak area of methylene groups is 0.9 or more, further enhancing its encapsulating properties.
4. The encapsulant film of claim 3 , wherein α 1 is in a range of 1.5 to 4, and β 1 is in a range of 50 to 150.
An encapsulant film exhibiting specific rheological characteristics where the complex viscosity (η*) is defined by the equation η* = α 1 ω^(β 1-1) Pa·s at 85°C. The parameter α 1, influencing the magnitude of the viscosity, falls within the range of 1.5 to 4, and β 1, impacting the frequency dependence of the viscosity, falls within the range of 50 to 150. These parameters are key for achieving the desired balance of flow and stability during optoelectronic device manufacturing.
5. The encapsulant film of claim 3 , wherein α 1 is in a range of 2.3 to 3.3, and β 1 is in a range of 70 to 130.
An encapsulant film exhibiting specific rheological characteristics where the complex viscosity (η*) is defined by the equation η* = α 1 ω^(β 1-1) Pa·s at 85°C. The parameter α 1, influencing the magnitude of the viscosity, falls within the more specific range of 2.3 to 3.3, and β 1, impacting the frequency dependence of the viscosity, falls within the more specific range of 70 to 130. These narrowed parameter ranges provide an optimized balance of flow and stability during the manufacture of optoelectronic devices.
6. The encapsulant film of claim 1 , wherein the peel strength of the encapsulant film to the glass substrate is greater than or equal to 50 N/15 mm, as measured at a peel angle of 90° and a peel rate of 50 mm/min after the encapsulant film is laminated on the glass substrate at a temperature of 110° C.
The encapsulant film, comprising a copolymer of olefin resin, unsaturated silane, and aminosilane compounds where the ratio of the peak area of silanol and amine groups (3100-3600 cm⁻¹) to the peak area of methylene groups (705-735 cm⁻¹) is 0.6 or greater, exhibits strong adhesion to glass substrates. When laminated onto a glass substrate at 110°C, the peel strength of the film is at least 50 N/15 mm. This peel strength is measured at a 90° peel angle and a peel rate of 50 mm/min, ensuring robust bonding in optoelectronic device applications.
8. The encapsulant film of claim 7 , wherein the yellowness index (YI) value is in a range of 1.0 to 1.5.
An encapsulant film exhibiting a specific yellowness index (YI) value in a range of 1.0 to 1.5. Maintaining this YI range ensures minimal color distortion and optimal light transmission properties within the encapsulant film, which is vital for performance in optoelectronic devices.
10. The encapsulant film of claim 9 , wherein R 1 and R 2 each independently represent a hydroxyl group; R 3 represents —OSiR 6 m R 7 (2-m) R 8 bound to the silicon atom; R 6 and R 7 each independently represent a hydroxyl group; R 8 represents —(CH 2 ) n NR 11 R 12 bound to the silicon atom; R 11 represents hydrogen; R 12 represents R 13 NH 2 ; and R 13 represents alkylene group.
An unsaturated silane compound used in the encapsulant film has a specific molecular structure defined by the formula R 1 R 2 Si(OR 3 ) 2. In this structure, R 1 and R 2 are each a hydroxyl group (OH). R 3 represents a group, —OSiR 6 m R 7 (2-m) R 8, bound to the silicon atom. R 6 and R 7 are also each a hydroxyl group (OH). R 8 is a group, —(CH 2 ) n NR 11 R 12, also bound to the silicon atom. R 11 is hydrogen (H), and R 12 is R 13 NH 2, where R 13 is an alkylene group (a saturated hydrocarbon chain), linking to an amine group.
12. The encapsulant film of claim 11 , wherein R 14 and R 15 each independently represent a hydroxyl group or —R 16 R 17 bound to a silicon atom; R 16 represents oxygen; and R 17 represents an alkyl group.
An aminosilane compound for the encapsulant film has a chemical structure defined by the formula R 14 R 15 Si(OR 18 ) 2. In this structure, R 14 and R 15 are each independently a hydroxyl group (OH) or —R 16 R 17 group bound to a silicon atom. R 16 is oxygen (O), and R 17 is an alkyl group (a saturated hydrocarbon chain).
13. An optoelectronic device comprising: a front substrate; a back sheet; the encapsulant film stacked between the front substrate and the back sheet as defined in claim 1 ; and an optoelectronic element encapsulated by the encapsulant film.
An optoelectronic device consists of a front substrate, a back sheet, and an optoelectronic element, all encapsulated by a film between the front substrate and the back sheet. The encapsulant film comprises a copolymer made from an olefin resin, an unsaturated silane compound, and an aminosilane compound. The aminosilane compound constitutes 1 to 40 parts by weight per 100 parts by weight of the silane compound within the composition. The film has a ratio (Sₐ/Sₘ) of 0.6 or more, where Sₐ is the peak area of silanol and amine groups (3100-3600 cm⁻¹) and Sₘ is the peak area of methylene groups (705-735 cm⁻¹), measured by FT-IR using ATR.
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December 24, 2013
August 15, 2017
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