A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part having a base part with an optical path and a transparent member on the base part and connected to the optical path, and supports, by the transparent member, a region under a targeted electrode in the substrate; a crimping tool arranged over the transparent member and presses the component to the substrate; a light irradiating part that irradiates the adhesive member attached to the targeted electrode with light through the optical path; and a light shielding member that covers a portion in which the transparent member is not installed in an opening part of the optical path in the base part.
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1. A component crimping apparatus comprising: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of a plurality of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; at least one supporting part that has a base part provided with an optical path opened in an upper surface, and a transparent member installed on the upper surface of the base part and connected to the optical path, and supports, by the transparent member, a region under a targeted electrode in a lower surface of the substrate held by the substrate holding part, the targeted electrode being an electrode targeted for crimping the component among the plurality of electrodes; at least one crimping tool that is arranged over the transparent member and presses the component to the substrate whose lower surface is supported by the supporting part; a light irradiating part that irradiates the adhesive member attached to the targeted electrode with light from a lower surface side of the substrate through the transparent member by irradiating the optical path with the light when the crimping tool presses the component to the substrate; and a light shielding member that covers a portion in which the transparent member is not installed in an opening part of the optical path in the upper surface of the base part.
The component crimping apparatus is a device for attaching small components to transparent substrates, like glass, which have multiple electrodes along an edge. The device uses a holder for the substrate, and a support underneath a specific electrode targeted for component attachment. This support has a base with a built-in light path and a transparent window on top of the base, aligned with the light path, to support the substrate. A crimping tool presses the component onto the substrate above the transparent window. A light source shines light through the optical path and transparent window to cure a light-sensitive adhesive that glues the component to the electrode. A shield blocks stray light from escaping the optical path where the transparent window isn't present.
2. The component crimping apparatus according to claim 1 , wherein the transparent member is configured slidably in a horizontal direction with respect to the upper surface of the base part.
The component crimping apparatus, as described previously, has a transparent window within the support that can slide horizontally relative to the support base's upper surface. This sliding functionality allows for fine-tuned adjustments in the positioning of the transparent member relative to the substrate's targeted electrode during the component crimping process. This facilitates precise alignment and optimal light exposure for curing the adhesive.
3. The component crimping apparatus according to claim 1 , wherein a plurality of the transparent members and the crimping tools are respectively juxtaposed in a direction of arrangement of the electrodes when the substrate is supported by the supporting part.
The component crimping apparatus, as described previously, uses multiple transparent windows and crimping tools. These are arranged side-by-side, aligned with the direction the electrodes are placed on the substrate. This allows for simultaneously crimping components onto multiple electrodes in a single operation, increasing the speed and efficiency of component attachment to the transparent substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 21, 2015
August 22, 2017
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