An electronic component package includes: a core including a cavity, a first resin layer, a second resin layer and a reinforcing layer disposed between the first resin layer and the second resin layer; and an electronic component disposed in the cavity, wherein a thickness of the first resin layer is different from a thickness of the second resin layer.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An electronic component package, comprising: a core comprising a cavity, a first resin layer, a second resin layer and a reinforcing layer deposed between the first resin layer and the second resin layer; and an electronic component disposed in the cavity, and comprising a semiconductor layer and a passivation layer disposed on at least one surface of the semiconductor layer, wherein a thickness of the first resin layer is different from a thickness of the second resin layer, wherein the passivation layer comprises a coefficient of thermal expansion that is greater than a coefficient of thermal expansion of the semiconductor layer, wherein the first resin layer is disposed toward a first side of the electronic component at which the passivation layer is positioned and the second resin layer is disposed toward a second side of the electronic component that is opposite to the first side of the electronic component, and wherein the second resin layer is thicker than the first resin layer.
An electronic component package contains a core with a cavity. The core has a first resin layer, a second resin layer, and a reinforcing layer between them. An electronic component, featuring a semiconductor layer and a passivation layer on at least one surface, sits inside the cavity. The first resin layer's thickness differs from the second resin layer's. The passivation layer's thermal expansion coefficient exceeds that of the semiconductor layer. The first resin layer is on the passivation layer side of the electronic component, while the second resin layer is on the opposite side, with the second resin layer being thicker than the first.
2. The electronic component package of claim 1 , wherein the first resin layer, the second resin layer and the passivation layer are formed of a same material.
The electronic component package, which contains a core with a cavity; the core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component with a semiconductor layer and a passivation layer on at least one surface, located inside the cavity; where the first resin layer's thickness differs from the second resin layer's; the passivation layer's thermal expansion coefficient exceeds that of the semiconductor layer; the first resin layer is on the passivation layer side of the electronic component and the second resin layer is on the opposite side, the second resin layer being thicker than the first; has the first resin layer, second resin layer, and passivation layer all made from the same material.
3. The electronic component package of claim 1 , further comprising a circuit pattern connected to the electronic component through a conducive via which passes through the passivation layer.
The electronic component package, which contains a core with a cavity; the core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component with a semiconductor layer and a passivation layer on at least one surface, located inside the cavity; where the first resin layer's thickness differs from the second resin layer's; the passivation layer's thermal expansion coefficient exceeds that of the semiconductor layer; the first resin layer is on the passivation layer side of the electronic component and the second resin layer is on the opposite side, the second resin layer being thicker than the first; also includes a circuit pattern connected to the electronic component via a conductive via that passes through the passivation layer.
4. The electronic component package of claim 1 , wherein the reinforcing layer comprises a glass cloth.
The electronic component package, which contains a core with a cavity; the core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component with a semiconductor layer and a passivation layer on at least one surface, located inside the cavity; where the first resin layer's thickness differs from the second resin layer's; the passivation layer's thermal expansion coefficient exceeds that of the semiconductor layer; the first resin layer is on the passivation layer side of the electronic component and the second resin layer is on the opposite side, the second resin layer being thicker than the first; has a reinforcing layer made from a glass cloth.
5. The electronic component package of claim 1 , further comprising a molding part disposed in the cavity and surrounding the electronic component.
The electronic component package, which contains a core with a cavity; the core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component with a semiconductor layer and a passivation layer on at least one surface, located inside the cavity; where the first resin layer's thickness differs from the second resin layer's; the passivation layer's thermal expansion coefficient exceeds that of the semiconductor layer; the first resin layer is on the passivation layer side of the electronic component and the second resin layer is on the opposite side, the second resin layer being thicker than the first; also includes a molding part inside the cavity that surrounds the electronic component.
6. The electronic component package of claim 1 , wherein the electronic component is configured to have warpage in the thickness direction of the core in response to a temperature change.
The electronic component package, which contains a core with a cavity; the core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component with a semiconductor layer and a passivation layer on at least one surface, located inside the cavity; where the first resin layer's thickness differs from the second resin layer's; the passivation layer's thermal expansion coefficient exceeds that of the semiconductor layer; the first resin layer is on the passivation layer side of the electronic component and the second resin layer is on the opposite side, the second resin layer being thicker than the first; has an electronic component designed to warp in the core's thickness direction when the temperature changes.
7. The electronic component package of claim 1 , wherein the core is configured to have warpage in a direction opposite to the direction of the warpage of the electronic component in response to a temperature change.
The electronic component package, which contains a core with a cavity; the core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component with a semiconductor layer and a passivation layer on at least one surface, located inside the cavity; where the first resin layer's thickness differs from the second resin layer's; the passivation layer's thermal expansion coefficient exceeds that of the semiconductor layer; the first resin layer is on the passivation layer side of the electronic component and the second resin layer is on the opposite side, the second resin layer being thicker than the first; has a core designed to warp in the opposite direction of the electronic component's warpage when the temperature changes.
8. An electronic component package, comprising: a core comprising a first resin layer, a second resin layer and a reinforcing layer disposed between the first resin layer and the second resin layer; and an electronic component disposed in the core and comprising a passivation layer disposed at a passivation layer side of the electronic component in a thickness direction of the electronic component, and a semiconductor layer disposed at a semiconductor layer side of the electronic component in the thickness direction of the electronic component, wherein the first resin layer is positioned toward the passivation layer side of the electronic component and the second resin layer is positioned toward the semiconductor layer side of the electronic component, and wherein a thickness of the first resin layer is different than a thickness of the second resin layer.
An electronic component package includes a core with a first resin layer, a second resin layer, and a reinforcing layer between them. An electronic component is embedded within the core. This component consists of a passivation layer on one side (passivation layer side) and a semiconductor layer on the opposite side (semiconductor layer side). The first resin layer is positioned toward the passivation layer side, and the second resin layer is positioned toward the semiconductor layer side. The thickness of the first resin layer is different from the thickness of the second resin layer.
9. The electronic component package of claim 8 , wherein a coefficient of thermal expansion of the reinforcing layer is less than a coefficient of thermal expansion of the first resin layer and a coefficient of thermal expansion of the second resin layer.
The electronic component package, which contains a core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component consisting of a passivation layer and a semiconductor layer; where the first resin layer is on the passivation layer side and the second resin layer is on the semiconductor layer side; and the thickness of the first resin layer differs from the thickness of the second resin layer; has a reinforcing layer with a coefficient of thermal expansion that is less than both the first resin layer's and the second resin layer's thermal expansion coefficients.
10. The electronic component package of claim 9 , wherein the first resin layer, the second resin layer and the passivation layer are formed of a same material.
The electronic component package, which contains a core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component consisting of a passivation layer and a semiconductor layer; where the first resin layer is on the passivation layer side and the second resin layer is on the semiconductor layer side; the thickness of the first resin layer differs from the thickness of the second resin layer; and the reinforcing layer's thermal expansion coefficient is less than both the first and second resin layers' thermal expansion coefficients; has the first resin layer, second resin layer, and passivation layer all made from the same material.
11. The electronic component package of claim 9 , wherein the thickness of the second resin layer is greater than the thickness of the first resin layer.
The electronic component package, which contains a core with a first resin layer, a second resin layer, and a reinforcing layer between them; an electronic component consisting of a passivation layer and a semiconductor layer; where the first resin layer is on the passivation layer side and the second resin layer is on the semiconductor layer side; the thickness of the first resin layer differs from the thickness of the second resin layer; and the reinforcing layer's thermal expansion coefficient is less than both the first and second resin layers' thermal expansion coefficients; has a second resin layer that is thicker than the first resin layer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
July 8, 2016
October 10, 2017
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