Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A stiffener tape for a wafer, the stiffener tape comprising: a mounting tape; a metallic stiffener removably attached to the mounting tape; and a die attach film attached to the stiffener, wherein the mounting tape, the die attach film and the metallic stiffener are formed into a roll and the metallic stiffener is between the mounting tape and the die attach film.
A stiffener tape designed for use with wafers in electronic assembly. This tape consists of a mounting tape, a metallic stiffener that can be removed from the mounting tape, and a die attach film that adheres to the stiffener. The mounting tape, stiffener, and die attach film are rolled together such that the metallic stiffener is positioned between the mounting tape and the die attach film within the roll.
2. The stiffener tape of claim 1 , wherein the mounting tape is a polymer film.
The stiffener tape as described in the previous stiffener tape description has a mounting tape that is made from a polymer film material. Specifically, the stiffener tape includes a mounting tape; a metallic stiffener removably attached to the mounting tape; and a die attach film attached to the stiffener, wherein the mounting tape, the die attach film and the metallic stiffener are formed into a roll and the metallic stiffener is between the mounting tape and the die attach film.
3. The stiffener tape of claim 1 , wherein the die attach film is an adhesive.
The stiffener tape as described in the previous stiffener tape description has a die attach film that functions as an adhesive. Specifically, the stiffener tape includes a mounting tape; a metallic stiffener removably attached to the mounting tape; and a die attach film attached to the stiffener, wherein the mounting tape, the die attach film and the metallic stiffener are formed into a roll and the metallic stiffener is between the mounting tape and the die attach film.
4. The stiffener tape of claim 1 , wherein the metallic stiffener is a metal foil.
The stiffener tape as described in the previous stiffener tape description has a metallic stiffener that is a metal foil. Specifically, the stiffener tape includes a mounting tape; a metallic stiffener removably attached to the mounting tape; and a die attach film attached to the stiffener, wherein the mounting tape, the die attach film and the metallic stiffener are formed into a roll and the metallic stiffener is between the mounting tape and the die attach film.
5. The stiffener tape of claim 1 , wherein a size of the metallic stiffener is larger than a size of the wafer.
The stiffener tape as described in the previous stiffener tape description has a metallic stiffener that is larger in size than the wafer it is intended to support. Specifically, the stiffener tape includes a mounting tape; a metallic stiffener removably attached to the mounting tape; and a die attach film attached to the stiffener, wherein the mounting tape, the die attach film and the metallic stiffener are formed into a roll and the metallic stiffener is between the mounting tape and the die attach film.
6. A method comprising forming a stiffener tape into a roll, wherein the stiffener tape includes a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film.
A method for creating a stiffener tape. The method involves forming the stiffener tape into a roll. The stiffener tape itself includes a mounting tape, a metallic stiffener that can be removed from the mounting tape, and a die attach film that adheres to the metallic stiffener. The metallic stiffener is positioned between the mounting tape and the die attach film within the roll.
7. The method of claim 6 , further comprising: unrolling the roll of stiffener tape; and attaching the stiffener tape to a wafer.
The method of creating a stiffener tape as described in the previous method description further includes unrolling the roll of stiffener tape, which consists of a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film; and attaching the stiffener tape to a wafer.
8. The method of claim 7 , further comprising attaching a back-grind tape to the wafer before attaching the stiffener tape to the wafer.
The method of creating and using a stiffener tape as described in the previous method description further includes attaching a back-grind tape to the wafer before attaching the stiffener tape, which consists of a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film, to the wafer.
9. The method of claim 8 , further comprising thinning the wafer after attaching the back-grind tape to the wafer.
The method of creating and using a stiffener tape as described in the previous method description further includes thinning the wafer after attaching a back-grind tape to the wafer and before attaching the stiffener tape, which consists of a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film, to the wafer.
10. The method of claim 9 , wherein attaching the stiffener ape to the wafer includes attaching the stiffener tape to the thinned wafer.
In the method of creating and using a stiffener tape as described in the previous method description, attaching the stiffener tape, which consists of a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film, to the wafer includes attaching the stiffener tape to the thinned wafer after attaching a back-grind tape to the wafer and thinning.
11. The method of claim 10 , further comprising removing the back-grind tape from the thinned wafer.
The method of creating and using a stiffener tape as described in the previous method description further includes removing the back-grind tape from the thinned wafer after attaching the stiffener tape, which consists of a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film, to the wafer.
12. The method of claim 7 , further comprising singulating the wafer.
The method of creating and using a stiffener tape as described in the previous method description further includes singulating the wafer after attaching the stiffener tape, which consists of a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film, to the wafer.
13. The method of claim 12 , wherein singulating the wafer includes dicing the wafer with two cutting blades.
In the method of creating and using a stiffener tape as described in the previous method description, singulating the wafer after attaching the stiffener tape, which consists of a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener such that the metallic stiffener is between the mounting tape and the die attach film, includes dicing the wafer with two cutting blades.
14. A method comprising: forming a stiffener tape that includes a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener, wherein the metallic stiffener is between the mounting tape and the die attach film; and attaching the stiffener tape to the wafer.
A method for using a stiffener tape that includes forming a stiffener tape comprising a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener, wherein the metallic stiffener is between the mounting tape and the die attach film; and attaching the stiffener tape to the wafer.
15. The method of claim 14 , further comprising attaching a back-grind tape to the wafer before attaching the stiffener tape to the wafer.
The method of using a stiffener tape as described in the previous method description further includes attaching a back-grind tape to the wafer before attaching the stiffener tape, which includes a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener, wherein the metallic stiffener is between the mounting tape and the die attach film.
16. The method of claim 14 , further comprising: thinning the wafer after attaching the back-grind tape to the wafer; removing the back-grind tape from the thinned wafer; and singulating the wafer.
The method of using a stiffener tape as described in the previous method description further includes thinning the wafer after attaching a back-grind tape to the wafer and before attaching the stiffener tape, which includes a mounting tape, a metallic stiffener removably attached to the mounting tape and a die attach film attached to the metallic stiffener, wherein the metallic stiffener is between the mounting tape and the die attach film; removing the back-grind tape from the thinned wafer; and singulating the wafer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 12, 2014
October 17, 2017
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.