A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board. The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A printed wiring board, comprising: a first circuit board having a first surface and a second surface on an opposite side with respect to the first surface; and a second circuit board having a third surface and a fourth surface on an opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board, wherein the first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board comprises reinforcing material and has an opening portion exposing the mounting area of the second circuit board, the second circuit board comprises a first resin insulating layer having a plurality of first via openings extending from an upper surface to a lower surface of the first resin insulating layer, a first inner conductive layer formed on the lower surface of the first resin insulating layer, and a plurality of first via conductors formed in the plurality of first via openings of the first resin insulating layer, respectively, the upper surface of the first resin insulating layer is forming the third surface of the second circuit board, each of the first via conductors has a bottom portion exposed in the opening portion of the first circuit board such that the bottom portion of each of the first via conductors is forming a mounting pad positioned to mount an electronic component, the bottom portion of each of the first via conductors is formed such that the bottom portion is recessed from the third surface of the second circuit board, and each of the first via conductors comprises a seed layer formed on a side wall of a respective one of the first via openings and an electrolytic plating layer formed on the seed layer such that the bottom portion of each of the first via conductors has the electrolytic plating layer and the seed layer surrounding the electrolytic plating layer and that the seed layer in the bottom portion is recessed from the electrolytic plating layer.
A printed circuit board comprises two boards laminated together. The first board has a top and bottom surface, includes reinforcing material, and features a hole exposing a mounting area on the second board. The second board has a top and bottom surface, where the top surface forms the mounting area. The second board also includes a resin insulating layer with vias, an inner conductive layer below the resin, and conductive vias in the insulating layer's via holes. The vias' bottoms are exposed in the first board's hole, forming mounting pads for components. The via bottoms are recessed slightly from the second board's top surface. Each via includes a seed layer on the via hole sidewall and an electrolytic plating layer on the seed layer, with the seed layer recessed within the plating layer at the via bottom.
2. The printed wiring board according to claim 1 , wherein each of the first via openings is tapering from the lower surface toward the upper surface of the first resin insulating layer such than each of the first via conductors is tapering from the lower surface toward the upper surface of the first resin insulating layer.
The printed circuit board, as described above, features vias within the resin insulating layer of the second board that are tapered. These via holes narrow from the bottom surface of the resin insulating layer towards its top surface. Consequently, the conductive vias themselves also taper from bottom to top.
3. The printed wiring board according to claim 1 , wherein the opening portion of the first circuit board is formed such that the opening portion is tapering from the second surface toward the first surface of the first circuit board.
The printed circuit board, as described above, has a hole in the first circuit board that is tapered. This opening becomes wider from the top surface (opposite the second board) towards the bottom surface (facing the second board).
4. The printed wiring board according to claim 1 , wherein the second circuit board has a recessed portion connected to the opening portion of the first circuit board.
The printed circuit board, as described above, includes a recessed portion on the second circuit board. This recessed section is connected to the opening in the first circuit board, creating a contiguous depression where components can be mounted.
5. The printed wiring board according to claim 1 , wherein the second circuit board has a recessed portion formed in the opening portion of the first circuit board.
The printed circuit board, as described above, includes a recessed portion on the second circuit board that is positioned within the opening of the first circuit board.
6. The printed wiring board according to claim 2 , wherein the opening portion of the first circuit board is formed such that the opening portion is tapering from the second surface toward the first surface of the first circuit board.
The printed circuit board, as described where the vias within the resin insulating layer of the second board are tapered and the opening in the first circuit board is tapered. The via holes narrow from the bottom surface of the resin insulating layer towards its top surface and the opening in the first circuit board becomes wider from the top surface (opposite the second board) towards the bottom surface (facing the second board).
7. The printed wiring board according to claim 2 , wherein the second circuit board has a recessed portion connected to the opening portion of the first circuit board.
The printed circuit board, as described where the vias within the resin insulating layer of the second board are tapered, includes a recessed portion on the second circuit board. This recessed section is connected to the opening in the first circuit board, creating a contiguous depression where components can be mounted.
8. The printed wiring board according to claim 2 , wherein the second circuit board has a recessed portion formed in the opening portion of the first circuit board.
The printed circuit board, as described where the vias within the resin insulating layer of the second board are tapered, includes a recessed portion on the second circuit board that is positioned within the opening of the first circuit board.
9. The printed wiring board according to claim 3 , wherein the second circuit board has a recessed portion connected to the opening portion of the first circuit board.
The printed circuit board, as described where the opening in the first circuit board is tapered, includes a recessed portion on the second circuit board. This recessed section is connected to the opening in the first circuit board, creating a contiguous depression where components can be mounted.
10. The printed wiring board according to claim 3 , wherein the second circuit board has a recessed portion formed in the opening portion of the first circuit board.
The printed circuit board, as described where the opening in the first circuit board is tapered, includes a recessed portion on the second circuit board that is positioned within the opening of the first circuit board.
11. The printed wiring board according to claim 7 , wherein the opening portion of the first circuit board is formed such that the opening portion is tapering from the second surface toward the first surface of the first circuit board.
The printed circuit board, as described where the second circuit board has a recessed portion connected to the opening portion of the first circuit board, and the opening portion of the first circuit board is formed such that the opening portion is tapering from the second surface toward the first surface of the first circuit board. This means the opening in the first board widens from its top surface (opposite the second board) to its bottom surface (facing the second board), and the second board features a recessed area connected to this tapered opening.
12. A printed wiring board, comprising: a first circuit board having a first surface and a second surface on an opposite side with respect to the first surface; and a second circuit board having a third surface and a fourth surface on an opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board, wherein the first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board comprises reinforcing material and has an opening portion exposing the mounting area of the second circuit board, the second circuit board comprises a first resin insulating layer having a plurality of first via openings extending from an upper surface to a lower surface of the first resin insulating layer, a first inner conductive layer formed on the lower surface of the first resin insulating layer, and a plurality of first via conductors formed in the plurality of first via openings of the first resin insulating layer, respectively, the upper surface of the first resin insulating layer is forming the third surface of the second circuit board, each of the first via conductors has a bottom portion exposed in the opening portion of the first circuit board such that the bottom portion of each of the first via conductors is forming a mounting pad positioned to mount an electronic component, and each of the first via conductors comprises a seed layer formed on a side wall of a respective one of the first via openings and an electrolytic plating layer formed on the seed layer such that the bottom portion of each of the first via conductors has the electrolytic plating layer and the seed layer surrounding the electrolytic plating layer and that the seed layer in the bottom portion is recessed from the electrolytic plating layer.
A printed circuit board comprises two boards laminated together. The first board has a top and bottom surface, includes reinforcing material, and features a hole exposing a mounting area on the second board. The second board has a top and bottom surface, where the top surface forms the mounting area. The second board also includes a resin insulating layer with vias, an inner conductive layer below the resin, and conductive vias in the insulating layer's via holes. The vias' bottoms are exposed in the first board's hole, forming mounting pads for components. Each via includes a seed layer on the via hole sidewall and an electrolytic plating layer on the seed layer, with the seed layer recessed within the plating layer at the via bottom.
13. The printed wiring board according to claim 12 , wherein each of the first via openings is tapering from the lower surface toward the upper surface of the first resin insulating layer such than each of the first via conductors is tapering from the lower surface toward the upper surface of the first resin insulating layer.
The printed circuit board, as described above, features vias within the resin insulating layer of the second board that are tapered. These via holes narrow from the bottom surface of the resin insulating layer towards its top surface. Consequently, the conductive vias themselves also taper from bottom to top.
14. The printed wiring board according to claim 12 , wherein the opening portion of the first circuit board is formed such that the opening portion is tapering from the second surface toward the first surface of the first circuit board.
The printed circuit board, as described above, has a hole in the first circuit board that is tapered. This opening becomes wider from the top surface (opposite the second board) towards the bottom surface (facing the second board).
15. The printed wiring board according to claim 12 , wherein the second circuit board has a recessed portion connected to the opening portion of the first circuit board.
The printed circuit board, as described above, includes a recessed portion on the second circuit board. This recessed section is connected to the opening in the first circuit board, creating a contiguous depression where components can be mounted.
16. The printed wiring board according to claim 12 , wherein the second circuit board has a recessed portion formed in the opening portion of the first circuit board.
The printed circuit board, as described above, includes a recessed portion on the second circuit board that is positioned within the opening of the first circuit board.
17. The printed wiring board according to claim 13 , wherein the opening portion of the first circuit board is formed such that the opening portion is tapering from the second surface toward the first surface of the first circuit board.
The printed circuit board, as described where the vias within the resin insulating layer of the second board are tapered, has a hole in the first circuit board that is tapered. The via holes narrow from the bottom surface of the resin insulating layer towards its top surface and the opening in the first circuit board becomes wider from the top surface (opposite the second board) towards the bottom surface (facing the second board).
18. The printed wiring board according to claim 13 , wherein the second circuit board has a recessed portion connected to the opening portion of the first circuit board.
The printed circuit board, as described where the vias within the resin insulating layer of the second board are tapered, includes a recessed portion on the second circuit board. This recessed section is connected to the opening in the first circuit board, creating a contiguous depression where components can be mounted.
19. The printed wiring board according to claim 13 , wherein the second circuit board has a recessed portion formed in the opening portion of the first circuit board.
The printed circuit board, as described where the vias within the resin insulating layer of the second board are tapered, includes a recessed portion on the second circuit board that is positioned within the opening of the first circuit board.
20. The printed wiring board according to claim 14 , wherein the second circuit board has a recessed portion connected to the opening portion of the first circuit board.
The printed circuit board, as described where the opening in the first circuit board is tapered, includes a recessed portion on the second circuit board. This recessed section is connected to the opening in the first circuit board, creating a contiguous depression where components can be mounted.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 16, 2015
October 17, 2017
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