A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A tool comprising: a ring shape chamber unit having an inner cylindrical wall and an outer cylindrical wall, wherein the inner cylindrical wall and the outer cylindrical wall defines the ring shape chamber; a wafer lifting system disposed in the ring shape chamber, wherein the wafer lifting system comprises a wafer holder configured to support a wafer and a lifting pin coupled to the wafer holder; a heater coupled to the ring shape chamber unit, and configured to heat the wafer; and an exhausting unit coupled to the ring shape chamber unit, and configured to exhaust gas in the ring shape chamber, wherein the heater is disposed between the exhausting unit and the wafer lifting system, and the wafer lifting system is configured to move the wafer in a spiral motion and to provide varying vertical distance between the heater and the wafer by vertically moving the lifting pin as the wafer lifting system moves in a spiral motion within the ring shape chamber.
A reflow tool uses a ring-shaped chamber with inner and outer cylindrical walls. A wafer lifting system inside the chamber holds and moves a wafer. This system includes a wafer holder and a lifting pin. A heater, positioned between an exhaust unit and the wafer lifting system, heats the wafer. An exhaust unit removes gases from the chamber. The lifting system moves the wafer in a spiral path while simultaneously adjusting the vertical distance between the wafer and the heater by raising or lowering the lifting pin during the spiral motion.
2. The tool of claim 1 , further comprising a jet system coupled to the ring shape chamber unit, and configured to jet a deoxidizing gas on the wafer.
The reflow tool described above also includes a jet system connected to the ring-shaped chamber. This jet system sprays a deoxidizing gas onto the wafer.
3. The tool of claim 2 , wherein the jet system is disposed on the inner cylindrical wall and the outer cylindrical wall of the ring shape chamber unit to jet the deoxidizing gas into the ring shape chamber.
In the reflow tool with the deoxidizing gas jetting system, the gas jets are located on the inner and outer cylindrical walls of the ring-shaped chamber. This allows the deoxidizing gas to be sprayed directly into the chamber.
4. The tool of claim 1 , wherein the ring shape chamber unit comprises: a first thermal zone, a second thermal zone and a third thermal zone which are disposed side by side in the ring shape chamber to form a circle.
In the reflow tool, the ring-shaped chamber is divided into three thermal zones (first, second, and third). These zones are arranged side-by-side to form a circular configuration within the ring chamber.
5. The tool of claim 1 , wherein the heater is disposed above the ring shape chamber unit.
In the reflow tool, the heater is positioned above the ring-shaped chamber.
6. The tool of claim 5 , wherein the ring shape chamber unit is covered by the heater.
In the reflow tool, with the heater positioned above the ring-shaped chamber, the heater completely covers the ring-shaped chamber.
7. The tool of claim 6 , wherein the heater has a plurality of temperature zones.
In the reflow tool with the heater positioned above and covering the ring-shaped chamber, the heater has multiple independently controllable temperature zones.
8. The tool of claim 5 , wherein the heater has a plurality of slits, and the exhausting unit is configured to exhaust gas in the ring shape chamber through the plurality of slits.
In the reflow tool with the heater positioned above the ring-shaped chamber, the heater contains multiple slits. The exhaust unit removes gases from the ring-shaped chamber through these slits.
9. The tool of claim 1 , further comprising: a buffer zone coupled to the ring shape chamber unit; and at least one front opening unified pod coupled to the buffer zone, wherein the buffer zone is configured to transfer the wafer between the front opening unified pod and the wafer lifting system.
The reflow tool includes a buffer zone connected to the ring-shaped chamber. At least one front opening unified pod (FOUP) is connected to the buffer zone. The buffer zone transfers wafers between the FOUP and the wafer lifting system.
10. The tool of claim 9 , wherein the buffer zone comprises: a first buffer zone coupled to the ring shape chamber unit, and configured to transfer the wafer from the front opening unified pod to the wafer lifting system; and a second buffer zone coupled to the ring shape chamber unit, and configured to transfer the wafer from the wafer lifting system to the front opening unified pod.
In the reflow tool with the buffer zone, the buffer zone consists of a first buffer zone that moves wafers from the FOUP to the wafer lifting system and a second buffer zone that moves wafers from the wafer lifting system back to the FOUP.
11. A tool comprising: a ring shape chamber unit having an inner cylindrical wall and an outer cylindrical wall, wherein the inner cylindrical wall and the outer cylindrical wall defines a ring shape chamber; a wafer lifting system disposed in the ring shape chamber, wherein the wafer lifting system comprises a wafer holder configured to support a wafer and a lifting pin coupled to the wafer holder; a heater coupled to the ring shape chamber unit, and configured to heat the wafer; a jet system coupled to the ring shape chamber unit, and configured to jet a deoxidizing gas on the wafer; and an exhausting unit coupled to the ring shape chamber unit, and configured to exhaust gas in the ring shape chamber, wherein the heater is disposed between the exhausting unit and the wafer lifting system, and the wafer lifting system is configured to move the wafer in a spiral motion and to provide varying vertical distance between the heater and the wafer by vertically moving the lifting pin as the wafer lifting system moves in a spiral motion within the ring shape chamber.
A reflow tool uses a ring-shaped chamber with inner and outer cylindrical walls. A wafer lifting system inside the chamber holds and moves a wafer. This system includes a wafer holder and a lifting pin. A heater, positioned between an exhaust unit and the wafer lifting system, heats the wafer. A jet system sprays deoxidizing gas onto the wafer. An exhaust unit removes gases from the chamber. The lifting system moves the wafer in a spiral path while simultaneously adjusting the vertical distance between the wafer and the heater by raising or lowering the lifting pin during the spiral motion.
12. A tool comprising: a ring shape chamber unit having an inner cylindrical wall and an outer cylindrical wall, wherein the inner cylindrical wall and the outer cylindrical wall defines a ring shape chamber; at least one front opening unified pod coupled to the ring shape chamber unit; a wafer lifting system disposed in the ring shape chamber, wherein the wafer lifting system comprises a wafer holder configured to support a wafer and a lifting pin coupled to the wafer holder; a heater coupled to the ring shape chamber unit, and configured to heat the wafer; and an exhausting unit configured to exhaust gas in the ring shape chamber, wherein the heater is disposed between the exhausting unit and the wafer lifting system, wherein the wafer lifting system is configured to move the wafer in a spiral motion and to provide varying vertical distance between the heater and the wafer by vertically moving the lifting pin as the wafer lifting system moves in a spiral motion within the ring shape chamber.
A reflow tool uses a ring-shaped chamber with inner and outer cylindrical walls. At least one front opening unified pod (FOUP) is connected to the ring-shaped chamber. A wafer lifting system inside the chamber holds and moves a wafer. This system includes a wafer holder and a lifting pin. A heater, positioned between an exhaust unit and the wafer lifting system, heats the wafer. An exhaust unit removes gases from the chamber. The lifting system moves the wafer in a spiral path while simultaneously adjusting the vertical distance between the wafer and the heater by raising or lowering the lifting pin during the spiral motion.
13. The tool of claim 12 , further comprising a buffer zone connected to the front opening unified pod and the ring shape chamber.
The reflow tool with a FOUP connected to the ring-shaped chamber includes a buffer zone that connects the FOUP and the ring-shaped chamber. This buffer zone acts as an intermediary for wafer transfer.
14. The tool of claim 13 , wherein the lifting pin is further movable in the buffer zone.
In the reflow tool with the buffer zone, the lifting pin that moves the wafer holder is also capable of moving within the buffer zone, facilitating wafer transfer.
15. The tool of claim 13 , wherein the buffer zone comprises: an input buffer zone; and an output buffer zone adjacent to the input buffer zone.
In the reflow tool with the buffer zone, the buffer zone is separated into an input buffer zone and an output buffer zone, which are located adjacent to each other.
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January 16, 2014
November 7, 2017
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